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61.
公开(公告)号:US06306517B1
公开(公告)日:2001-10-23
申请号:US09632354
申请日:2000-08-03
申请人: Dennis Michael Gray , Yuk-Chiu Lau , Curtis Alan Johnson , Marcus Preston Borom , Warren Arthur Nelson
发明人: Dennis Michael Gray , Yuk-Chiu Lau , Curtis Alan Johnson , Marcus Preston Borom , Warren Arthur Nelson
IPC分类号: B32B900
摘要: An article having a spallation resistant TBC comprises a metal substrate, such as a high temperature superalloy, and a TBC, such as a coating of yttria stabilized zirconia. The TBC comprises a plurality of plasma-sprayed layers. The TBC has a coherent, continuous columnar grain microstructure, wherein at least one layer has a plurality of continuous columnar grains which have been extended by directional solidification into an adjacent layer.
摘要翻译: 具有抗剥落TBC的制品包括金属基底,例如高温超合金,以及TBC,例如氧化钇稳定的氧化锆的涂层。 TBC包括多个等离子体喷涂层。 TBC具有连续的连续的柱状晶粒微观结构,其中至少一层具有多个通过定向凝固延伸到相邻层中的连续柱状晶粒。
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62.
公开(公告)号:US6165628A
公开(公告)日:2000-12-26
申请号:US385544
申请日:1999-08-30
CPC分类号: C23C28/3215 , C23C4/02 , C23C28/325 , C23C28/345 , C23C28/3455 , Y02T50/67 , Y10S428/937 , Y10T428/12458 , Y10T428/12479 , Y10T428/12618 , Y10T428/12861 , Y10T428/12931
摘要: An article is described, which includes a metal-based substrate, such as a superalloy; a dense, primary bond layer; and a spongy secondary bond layer. A thermal barrier coating is applied over the secondary bond layer. The spongy layer has a microstructure which includes an open network of interconnected pores. A process is also described. It includes the step of applying a spongy, metallic bond layer over the substrate, followed by the application of a thermal barrier coating. A dense, primary bond layer may optionally be applied before the application of the spongy layer.
摘要翻译: 描述了一种制品,其包括金属基底,例如超级合金; 致密的主键层; 和海绵状二次键合层。 在二次接合层上施加热障涂层。 海绵层具有包括互连孔的开放网络的微结构。 还描述了一个过程。 它包括在衬底上施加海绵状金属粘合层,然后施加热障涂层的步骤。 在施加海绵层之前,可以任选地施加致密的主键层。
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