-
公开(公告)号：US20240356462A1
公开(公告)日：2024-10-24
申请号：US18756487
申请日：2024-06-27
发明人： Patrick Giagnocavo
CPC分类号： H02N2/04 , H05K1/189 , H10N35/00 , H05K2201/083 , H05K2201/10037 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151
摘要： Novel tools and techniques are provided for implementing flexible printed circuit board (“PCB”)-based mobile sensor platform. In various embodiments, a flexible PCB-based mobile sensor platform includes a body portion(s) and at least one of a microcontroller, a locomotion system, sensors, a transceiver(s), and/or the like, each disposed on the body portion(s). The locomotion system includes one or more flexible PCB portions and corresponding actuators. Based on instructions from the microcontroller, at least one actuator may cause bending and unbending of a corresponding flexible PCB portion(s) that causes the flexible PCB-based mobile sensor platform to move toward a target location within a first environment. Upon arrival, the sensors may collect sensor data regarding at least one of the target location, an object located at the target location, or a portion of the object, and the microcontroller may send the collected sensor data to an external device via the transceiver.
-
公开(公告)号：US12124092B2
公开(公告)日：2024-10-22
申请号：US18045177
申请日：2022-10-10
申请人： MD Elektronik GmbH
发明人： Helmut Pritz , Thomas Halbig
CPC分类号： G02B6/3897 , H01R12/7023 , H05K1/18 , H05K2201/09063 , H05K2201/09072 , H05K2201/10121 , H05K2201/10189
摘要： A connector for a circuit board includes a connector housing having a mounting arm. The mounting arm has a first fastening element that is releasably connectable to a first connecting element on the circuit board. The connection between the first fastening element and the first connecting element can be established and/or released by deflecting the mounting arm. A securing unit is disposed on the connector housing in such a way that the securing unit is movable between a releasing position and a locking position. In the locking position, the securing unit blocks deflection of the mounting arm. In the releasing position, the securing unit enables deflection of the mounting arm.
-
公开(公告)号：US12119371B2
公开(公告)日：2024-10-15
申请号：US17754825
申请日：2020-10-22
发明人： Hiizu Ohtorii , Hiroshi Morita , Yusuke Oyama , Eiji Otani , Ken Kikuchi
CPC分类号： H01L27/156 , H01L33/58 , H01L33/64 , H05K1/028 , H05K1/0281 , H05K1/189 , H05K2201/10121 , H05K2201/10151
摘要： The present technology relates to a light source apparatus that makes it possible to provide a widely applicable light source apparatus. A light source apparatus includes a transmissive board that transmits light emitted by a light-emitting element, a circuit board that drives the light-emitting element and is joined to the transmissive board, and a light-emitting board that has the light-emitting element and is connected to the circuit board via a first bump. Further, in the light source apparatus, the circuit board and an organic board are configured to be connected by sandwiching the light-emitting board via second bumps. The present technology can be applied to a light source apparatus that emits light.
-
公开(公告)号：US12089330B2
公开(公告)日：2024-09-10
申请号：US17809373
申请日：2022-06-28
申请人： IBIDEN CO., LTD.
发明人： Masatoshi Kunieda
CPC分类号： H05K1/112 , H05K1/0274 , G02B6/10 , H05K2201/10121 , H05K2201/10242
摘要： A wiring substrate includes an insulating layer, a conductor layer formed on surface of the insulating layer and including a conductor pad, a covering layer covering a portion of the insulating layer, an optical waveguide positioned on the surface of the insulating layer and including core part, and a conductor post including plating metal and formed on the conductor pad such that the post is penetrating through the covering layer and connected to a component. The insulating layer has component region covered by the component when the component is connected, the core part has side surface extending in direction along the surface of the insulating layer, the side surface has an exposed portion exposed in the component region and facing the opposite direction with respect to the insulating layer, and distance between the exposed portion and the surface of the insulating layer is greater than thickness of the covering layer.
-
公开(公告)号：US12085753B2
公开(公告)日：2024-09-10
申请号：US17481798
申请日：2021-09-22
发明人： Long Zheng , Sigeng Yang
CPC分类号： G02B6/13 , H05K1/181 , H05K1/182 , H05K2201/10121 , H05K2201/10287
摘要： An optical module includes a circuit board and a silicon optical chip. The circuit board includes a plurality of circuit board bonding pads. The silicon optical chip includes a plurality of chip bonding pads corresponding to the plurality of circuit board bonding pads. The plurality of chip bonding pads are electrically connected to the corresponding circuit board bonding pads, so that the silicon optical chip is electrically connected to the circuit board. A chip bonding pad is electrically connected to at least one corresponding circuit board bonding pad through a plurality of bonding wires, or a circuit board bonding pad is electrically connected to at least one corresponding chip bonding pad through a plurality of bonding wires. A connecting line of two or more of bonding positions of the plurality of bonding wires on the circuit board bonding pads is inclined with respect to a connecting line of centers of the circuit board bonding pads.
-
公开(公告)号：US12082349B2
公开(公告)日：2024-09-03
申请号：US17800289
申请日：2022-04-29
发明人： Xiaoyong Dong
CPC分类号： H05K3/301 , H05K1/0219 , H05K1/05 , H05K1/11 , H05K3/103 , H05K2201/0355 , H05K2201/10121 , H05K2201/10386
摘要： An electronic device includes a circuit board and a camera assembly. The circuit board has a mounting hole extending through the circuit board in a thickness direction, and the mounting hole includes a first end and a second end oppositely arranged along the thickness direction of the circuit board. The camera assembly includes a first part arranged in the mounting hole and a second part extending out from the first end of the mounting hole, and the first part includes a camera substrate assembly. A support member is arranged on the circuit board and at the mounting hole and the first part is arranged on the support member. The support member includes at least one conductive sheet. The at least one conductive sheet is further coupled to a metal wiring of the circuit board, and the at least one conductive sheet is insulated from the camera substrate assembly.
-
公开(公告)号：US12080977B2
公开(公告)日：2024-09-03
申请号：US17701837
申请日：2022-03-23
发明人： Cheng Zhi Mo , Qi Chen , Hao Wang , Fengfeng Yang
IPC分类号： H01R13/66 , G02B6/42 , H01R13/50 , H01R13/6581 , H01R43/18
CPC分类号： H01R13/6691 , G02B6/425 , H01R13/50 , H01R13/6581 , H01R43/18 , G02B6/423 , G02B6/4246 , G02B6/4249 , G02B6/428 , H01R13/665 , H01R13/6658 , H05K2201/10121
摘要： The present disclosure describes a signal transmission device based on molded interconnect device and laser direct structuring (MID/LDS) technology, comprising: a shielding shell (1); and a photoelectric conversion module (2), which includes a carrier (21), an electrical module (22) and an optical module (23). The photoelectric conversion module (2) is fixed inside the shielding shell (1), wherein the first recessed structure (201) accommodates a driving chip (211), a photoelectric conversion chip (212) and an optical module (23), and the second recessed structure (202) accommodates an electrical module (22), the driving chip (211), the photoelectric conversion chip (212) and the conductive terminal (215) are electrically connected to each other, and the carrier (21) is designed by integral molding based on the MID/LDS technology. In t present disclosure, the design space in the shielding shell can be effectively saved.
-
公开(公告)号：US12078847B2
公开(公告)日：2024-09-03
申请号：US17576298
申请日：2022-01-14
CPC分类号： G02B6/3825 , G02B6/3897 , G02B6/4246 , G02B6/428 , G02B6/4292 , G02B6/43 , H05K1/141 , H05K1/181 , G02B6/3895 , H05K2201/10121 , H05K2201/10189 , H05K2201/10446
摘要： The present disclosure is directed to a board mounted active component assembly that includes a printed circuit board to which a connector is mounted and electrically connected. In one aspect, the connector includes a housing defining an adapter port for receiving an optical plug. The connector also includes a fiber optic transceiver module secured within the housing such that the transceiver module is optically aligned with an optical plug received in the adapter port. The fiber optic transceiver module includes a transmitter optical sub-assembly (TOSA) and a receiver optical sub-assembly (ROSA) with leads connected to a circuit on the printed circuit board.
-
公开(公告)号：US20240260242A1
公开(公告)日：2024-08-01
申请号：US18233353
申请日：2023-08-14
发明人： CHIN-TING CHEN
CPC分类号： H05K9/0022 , H05K1/0274 , H05K2201/10121
摘要： An anti-magnetic interference component includes a circuit board, a plurality of electronic components disposed on the circuit board, a flexible board, and at least one first electromagnetic shielding film. The flexible board includes a covering portion and two connecting portions. The covering portion can be bend relative to each of the two connecting portions, the two connecting portions is connected to the circuit board, the covering portion can cover and space apart from the circuit board when the covering portion is bend relative to the two connecting portions, causing the covering portion and the circuit board to cooperatively form an accommodation space for receiving the electronic components. The first electromagnetic shielding film is disposed on the covering portion and the two connecting portions, the first electromagnetic shielding film can face the plurality of electronic components when the covering portion covers the circuit board.
-
公开(公告)号：US20240260186A1
公开(公告)日：2024-08-01
申请号：US18561274
申请日：2022-05-17
发明人： Thomas KIPPES , Joerg Erich SORG
CPC分类号： H05K1/111 , H05K3/0061 , H05K3/341 , H05K2201/10121 , H05K2203/1173
摘要： The invention relates to an optoelectronic assembly with an optoelectronic component with two or more connecting contacts for feeding supply and/or control signals. A housing with a two-dimensional structured underside has two or more solder pads which are each surrounded by a non-wettable region, wherein the solder pads are guided through the underside of the housing and are connected to the plurality of connecting contacts. Furthermore, the underside of the housing comprises two or more solder surfaces which are each surrounded by a non-wettable region. The two or more solder pads and the solder surfaces are thereby substantially uniformly distributed over the underside of the housing.
-
-
-
-
-
-
-
-
-
搜索结果
1600 条记录 (耗时 0.027 秒)
