公开(公告)号：US09841341B2

公开(公告)日：2017-12-12

申请号：US14861648

申请日：2015-09-22

Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS, INC.

Inventor： Fulvio Vittorio Fontana ,  Jefferson Talledo

IPC: H01L21/50 ,  H01L23/498 ,  G01L19/14 ,  B81B7/00 ,  B81C1/00 ,  H01L23/057 ,  H01L23/495

CPC classification number: G01L19/148 ,  B81B7/0045 ,  B81C1/00325 ,  H01L21/50 ,  H01L23/057 ,  H01L23/49575 ,  H01L23/49861 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: A surface mounting device has one body of semiconductor material such as an ASIC, and a package surrounding the body. The package has a base region carrying the body, a cap and contact terminals. The base region has a Young's modulus lower than 5 MPa. For forming the device, the body is attached to a supporting frame including contact terminals and a die pad, separated by cavities; bonding wires are soldered to the body and to the contact terminals; an elastic material is molded so as to surround at least in part lateral sides of the body, fill the cavities of the supporting frame and cover the ends of the bonding wires on the contact terminals; and a cap is fixed to the base region. The die pad is then etched away.

公开(公告)号：US09536756B1

公开(公告)日：2017-01-03

申请号：US14754143

申请日：2015-06-29

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Amor Zapanta

IPC: H01L21/00 ,  H01L21/56 ,  H01L21/48 ,  H01L21/78

CPC classification number: H01L21/566 ,  H01L21/4825 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3107 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00012

Abstract: One or more embodiments are directed to semiconductor packages that are assembled using a sacrificial material, that when removed, separates the assembled packages into individual packages. The sacrificial material may be removed by a blanket technique such that a mask, pattern, or alignment step is not needed. In one embodiment the sacrificial material is formed on the lead frame on a connecting bar of a lead frame between adjacent leads. After the molding step, the connecting bar is etched away exposing a surface of the sacrificial material. The sacrificial material is removed, thereby separating the assembled packages into individual packages.

Abstract translation: 一个或多个实施例涉及使用牺牲材料组装的半导体封装，当被移除时，将组装的封装分离成单个封装。 可以通过覆盖技术去除牺牲材料，使得不需要掩模，图案或对准步骤。 在一个实施例中，牺牲材料形成在引线框架上的相邻引线之间的引线框架的连接杆上。 在模制步骤之后，连接杆被蚀刻掉，暴露牺牲材料的表面。 去除牺牲材料，从而将组装的包装分离成单独的包装。

公开(公告)号：US20160379846A1

公开(公告)日：2016-12-29

申请号：US14754143

申请日：2015-06-29

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Amor Zapanta

IPC: H01L21/56 ,  H01L21/78 ,  H01L21/48

CPC classification number: H01L21/566 ,  H01L21/4825 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3107 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00012

Abstract: One or more embodiments are directed to semiconductor packages that are assembled using a sacrificial material, that when removed, separates the assembled packages into individual packages. The sacrificial material may be removed by a blanket technique such that a mask, pattern, or alignment step is not needed. In one embodiment the sacrificial material is formed on the lead frame on a connecting bar of a lead frame between adjacent leads. After the molding step, the connecting bar is etched away exposing a surface of the sacrificial material. The sacrificial material is removed, thereby separating the assembled packages into individual packages.

Abstract translation: 一个或多个实施例涉及使用牺牲材料组装的半导体封装，当被移除时，将组装的封装分离成单个封装。 可以通过覆盖技术去除牺牲材料，使得不需要掩模，图案或对准步骤。 在一个实施例中，牺牲材料形成在引线框架上的相邻引线之间的引线框架的连接杆上。 在模制步骤之后，连接杆被蚀刻掉，暴露牺牲材料的表面。 去除牺牲材料，从而将组装的包装分离成单独的包装。