公开(公告)号：US11801664B2

公开(公告)日：2023-10-31

申请号：US17728396

申请日：2022-04-25

Applicant: POSCO CO., LTD

Inventor： Seong-Woo Kim ,  Jin-Keun Oh ,  Yeol-Rae Cho

IPC: B32B15/01 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/28 ,  C22C38/32 ,  C23C2/12 ,  C23C2/28 ,  B21D22/02 ,  C22C38/00 ,  C21D9/46 ,  C22F1/00 ,  C22F1/04 ,  C21D6/00 ,  C23C2/40 ,  C23F17/00 ,  B21D35/00 ,  C23C26/00 ,  C23C28/02 ,  C23C30/00 ,  C23C28/00 ,  B32B15/18 ,  C23C2/04 ,  B32B15/04 ,  C23C2/26 ,  C23C2/06 ,  C22C30/00 ,  C22C38/14 ,  C22C38/48 ,  C22C38/40 ,  C22C38/18 ,  C22C38/42 ,  C22C38/44 ,  C22C38/08 ,  C22C38/16 ,  C22C38/24 ,  C22C21/00 ,  C22C38/38 ,  C22C38/46 ,  C22C38/20 ,  C22C38/26 ,  C22C38/22 ,  C22C38/58 ,  C22C38/12 ,  C22C38/50 ,  C22C38/54 ,  B21D37/16 ,  B32B5/20 ,  B32B5/18

CPC classification number: B32B15/012 ,  B21D22/02 ,  B21D22/022 ,  B21D35/00 ,  B21D35/005 ,  B21D37/16 ,  B32B5/18 ,  B32B5/20 ,  B32B15/01 ,  B32B15/011 ,  B32B15/013 ,  B32B15/04 ,  B32B15/043 ,  B32B15/18 ,  C21D6/005 ,  C21D6/008 ,  C21D9/46 ,  C22C21/00 ,  C22C30/00 ,  C22C38/001 ,  C22C38/002 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/08 ,  C22C38/12 ,  C22C38/14 ,  C22C38/16 ,  C22C38/18 ,  C22C38/20 ,  C22C38/22 ,  C22C38/24 ,  C22C38/26 ,  C22C38/28 ,  C22C38/32 ,  C22C38/38 ,  C22C38/40 ,  C22C38/42 ,  C22C38/44 ,  C22C38/46 ,  C22C38/48 ,  C22C38/50 ,  C22C38/54 ,  C22C38/58 ,  C22F1/002 ,  C22F1/04 ,  C23C2/04 ,  C23C2/06 ,  C23C2/12 ,  C23C2/26 ,  C23C2/28 ,  C23C2/40 ,  C23C26/00 ,  C23C28/023 ,  C23C28/321 ,  C23C28/322 ,  C23C30/00 ,  C23C30/005 ,  C23F17/00 ,  Y10T428/12479 ,  Y10T428/12757 ,  Y10T428/12799 ,  Y10T428/12951 ,  Y10T428/12958 ,  Y10T428/12972 ,  Y10T428/12979 ,  Y10T428/12993

Abstract: Provided is a steel sheet for a hot press formed member having excellent resistance to hydrogen delayed fracture, and a method for manufacturing the same. A steel sheet for a hot press formed member comprises: a base steel sheet; an aluminum alloy plating layer on a surface of the base steel sheet; and an oxide layer which is formed on a surface of the plating layer and has a thickness of 0.05 μm or more.

公开(公告)号：US11759821B1

公开(公告)日：2023-09-19

申请号：US16898482

申请日：2020-06-11

Applicant: Waymo LLC

Inventor： John Simpson

IPC: B33Y80/00 ,  B05D7/24 ,  B05D3/04 ,  B33Y40/20

CPC classification number: B05D7/24 ,  B05D3/04 ,  B33Y40/20 ,  B33Y80/00 ,  Y10T428/12479

Abstract: Porous solid members are provided that include, disposed on at least a portion of the internal surfaces of a plurality of channels thereof, a plurality of superhydrophobic particles. These particles inhibit ingress of water or other aqueous fluids into the internal spaces of the porous solid member, reducing the occurrence of corrosion, biological growth, or other unwanted effects of fluids present in the internal spaces. The porous solid member could be fabricated using 3D printing methods, e.g., the member could be a 3D printed aluminum or other metal(s). The plurality of superhydrophobic particles can be disposed on the internal surfaces of the channels within the porous solid member via a number of processes, e.g., by delivering the particles into the channels while disposed in a payload fluid that later evaporates.

公开(公告)号：US09950369B2

公开(公告)日：2018-04-24

申请号：US15421787

申请日：2017-02-01

Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA ,  FINE SINTER CO., LTD ,  Sanyo Special Steel Co., Ltd.

Inventor： Nobuyuki Shinohara ,  Kimihiko Ando ,  Yoshihisa Ueda ,  Yusaku Yoshida ,  Masaru Sugimoto ,  Toshiyuki Sawada ,  Shingo Fukumoto

IPC: B22F7/00 ,  B22F3/16 ,  C22C38/38 ,  C22C27/04 ,  C22C38/04 ,  C22C38/02 ,  C22C38/22 ,  B32B15/18 ,  B32B15/01 ,  C22C27/06 ,  C22C1/05 ,  C22C1/04 ,  C22C29/02 ,  C22C38/00 ,  C22C1/10 ,  C22C45/10 ,  C22C45/02 ,  C22C30/00 ,  C22C38/12 ,  C22C38/44

CPC classification number: B22F7/008 ,  B22F3/16 ,  B22F5/106 ,  B22F2301/35 ,  B22F2302/40 ,  B22F2304/10 ,  B22F2998/10 ,  B22F2999/00 ,  B32B15/01 ,  B32B15/18 ,  C22C1/04 ,  C22C1/05 ,  C22C1/051 ,  C22C1/053 ,  C22C1/055 ,  C22C1/10 ,  C22C27/04 ,  C22C27/06 ,  C22C29/02 ,  C22C30/00 ,  C22C33/0285 ,  C22C38/00 ,  C22C38/02 ,  C22C38/04 ,  C22C38/12 ,  C22C38/22 ,  C22C38/38 ,  C22C38/44 ,  C22C45/02 ,  C22C45/10 ,  Y10T428/12028 ,  Y10T428/12042 ,  Y10T428/12056 ,  Y10T428/1209 ,  Y10T428/12125 ,  Y10T428/12132 ,  Y10T428/12139 ,  Y10T428/12146 ,  Y10T428/12153 ,  Y10T428/12229 ,  Y10T428/12479 ,  Y10T428/12951 ,  Y10T428/12958 ,  Y10T428/12972 ,  Y10T428/12979 ,  C22C1/058 ,  C22C1/045 ,  B22F1/0003 ,  B22F3/02 ,  B22F3/1039

Abstract: Mixed powder that contains first hard particles, second hard particles, graphite particles, and iron particles is used to manufacture a sintered alloy. The first hard particle is a Fe—Mo—Cr—Mn based alloy particle, the second hard particle is a Fe—Mo—Si based alloy particle. The mixed powder contains 5 to 50 mass % of the first hard particles, 1 to 8 mass % of the second hard particles, and 0.5 to 1.0 mass % of the graphite particles when total mass of the first hard particles, the second hard particles, the graphite particles, and the iron particles is set as 100 mass %.

公开(公告)号：US09905327B2

公开(公告)日：2018-02-27

申请号：US14983484

申请日：2015-12-29

Applicant: Industrial Technology Research Institute

Inventor： Yuan-Ling Tsai ,  Ying-Jung Chiang ,  Jiun-Jang Yu

IPC: H01B3/30 ,  B32B15/01 ,  B32B3/26 ,  B32B7/04 ,  B32B3/30 ,  B32B15/04 ,  B32B15/092 ,  B32B15/16 ,  B32B15/20 ,  H01B1/22 ,  H01B1/20

CPC classification number: H01B3/30 ,  B32B3/26 ,  B32B3/263 ,  B32B3/30 ,  B32B7/04 ,  B32B15/01 ,  B32B15/04 ,  B32B15/043 ,  B32B15/092 ,  B32B15/16 ,  B32B15/20 ,  H01B1/20 ,  H01B1/22 ,  Y10T428/12389 ,  Y10T428/12396 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/12479 ,  Y10T428/12486 ,  Y10T428/12493 ,  Y10T428/12535 ,  Y10T428/12569 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/12993

Abstract: A metal conducting structure includes a first metal conducting layer, a second metal conducting layer, and a third metal conducting layer. The first metal conducting layer consists of a first polymer material and first metal particles. The first metal conducting layer is covered by the second metal conducting layer which is a structure with pores, the structure consists of second metal particles. The second metal conducting layer is covered by the third metal conducting layer. The pores of the second metal conducting layer are filled with a metal material of the third metal conducting layer.

公开(公告)号：US20170307040A1

公开(公告)日：2017-10-26

申请号：US14156242

申请日：2014-01-15

Applicant: HRL Laboratories, LLC

Inventor： Tobias A. Schaedler ,  Alan J. Jacobsen ,  William Carter ,  Christopher P. Henry ,  Chia-Ming -"Gavin" Chang ,  Geoffrey P. McKnight ,  Andrew P. Nowak

IPC: F16F7/00

CPC classification number: F16F7/00 ,  B05D1/00 ,  B32B3/10 ,  B32B3/12 ,  B32B7/04 ,  B32B9/005 ,  B32B9/041 ,  B32B9/045 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  B32B27/06 ,  B32B27/08 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2307/102 ,  B32B2307/20 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/308 ,  B32B2307/50 ,  B32B2307/51 ,  B32B2307/536 ,  B32B2307/54 ,  B32B2307/542 ,  B32B2307/56 ,  B32B2307/704 ,  B32B2307/706 ,  B32B2307/714 ,  B32B2307/72 ,  B32B2307/732 ,  B32B2605/08 ,  B32B2605/12 ,  B32B2605/16 ,  B32B2605/18 ,  B33Y80/00 ,  B81B3/0035 ,  B81B3/0067 ,  B81B3/007 ,  B81C1/00126 ,  C04B30/02 ,  C04B2111/40 ,  C04B2111/52 ,  C23C16/00 ,  C23C18/1657 ,  C23C26/00 ,  C25D1/08 ,  Y10T428/1234 ,  Y10T428/12361 ,  Y10T428/12375 ,  Y10T428/12479 ,  Y10T428/24149 ,  Y10T428/24273 ,  Y10T428/24661 ,  Y10T428/249953 ,  Y10T428/26 ,  C04B35/00 ,  C04B38/04

Abstract: Described is a micro-lattice damping material and a method for repeatable energy absorption. The micro-lattice damping material is a cellular material formed of a three-dimensional interconnected network of hollow tubes. This material is operable to provide high damping, specifically acoustic, vibration or shock damping, by utilizing the energy absorption mechanism of hollow tube buckling, which is rendered repeatable by the micro-lattice architecture.

公开(公告)号：US09586382B2

公开(公告)日：2017-03-07

申请号：US13354176

申请日：2012-01-19

Applicant: Wei-Hsing Tuan ,  Shao-Kuan Lee

Inventor： Wei-Hsing Tuan ,  Shao-Kuan Lee

IPC: B32B15/20 ,  H01L23/373 ,  H05K3/38 ,  B32B18/00 ,  C04B37/02 ,  H05K1/03 ,  H05K3/18

CPC classification number: B32B15/20 ,  B32B18/00 ,  B32B2311/00 ,  B32B2315/02 ,  B32B2457/00 ,  C04B37/026 ,  C04B2235/6584 ,  C04B2235/9607 ,  C04B2237/062 ,  C04B2237/12 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/125 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/54 ,  C04B2237/56 ,  C04B2237/58 ,  C04B2237/597 ,  C04B2237/60 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  H01L23/3735 ,  H01L2224/48091 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/181 ,  H05K3/388 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2203/072 ,  Y10T428/12479 ,  Y10T428/249984 ,  H01L2924/00014

Abstract: A ceramic/metal composite structure includes an aluminum oxide substrate, an interface bonding layer and a copper sheet. The interface bonding layer is disposed on the aluminum oxide substrate. The copper sheet is disposed on the interface bonding layer. The interface bonding layer bonds the aluminum oxide substrate to the copper sheet. Some pores are formed near or in the interface bonding layer. A porosity of the interface bonding layer is substantially smaller than or equal to 25%.

Abstract translation: 陶瓷/金属复合结构包括氧化铝衬底，界面粘合层和铜片。 界面接合层设置在氧化铝基板上。 铜片设置在界面结合层上。 界面结合层将氧化铝基板与铜片结合。 在界面结合层附近或之中形成一些孔。 界面结合层的孔隙率基本上小于或等于25％。

公开(公告)号：US09546432B2

公开(公告)日：2017-01-17

申请号：US14817742

申请日：2015-08-04

Applicant: LAM RESEARCH CORPORATION

Inventor： Hong Shih ,  Lin Xu ,  John Michael Kerns ,  William Charles ,  John Daugherty ,  Sivakami Ramanathan ,  Russell Ormond ,  Robert G. O'Neill ,  Tom Stevenson

IPC: C25D11/04 ,  C25D11/02 ,  H01L21/3065 ,  H01L21/02 ,  C25D11/16 ,  C25D11/12 ,  C23C28/00 ,  C23C24/00 ,  H01L21/67 ,  C23C16/44 ,  H01L21/78

CPC classification number: C25D11/026 ,  C23C16/4404 ,  C23C24/00 ,  C23C28/322 ,  C23C28/345 ,  C25D11/04 ,  C25D11/12 ,  C25D11/16 ,  H01L21/02274 ,  H01L21/3065 ,  H01L21/67017 ,  H01L21/67069 ,  H01L21/78 ,  Y10T428/12479 ,  Y10T428/12549 ,  Y10T428/1259

Abstract: A method of forming a dense oxide coating on an aluminum component of semiconductor processing equipment comprises cold spraying a layer of pure aluminum on a surface of the aluminum component to a predetermined thickness. A dense oxide coating is then formed on the layer of pure aluminum using a plasma electrolytic oxidation process, wherein the plasma electrolytic oxidation process causes the layer of pure aluminum to undergo microplasmic discharges, thus forming the dense oxide coating on the layer of pure aluminum on the surface of the aluminum component.

Abstract translation: 在半导体加工设备的铝部件上形成致密氧化物涂层的方法包括在铝部件的表面上冷却一层纯铝至预定厚度。 然后使用等离子体电解氧化工艺在纯铝层上形成致密的氧化物涂层，其中等离子体电解氧化工艺使纯铝层发生微量放电，从而在纯铝层上形成致密的氧化物涂层 铝部件的表面。

公开(公告)号：US09486879B2

公开(公告)日：2016-11-08

申请号：US13988387

申请日：2011-05-13

Applicant: Satoru Kurita ,  Keiichi Endoh ,  Yu Saito ,  Yutaka Hisaeda ,  Toshihiko Ueyama

Inventor： Satoru Kurita ,  Keiichi Endoh ,  Yu Saito ,  Yutaka Hisaeda ,  Toshihiko Ueyama

IPC: B23K35/00 ,  B32B15/00 ,  B23K31/02 ,  B23K1/00 ,  B23K20/00 ,  H01L23/00 ,  B22F1/00 ,  B23K35/02 ,  B32B3/26 ,  B32B15/01

CPC classification number: B23K31/02 ,  B22F1/0014 ,  B22F1/0062 ,  B22F1/0096 ,  B22F2999/00 ,  B23K1/0016 ,  B23K20/00 ,  B23K35/025 ,  B23K2101/36 ,  B32B3/26 ,  B32B15/018 ,  G10L2019/0002 ,  G10L2019/0011 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27505 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/83075 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83439 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/83907 ,  H01L2224/83986 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/203 ,  Y10T428/12479 ,  H01L2224/832 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665 ,  B22F1/0018 ,  H01L2924/0002

Abstract: There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a practical use even if not a heat treatment is applied thereto at a high temperature, which is the bonding material containing silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1 nm or more and 200 nm or less, and silver particles having an average particle size of 0.5 μm or more and 10 μm or less, and an organic material having two or more carboxyl groups.

Abstract translation: 提供了能够在诸如氮气氛的惰性气体气氛下形成接合体的接合材料，并且即使在高温下不施加热处理也能够表现出耐用实用的接合强度， 是含有碳原子数为8以下，平均一次粒径为1nm以上且200nm以下的脂肪酸的银纳米颗粒的结合材料，平均粒径为0.5μm的银粒子或 多于10μm或更小，以及具有两个或更多个羧基的有机材料。

公开(公告)号：US09371575B2

公开(公告)日：2016-06-21

申请号：US13634303

申请日：2011-03-11

Applicant: Laurent Prevond ,  Nicolas Collard ,  Renaud Caplain ,  Pierre Francois

Inventor： Laurent Prevond ,  Nicolas Collard ,  Renaud Caplain ,  Pierre Francois

IPC: B32B5/18 ,  C23C8/80 ,  B21D47/04 ,  B22F7/04 ,  B32B3/26 ,  B32B3/28 ,  B32B15/01 ,  B32B15/20 ,  C22F1/00 ,  C22F1/04 ,  F28F21/08 ,  B23K31/02 ,  B32B15/04 ,  B22F7/00 ,  C22C47/20

CPC classification number: C23C8/80 ,  B21D47/04 ,  B22F7/004 ,  B22F7/04 ,  B22F2999/00 ,  B23K31/02 ,  B32B3/266 ,  B32B3/28 ,  B32B5/18 ,  B32B15/012 ,  B32B15/016 ,  B32B15/017 ,  B32B15/04 ,  B32B15/20 ,  B32B2457/18 ,  C22C47/20 ,  C22F1/00 ,  C22F1/04 ,  F28F21/084 ,  F28F2275/06 ,  Y10T428/12479 ,  B22F3/18

Abstract: The invention relates to a method for manufacturing an aluminum/metal assembly consisting of a metal layer made of a first metal on the surface of a metal object made of a second metal, the first or second metal being aluminum, wherein said method includes the following steps: placing a metal foam having an open porosity on a surface of the metal object, and applying mechanical stress to the metal foam in such a manner that said foam becomes embedded in the surface of the object.

Abstract translation: 本发明涉及一种铝/金属组件的制造方法，所述铝/金属组件由金属物质制成的金属层构成，所述金属层由金属物体由第二金属制成的表面上，所述第一或第二金属为铝，其中所述方法包括以下 步骤：在金属物体的表面上放置具有开放孔隙率的金属泡沫，并以使所述泡沫体嵌入物体表面的方式对金属泡沫施加机械应力。

公开(公告)号：US20160138164A1

公开(公告)日：2016-05-19

申请号：US15003533

申请日：2016-01-21

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC TOYAMA CO., LTD.

Inventor： Kazuki Okuno ,  Masahiro Kato ,  Tomoyuki Awazu ,  Masatoshi Majima ,  Kengo Tsukamoto ,  Hitoshi Tsuchida ,  Hidetoshi Saito

IPC: C23C16/56

CPC classification number: C23C16/56 ,  B22F3/1137 ,  B22F3/1146 ,  B22F2998/10 ,  C22C1/08 ,  C22C19/05 ,  C23C18/1657 ,  C25D1/08 ,  C25D5/12 ,  C25D5/14 ,  C25D5/50 ,  H01B1/02 ,  H01B13/0036 ,  H01G11/68 ,  H01G11/70 ,  H01M4/661 ,  H01M4/667 ,  H01M4/80 ,  H01M4/8605 ,  H01M4/8803 ,  Y02E60/13 ,  Y10T428/12479

Abstract: Provided is a porous metal body containing at least nickel, tin, and chromium. An example of a method of producing such a porous metal body is a method including a conductive-coating-layer formation step of forming a conductive coating layer containing chromium on a surface of a porous base formed of a resin material; a metal-layer formation step of forming a nickel layer and a tin layer in any order on a surface of the conductive coating layer; a removal step of removing the porous base; and a diffusion step of, by a heat treatment, causing interdiffusion of metal atoms between the nickel layer and the tin layer and diffusing chromium contained in the conductive coating layer into the nickel layer and the tin layer.

Abstract translation: 提供至少含有镍，锡和铬的多孔金属体。 制造这种多孔金属体的方法的一个例子是包括在由树脂材料形成的多孔基底的表面上形成含有铬的导电涂层的导电涂层形成步骤的方法; 金属层形成步骤，在导电涂层的表面上以任何顺序形成镍层和锡层; 去除多孔基底的去除步骤; 以及扩散步骤，通过热处理，引起镍层和锡层之间的金属原子的相互扩散，并将包含在导电涂层中的铬扩散到镍层和锡层中。