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114 条记录 (耗时 0.021 秒)

    MICROSCOPE OBJECTIVE SYSTEM
    63.
    发明申请
    MICROSCOPE OBJECTIVE SYSTEM 有权
    MICROSCOPE目标系统

    公开(公告)号：US20070058262A1

    公开(公告)日：2007-03-15

    申请号：US11459146

    申请日：2006-07-21

    申请人： Ralf Wolleschensky ,  Hans-Jürgen Dobschal ,  Robert Brunner

    发明人： Ralf Wolleschensky ,  Hans-Jürgen Dobschal ,  Robert Brunner

    IPC分类号： G02B21/02

    CPC分类号： G02B21/33 ,  G02B21/02 ,  G02B21/082

    摘要： A microscope objective system is provided, comprising an objective (3), which comprises an illumination beam path via which illumination radiation from a source (2) is directed onto an object (7) to be examined, as well as a partial detection beam path surrounding at least part of the illumination beam path and, together with the illumination beam path, forms a detection beam path via which radiation to be detected and coming from the sample (7) is guided towards a detector (6).

    摘要翻译： 提供了一种显微镜物镜系统，其包括物镜（3），其包括照明光束路径，通过该照明光束路径来自源（2）的照射辐射被引导到要检查的物体（7）上，以及部分检测光束路径 围绕照明光束路径的至少一部分，并且与照明光束路径一起形成检测光束路径，通过该检测光束路径将待检测的来自样品（7）的辐射引导到检测器（6）。

    OPTICAL PHYSICAL INTERFACE MODULE
    64.
    发明申请
    OPTICAL PHYSICAL INTERFACE MODULE 审中-公开
    光学物理接口模块

    公开(公告)号：US20150346441A1

    公开(公告)日：2015-12-03

    申请号：US14308020

    申请日：2014-06-18

    申请人： Martin Julien ,  Robert Brunner

    发明人： Martin Julien ,  Robert Brunner

    IPC分类号： G02B6/42 ,  H04B10/80

    CPC分类号： G02B6/4231 ,  G02B6/3885 ,  G02B6/3897 ,  G02B6/4293 ,  G02B6/43 ,  H04B10/25 ,  H04B10/40 ,  H04B10/801 ,  H04B10/808

    摘要： An optical physical interface module is provided which includes a first optical physical interface, a second optical physical interface and one or more optical components. The first optical physical interface is configured to plug into a first connector and communicate optical signals toward the first connector. The second optical physical interface is configured to receive a second connector and communicate optical signals toward the second connector. The one or more optical components are operable to process optical signals between the first and second optical physical interfaces. The optical physical interface module may be provided at the edge of a circuit board so that the circuit board has an optical interface for external communication. The optical physical interface module may be a stand-alone module or integrated into a connector of an optical cable, among other configurations.

    摘要翻译： 提供了一种光学物理接口模块，其包括第一光学物理接口，第二光学物理接口和一个或多个光学部件。 第一光学物理接口被配置成插入第一连接器并将光信号传送到第一连接器。 第二光学物理接口被配置为接收第二连接器并且向第二连接器传送光信号。 一个或多个光学部件可操作以处理第一和第二光学物理接口之间的光信号。 光学物理接口模块可以设置在电路板的边缘处，使得电路板具有用于外部通信的光学接口。 光学物理接口模块可以是独立模块或集成到光缆的连接器中，以及其他配置。

    Fine-Grained Optical Shuffle Interconnect Topology Migration
    65.
    发明申请
    Fine-Grained Optical Shuffle Interconnect Topology Migration 有权
    细粒度光学随机互连拓扑迁移

    公开(公告)号：US20140314386A1

    公开(公告)日：2014-10-23

    申请号：US14195203

    申请日：2014-03-03

    申请人： Martin Julien ,  Robert Brunner

    发明人： Martin Julien ,  Robert Brunner

    IPC分类号： G02B6/44

    CPC分类号： G02B6/4446 ,  G02B6/4452 ,  H04Q1/025 ,  H04Q1/13 ,  H04Q11/0005

    摘要： An optical patch unit is adapted for mounting in or on an optical equipment rack and facilitates a migration from one optical shuffle box or topology to another. The optical patch unit simplifies the replacement of an optical shuffle box, in some cases allowing a phased migration that minimizes system down-time. The optical patch units described herein include passive optical patch panels. Chassis card and optical shuffle connections are terminated at the passive optical patch panel, making it possible to simplify the cabling between the chassis cards and the optical shuffle box. Once installed, chassis card cables do not need to be manipulated at all during subsequent optical shuffle maintenance procedures. Other optical patch units described herein include active optical patch units, which make the migration process less dependent on human intervention and can further reduce system down-time.

    摘要翻译： 光学贴片单元适于安装在光学设备机架中或其上，并且有助于从一个光学洗牌盒或拓扑迁移到另一个。 光学贴片单元简化了光学洗牌盒的更换，在某些情况下允许使系统停机时间最小化的分阶段迁移。 本文所述的光学贴片单元包括无源光学接线板。 在无源光接插板上，机箱卡和光学洗牌连接终止，使得可以简化机箱卡和光学洗牌盒之间的布线。 一旦安装，在随后的光学洗牌维护程序中，根本不需要操作机箱卡电缆。 本文所述的其它光学贴片单元包括主动光学贴片单元，其使得移动过程较少依赖于人类干预，并且可以进一步减少系统停机时间。

    AUDIO LISTENING SYSTEM
    66.
    发明申请
    AUDIO LISTENING SYSTEM 有权
    音响系统

    公开(公告)号：US20130343591A1

    公开(公告)日：2013-12-26

    申请号：US13517035

    申请日：2011-12-22

    申请人： Robert Brunner ,  Gregoire Vandenbussche ,  Chris Fruhauf

    发明人： Robert Brunner ,  Gregoire Vandenbussche ,  Chris Fruhauf

    IPC分类号： H04R1/10

    CPC分类号： H04R1/1091 ,  H04R1/1066 ,  H04R1/1075 ,  H04R5/0335

    摘要： A headphone assembly is provided and includes a headband assembly comprising at least one end; an ear-cup assembly pivotably engaged to the headband assembly by an engagement structure positioned proximate to the at least one end of the headband assembly, the ear-cup assembly comprising a cap and a housing, wherein the cap and the housing are connected to form an enclosed space inside the ear-cup assembly; a transducer configured to produce sound and positioned within the enclosed space of the ear-cup assembly; and a damper rim positioned between the ear-cup assembly and the at least one end of the headband assembly, the damper rim covering the engagement structure and being engaged to the ear-cup assembly and the at least one end of the headband assembly.

    摘要翻译： 耳机组件被提供并且包括头带组件，其包括至少一个端部; 耳杯组件，其可通过靠近头带组件的至少一个端部定位的接合结构枢转地接合到头带组件，所述耳杯组件包括帽和壳体，其中帽和壳体连接形成 耳杯组件内的封闭空间; 被配置为产生声音并定位在耳杯组件的封闭空间内的换能器; 以及位于耳杯组件和头带组件的至少一个端部之间的阻尼器边缘，阻尼器边缘覆盖接合结构并且接合到耳杯组件和头带组件的至少一个端部。

    Optical interconnects in cooling substrates
    69.
    发明授权
    Optical interconnects in cooling substrates 有权
    冷却衬底中的光学互连

    公开(公告)号：US08179676B2

    公开(公告)日：2012-05-15

    申请号：US12840766

    申请日：2010-07-21

    申请人： Martin Julien ,  Robert Brunner

    发明人： Martin Julien ,  Robert Brunner

    IPC分类号： H05K7/20 ,  G02B6/36

    CPC分类号： G02B6/43 ,  G02B6/4269 ,  H01L23/473 ,  H01L33/648 ,  H01L2924/0002 ,  H04B10/803 ,  H05K1/0203 ,  H05K1/0274 ,  H05K7/20636 ,  H05K2201/10121 ,  H01L2924/00

    摘要： Fluid-cooling technology developed for printed circuit boards (PCBs) and electronics assemblies is combined with optical-based interconnect technology, thereby enabling efficient fabrication of PCBs with free-space optical bearers. Since cooling components such as fans and heat sinks are no longer required on the PCB, the PCB is thinner and makes better use of a cooling substrate by also using it to carry optical signals. A card or a backplane supporting a plurality of active components can combine optical signals and cooling aspects in support of those components.

    摘要翻译： 为印刷电路板（PCB）和电子组件开发的流体冷却技术与光学互连技术结合在一起，从而能够高效地制造具有自由空间光学载体的PCB。 由于PCB上不再需要诸如风扇和散热器的冷却部件，所以PCB更薄，并且还通过使用它来承载光信号来更好地利用冷却基板。 支持多个有源部件的卡或背板可以组合支持这些部件的光信号和冷却方面。

    OPTICAL INTERCONNECTS IN COOLING SUBSTRATES
    70.
    发明申请
    OPTICAL INTERCONNECTS IN COOLING SUBSTRATES 有权
    冷却基板中的光学互连

    公开(公告)号：US20120020020A1

    公开(公告)日：2012-01-26

    申请号：US12840766

    申请日：2010-07-21

    申请人： Martin Julien ,  Robert Brunner

    发明人： Martin Julien ,  Robert Brunner

    IPC分类号： H05K7/20

    CPC分类号： G02B6/43 ,  G02B6/4269 ,  H01L23/473 ,  H01L33/648 ,  H01L2924/0002 ,  H04B10/803 ,  H05K1/0203 ,  H05K1/0274 ,  H05K7/20636 ,  H05K2201/10121 ,  H01L2924/00

    摘要： Fluid-cooling technology developed for printed circuit boards (PCBs) and electronics assemblies is combined with optical-based interconnect technology, thereby enabling efficient fabrication of PCBs with free-space optical bearers. Since cooling components such as fans and heat sinks are no longer required on the PCB, the PCB is thinner and makes better use of a cooling substrate by also using it to carry optical signals. A card or a backplane supporting a plurality of active components can combine optical signals and cooling aspects in support of those components.

    摘要翻译： 为印刷电路板（PCB）和电子组件开发的流体冷却技术与光学互连技术结合在一起，从而能够高效地制造具有自由空间光学载体的PCB。 由于PCB上不再需要诸如风扇和散热器的冷却部件，所以PCB更薄，并且还通过使用它来承载光信号来更好地利用冷却基板。 支持多个有源部件的卡或背板可以组合支持这些部件的光信号和冷却方面。