公开(公告)号：US09766410B1

公开(公告)日：2017-09-19

申请号：US14795961

申请日：2015-07-10

Applicant: Acacia Communications, Inc.

Inventor： Long Chen

IPC: G02B6/30 ,  G02B6/26 ,  G02B6/34 ,  G02B6/35 ,  G02B6/12 ,  G02B6/28 ,  G02B6/42 ,  G02B6/124

CPC classification number: G02B6/3596 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/124 ,  G02B6/2852 ,  G02B6/30 ,  G02B6/34 ,  G02B6/42 ,  G02B2006/12159

Abstract: Techniques for forming a photonic integrated circuit having a facet coupler and a surface coupler are described. The photonic integrated circuit may be on a wafer, which may be diced to form an integrated device. The facet coupler may be positioned proximate to an edge of the integrated device, and the surface coupler may be positioned on a surface of the integrated device. The surface coupler may allow for evaluation and assessment of the circuit's performance, which may facilitate wafer-level testing of the circuit and diagnosis of the circuit before and after packaging.

公开(公告)号：US09703038B1

公开(公告)日：2017-07-11

申请号：US14796678

申请日：2015-07-10

Applicant: Acacia Communications, Inc.

Inventor： Long Chen

IPC: G02B6/122 ,  G02B6/24 ,  G02B6/14 ,  G02B6/12

CPC classification number: G02B6/1228 ,  G02B6/14 ,  G02B6/24 ,  G02B2006/12097

Abstract: Techniques for forming a facet optical coupler to couple light at an edge of silicon substrate are described. The facet optical coupler includes a silicon substrate, a layer of second material disposed on the silicon substrate and in direct contact with the edge of the silicon substrate, and an undercut region disposed between a portion of the silicon substrate and the layer of second material. The undercut region is offset from the edge to provide mechanical integrity of the facet optical coupler to improve production of photonic integrated circuits having the facet optical coupler from a wafer.

公开(公告)号：US20170031113A1

公开(公告)日：2017-02-02

申请号：US15295241

申请日：2016-10-17

Applicant: Acacia Communications, Inc.

Inventor： Long Chen ,  Christopher Doerr ,  Diedrik Vermeulen

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/34 ,  G02B6/28 ,  G02B6/30 ,  G02B6/122

CPC classification number: G02B6/4225 ,  G02B6/12004 ,  G02B6/122 ,  G02B6/1228 ,  G02B6/2852 ,  G02B6/30 ,  G02B6/34 ,  G02B6/4227 ,  G02B2006/12109 ,  G02B2006/12126

Abstract: A photonic integrated circuit (PIC) may be optically aligned to a plurality of optical components (e.g., an optical fiber array). Optical alignment may be facilitated by the use of an optical impedance element coupled between a first input/output (I/O) optical waveguide and a second I/O optical waveguide of the PIC. The optical impedance element me be configured to be transmissive during optical alignment and to be non-transmissive during the regular operation of the PIC.

Abstract translation: 光子集成电路（PIC）可以与多个光学部件（例如，光纤阵列）光学对准。 可以通过使用耦合在PIC的第一输入/输出（I / O）光波导和第二I / O光波导之间的光阻抗元件来促进光学对准。 光阻抗元件被配置为在光学对准期间是透射的，并且在PIC的常规操作期间是不透射的。

公开(公告)号：US09494748B2

公开(公告)日：2016-11-15

申请号：US14991816

申请日：2016-01-08

Applicant: Acacia Communications, Inc.

Inventor： Long Chen ,  Christopher Doerr ,  Diedrik Vermeulen

IPC: G02B6/12 ,  G02B6/42 ,  G02B6/30 ,  G02B6/28 ,  G02B6/122 ,  G02B6/34

CPC classification number: G02B6/4225 ,  G02B6/12004 ,  G02B6/122 ,  G02B6/1228 ,  G02B6/2852 ,  G02B6/30 ,  G02B6/34 ,  G02B6/4227 ,  G02B2006/12109 ,  G02B2006/12126

Abstract: A photonic integrated circuit (PIC) may be optically aligned to a plurality of optical components (e.g., an optical fiber array). Optical alignment may be facilitated by the use of an optical impedance element coupled between a first input/output (I/O) optical waveguide and a second I/O optical waveguide of the PIC. The optical impedance element me be configured to be transmissive during optical alignment and to be non-transmissive during the regular operation of the PIC.

Abstract translation: 光子集成电路（PIC）可以与多个光学部件（例如，光纤阵列）光学对准。 可以通过使用耦合在PIC的第一输入/输出（I / O）光波导和第二I / O光波导之间的光阻抗元件来促进光学对准。 光阻抗元件被配置为在光学对准期间是透射的，并且在PIC的常规操作期间是不透射的。