公开(公告)号：US20110015171A1

公开(公告)日：2011-01-20

申请号：US12765420

申请日：2010-04-22

Applicant: Haiyan BIAN ,  Kristen Chevalier ,  Jose Clemente ,  Pete Connolly ,  Chris Flores ,  Shu-Chen Lin ,  Li Liu ,  John Mabus ,  Mark Macielag ,  Mark McDonnell ,  Philip Pitis ,  Yue-Mei Zhang ,  Sui-Po Zhang ,  Bin Zhu

Inventor： Haiyan BIAN ,  Kristen Chevalier ,  Jose Clemente ,  Pete Connolly ,  Chris Flores ,  Shu-Chen Lin ,  Li Liu ,  John Mabus ,  Mark Macielag ,  Mark McDonnell ,  Philip Pitis ,  Yue-Mei Zhang ,  Sui-Po Zhang ,  Bin Zhu

IPC: A61K31/397 ,  C07D401/14 ,  C07D403/04 ,  C07D417/14 ,  C07D409/14 ,  A61P29/00 ,  A61P25/06 ,  A61P19/00 ,  A61P17/00

CPC classification number: C07D403/10 ,  C07D205/04 ,  C07D401/10 ,  C07D401/12 ,  C07D401/14 ,  C07D403/04 ,  C07D403/06 ,  C07D403/12 ,  C07D403/14 ,  C07D405/12 ,  C07D409/06 ,  C07D409/12 ,  C07D409/14 ,  C07D417/06 ,  C07D417/12 ,  C07D417/14 ,  C07D471/04 ,  C07D491/048 ,  C07D495/04

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula (I) as follows: wherein Y, Z, R1, and s are defined herein.

Abstract translation: 公开了用于治疗各种疾病，综合征，病症和障碍（包括疼痛）的化合物，组合物和方法。 这样的化合物由式（I）表示如下：其中Y，Z，R 1和S在本文中定义。

公开(公告)号：US20110015170A1

公开(公告)日：2011-01-20

申请号：US12765254

申请日：2010-04-22

Applicant: Haiyan BIAN ,  Kristen Chevalier ,  Jose Clemente ,  Pete Connolly ,  Chris Flores ,  Shu-Chen Lin ,  Li Liu ,  John Mabus ,  Mark Macielag ,  Mark McDonnell ,  Philip Pitis ,  Yue-Mei Zhang ,  Sui-Po Zhang ,  Bin Zhu

Inventor： Haiyan BIAN ,  Kristen Chevalier ,  Jose Clemente ,  Pete Connolly ,  Chris Flores ,  Shu-Chen Lin ,  Li Liu ,  John Mabus ,  Mark Macielag ,  Mark McDonnell ,  Philip Pitis ,  Yue-Mei Zhang ,  Sui-Po Zhang ,  Bin Zhu

IPC: A61K31/397 ,  C07D403/04 ,  C07D417/14 ,  C07D403/14 ,  A61P29/00 ,  A61P25/06 ,  A61P19/02 ,  A61P1/00

CPC classification number: C07D403/10 ,  C07D205/04 ,  C07D401/10 ,  C07D401/12 ,  C07D401/14 ,  C07D403/04 ,  C07D403/06 ,  C07D403/12 ,  C07D403/14 ,  C07D405/12 ,  C07D409/06 ,  C07D409/12 ,  C07D409/14 ,  C07D417/06 ,  C07D417/12 ,  C07D417/14 ,  C07D471/04 ,  C07D491/048 ,  C07D495/04

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula (I) as follows: wherein Y, Z, R1, and s are defined herein.

公开(公告)号：US20100324014A1

公开(公告)日：2010-12-23

申请号：US12765103

申请日：2010-04-22

Applicant: Haiyan BIAN ,  Kristen Chevalier ,  Jose Clemente ,  Pete Connolly ,  Chris Flores ,  Shu-Chen Lin ,  Li Liu ,  John Mabus ,  Mark Macielag ,  Mark McDonnell ,  Philip Pitis ,  Yue-Mei Zhang ,  Sui-Po Zhang ,  Bin Zhu

Inventor： Haiyan BIAN ,  Kristen Chevalier ,  Jose Clemente ,  Pete Connolly ,  Chris Flores ,  Shu-Chen Lin ,  Li Liu ,  John Mabus ,  Mark Macielag ,  Mark McDonnell ,  Philip Pitis ,  Yue-Mei Zhang ,  Sui-Po Zhang ,  Bin Zhu

IPC: A61K31/496 ,  C07D403/04 ,  C07D417/14 ,  A61K31/541 ,  A61P29/00

CPC classification number: C07D403/10 ,  C07D205/04 ,  C07D401/10 ,  C07D401/12 ,  C07D401/14 ,  C07D403/04 ,  C07D403/06 ,  C07D403/12 ,  C07D403/14 ,  C07D405/12 ,  C07D409/06 ,  C07D409/12 ,  C07D409/14 ,  C07D417/06 ,  C07D417/12 ,  C07D417/14 ,  C07D471/04 ,  C07D491/048 ,  C07D495/04

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula (I) as follows: wherein Y, Z, R1, and s are defined herein.

公开(公告)号：US20100324011A1

公开(公告)日：2010-12-23

申请号：US12765018

申请日：2010-04-22

Applicant: Haiyan Bian ,  Kristen Chevalier ,  Jose Clemente ,  Pete Connolly ,  Chris Flores ,  Shu-Chen Lin ,  Li Liu ,  John Mabus ,  Mark Macielag ,  Mark McDonnell ,  Philip Pitis ,  Yue-Mei Zhang ,  Sui-Po Zhang ,  Bin Zhu

Inventor： Haiyan Bian ,  Kristen Chevalier ,  Jose Clemente ,  Pete Connolly ,  Chris Flores ,  Shu-Chen Lin ,  Li Liu ,  John Mabus ,  Mark Macielag ,  Mark McDonnell ,  Philip Pitis ,  Yue-Mei Zhang ,  Sui-Po Zhang ,  Bin Zhu

IPC: A61K31/496 ,  C07D403/04 ,  C07D417/14 ,  C07D409/14 ,  C07D401/14 ,  C07D403/14 ,  A61P29/00

CPC classification number: C07D403/10 ,  C07D205/04 ,  C07D401/10 ,  C07D401/12 ,  C07D401/14 ,  C07D403/04 ,  C07D403/06 ,  C07D403/12 ,  C07D403/14 ,  C07D405/12 ,  C07D409/06 ,  C07D409/12 ,  C07D409/14 ,  C07D417/06 ,  C07D417/12 ,  C07D417/14 ,  C07D471/04 ,  C07D491/048 ,  C07D495/04

Abstract: Disclosed are compounds, compositions and methods for treating various diseases, syndromes, conditions and disorders, including pain. Such compounds are represented by Formula (I) as follows: wherein Y, Z, R1, and s are defined herein.

公开(公告)号：US20100317414A1

公开(公告)日：2010-12-16

申请号：US12797073

申请日：2010-06-09

Applicant: JUNG-PIN CHEN ,  SHU-CHEN LIN ,  SHAN-YAO CHEN

Inventor： JUNG-PIN CHEN ,  SHU-CHEN LIN ,  SHAN-YAO CHEN

IPC: H04W88/02

CPC classification number: H04M1/0252 ,  G06F1/1626 ,  G06F1/1656 ,  H04M1/0283

Abstract: A housing assembly includes a first housing having first positioning holes, a second housing having second positioning holes, and an assembly unit connected between the first and second housings and including two assembly parts. Multiple engaging devices each include a first engaging member and a second engaging member. The engaging devices are connected to the first and second positioning holes by first and second resilient members. An operation device is connected to the engaging devices and includes first and second release members which are respectively connected to the assembly parts. A link is connected to the assembly unit and connected with the first and second release members. An operation member is connected to the link to move the first or second release members of each engaging device and disengage the first and second release members from the first or second positioning holes of the first or second housings.

Abstract translation: 壳体组件包括具有第一定位孔的第一壳体，具有第二定位孔的第二壳体以及连接在第一壳体和第二壳体之间并包括两个组件部分的组件单元。 多个接合装置各自包括第一接合构件和第二接合构件。 接合装置通过第一和第二弹性构件连接到第一和第二定位孔。 操作装置连接到接合装置，并且包括分别连接到组装部件的第一和第二释放构件。 连接件连接到组件单元并与第一和第二释放构件连接。 操作构件连接到连杆以移动每个接合装置的第一或第二释放构件，并使第一和第二释放构件从第一或第二壳体的第一或第二定位孔脱离。

公开(公告)号：USD606527S1

公开(公告)日：2009-12-22

申请号：US29332360

申请日：2009-02-13

Applicant: Jung-pin Chen ,  Shu-chen Lin ,  Shan-yao Chen

Designer： Jung-pin Chen ,  Shu-chen Lin ,  Shan-yao Chen

公开(公告)号：USD606061S1

公开(公告)日：2009-12-15

申请号：US29332366

申请日：2009-02-13

Applicant: Jung-pin Chen ,  Shu-chen Lin ,  Shan-yao Chen

Designer： Jung-pin Chen ,  Shu-chen Lin ,  Shan-yao Chen