摘要:
A filter of the present invention is a filter including a substrate and a filter element mounted on the substrate, wherein the substrate is provided with a plurality of wiring layers including a filter element wiring layer which is formed with wirings and connected with the filter element, an insulating layer interposed between the plural wiring layers and a ground pattern formed in at least a part of a wiring layer under the filter element wiring layer; and the thickness of the insulating layer interposed between the filter element wiring layer and the other wiring layer is smaller than the width of the wiring formed in the filter element wiring layer, and is larger than the thickness of the other wiring layer. By such a configuration, a thin, high-suppression and high-isolation filter can be realized.
摘要:
A filter of the present invention is a filter including a substrate and a filter element mounted on the substrate, wherein the substrate is provided with a plurality of wiring layers including a filter element wiring layer which is formed with wirings and connected with the filter element, an insulating layer interposed between the plural wiring layers and a ground pattern formed in at least a part of a wiring layer under the filter element wiring layer; and the thickness of the insulating layer interposed between the filter element wiring layer and the other wiring layer is smaller than the width of the wiring formed in the filter element wiring layer, and is larger than the thickness of the other wiring layer. By such a configuration, a thin, high-suppression and high-isolation filter can be realized.
摘要:
A substrate for mounting a filter has a connection line layer having a transmission line for connecting a filter, a ground layer placed below the connection line layer and having a ground, and an insulation layer placed between the transmission line and the ground layer and having a thickness which satisfies a characteristic impedance of the transmission line in a range 0.1 to 50 ohms, the characteristic impedance determined by the thickness and a dielectric constant of the insulation layer and a width of the transmission line.
摘要:
A communication module includes a filter element, a package substrate on which the filter element is mounted, and a module substrate on which the package substrate is mounted. Each of the package substrate and the module substrate is formed of a laminate of a plurality of metal layers and a plurality of insulation layers. An outermost insulation layer forming a mounting surface of the package substrate that is a surface on which the filter element is mounted has a thickness smaller than a thickness of at least one of the other insulation layers included in the package substrate. An outer insulation layer forming a mounting surface of the module substrate that is a surface on which the package substrate is mounted has a thickness smaller than a thickness of at least one of the other insulation layers included in the module substrate.
摘要:
A duplexer includes a substrate including an insulation layer, an upper interconnection layer provided on an upper surface of the insulation layer, a lower interconnection layer provided on a lower surface of the insulation layer, and an inner interconnection layer provided in the insulation layer, the inner interconnection layer including an inner ground pad, at least one acoustic wave filter chip mounted on an upper surface of the substrate, signal pads provided on the upper interconnection layer and connected to signal electrodes of the at least one acoustic wave filter chip, and an upper ground pad that is provided in the upper interconnection layer so as to be located between the signal pads and is connected to a ground electrode of the at least one acoustic wave filter, wherein D1>D2 and D1>T1 where D1 is a minimum distance between the signal pads and the upper ground pad, D2 is a minimum distance between the signal pads and the inner ground pad, and T1 is a thickness of the insulation layer between the upper interconnection layer and the inner interconnection layer.
摘要:
The multimode surface acoustic wave filter includes two surface acoustic wave resonators closely arranged on a piezoelectric substrate in a direction perpendicular to the propagation direction of surface acoustic waves and acoustically coupled by a coupling section, each of the surface acoustic wave resonators including an interdigital transducer and two reflectors disposed closely on both sides of the interdigital transducer in a direction parallel to the propagation direction of the surface acoustic waves, the interdigital transducer having an excitation section for exciting the surface acoustic waves and a signal terminal section for inputting an electric signal, each of the reflectors having a grating section and a terminal section, wherein the velocity of surface acoustic waves propagating through the coupling section is a little larger than the velocity of the surface acoustic waves propagating through the excitation section of the interdigital transducer.
摘要:
A filter circuit includes a filter part connected between an input terminal and an output terminal and configured to have a passband, and a path connected in parallel with the filter part between the input terminal and the output terminal, the path having an impedance that enables a first signal passing through the path from the input terminal to the output terminal and a second signal passing through the filter part from the input terminal to the output terminal to have an opposite phase relationship in a frequency band outside of the passband and have almost equal amplitudes in the frequency band.
摘要:
A substrate for mounting a filter has a connection line layer having a transmission line for connecting a filter, a ground layer placed below the connection line layer and having a ground, and an insulation layer placed between the transmission line and the ground layer and having a thickness which satisfies a characteristic impedance of the transmission line in a range 0.1 to 50 ohms, the characteristic impedance determined by the thickness and a dielectric constant of the insulation layer and a width of the transmission line.