利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

162 条记录 (耗时 0.031 秒)

    Acoustic wave device
    5.
    发明授权
    Acoustic wave device 有权
    声波装置

    公开(公告)号：US09160301B2

    公开(公告)日：2015-10-13

    申请号：US13616265

    申请日：2012-09-14

    申请人： Motoyuki Tajima ,  Tooru Takezaki ,  Hitoshi Tsukidate

    发明人： Motoyuki Tajima ,  Tooru Takezaki ,  Hitoshi Tsukidate

    IPC分类号： H03H9/70 ,  H03H9/72 ,  H03H9/05 ,  H03H9/10

    CPC分类号： H03H9/0571 ,  H03H9/0576 ,  H03H9/1014 ,  H03H9/1042 ,  H03H9/1071 ,  H03H9/1085

    摘要： An acoustic wave device includes: a multilayer structure that has plural surfaces which principal surfaces of plural layers provide; a chip including an acoustic wave filter and mounted on a first surface; a resin unit sealing the chip; a wiring pattern that is formed on a second surface and electrically connected to at least one of resonators; a ground pattern that is formed on the second surface along a part of the wiring pattern, and is away from the wiring pattern; and an external terminal that is formed on a third surface and electrically connected to the wiring pattern and the ground pattern, the third surface being disposed on an opposite side of the first surface with respect to the second surface; wherein a part of the wiring pattern that comes closest to the ground pattern is substantially formed in parallel with the ground pattern.

    摘要翻译： 声波装置包括：多层结构，其具有多层提供的主表面的多个表面; 包括声波滤波器并安装在第一表面上的芯片; 密封芯片的树脂单元; 形成在第二表面上并与至少一个谐振器电连接的布线图案; 沿着所述布线图形的一部分形成在所述第二表面上并且远离所述布线图案的接地图案; 以及外部端子，其形成在第三表面上并且电连接到所述布线图案和所述接地图案，所述第三表面相对于所述第二表面设置在所述第一表面的相对侧上; 其中最靠近接地图案的布线图案的一部分基本上与接地图形平行地形成。

    SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND MOBILE PHONE
    6.
    发明申请
    SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND MOBILE PHONE 有权
    半导体器件，其制造方法和移动电话

    公开(公告)号：US20140018126A1

    公开(公告)日：2014-01-16

    申请号：US14008240

    申请日：2012-03-08

    申请人： Kengo Asai ,  Atsushi Isobe

    发明人： Kengo Asai ,  Atsushi Isobe

    IPC分类号： H01L41/332 ,  H04B1/40 ,  H01L41/09

    CPC分类号： H03H9/0542 ,  H01L23/3192 ,  H01L23/36 ,  H01L23/373 ,  H01L27/0629 ,  H01L29/4175 ,  H01L29/41758 ,  H01L29/66659 ,  H01L29/7835 ,  H01L41/0926 ,  H01L41/332 ,  H01L2924/0002 ,  H03F3/19 ,  H03F3/211 ,  H03F2200/171 ,  H03F2200/294 ,  H03F2200/451 ,  H03H9/0571 ,  H03H9/706 ,  H04B1/036 ,  H04B1/40 ,  H01L2924/00

    摘要： A technique capable of maintaining the filter characteristics of a transmitting filter and a receiving filter by reducing the influences of heat from the power amplifier given to the transmitting filter and the receiving filter as small as possible in the case where the transmitting filter and the receiving filter are formed on the same semiconductor substrate together with the power amplifier in a mobile communication equipment typified by a mobile phone is provided. A high heat conductivity film HCF is provided on a passivation film PAS over the entire area of a semiconductor substrate 1S including an area AR1 on which an LDMOSFET is formed and an area AR2 on which a thin-film piezoelectric bulk wave resonator BAW is formed. The heat mainly generated in the LDMOSFET is efficiently dissipated in all directions by the high heat conductivity film HCF formed on the surface of the semiconductor substrate 1S.

    摘要翻译： 在发送滤波器和接收滤波器的情况下，能够通过减小给发送滤波器和接收滤波器的功率放大器的热量的影响来保持发射滤波器和接收滤波器的滤波器特性的技术。 与移动电话代表的移动通信设备中的功率放大器一起形成在同一半导体衬底上。 在包括形成有LDMOSFET的区域AR1的半导体基板1S的整个区域上的钝化膜PAS上设置有高导热性膜HCF和形成有薄膜压电体波谐振器BAW的区域AR2。 主要在LDMOSFET中产生的热量通过形成在半导体衬底1S的表面上的高导热膜HCF在所有方向上被有效地消散。

    ACOUSTIC WAVE DEVICE
    7.
    发明申请
    ACOUSTIC WAVE DEVICE 有权
    声波设备

    公开(公告)号：US20130106530A1

    公开(公告)日：2013-05-02

    申请号：US13616265

    申请日：2012-09-14

    申请人： Motoyuki TAJIMA ,  Tooru TAKEZAKI ,  Hitoshi TSUKIDATE

    发明人： Motoyuki TAJIMA ,  Tooru TAKEZAKI ,  Hitoshi TSUKIDATE

    IPC分类号： H03H9/70 ,  H03H9/72

    CPC分类号： H03H9/0571 ,  H03H9/0576 ,  H03H9/1014 ,  H03H9/1042 ,  H03H9/1071 ,  H03H9/1085

    摘要： An acoustic wave device includes: a multilayer structure that has plural surfaces which principal surfaces of plural layers provide; a chip including an acoustic wave filter and mounted on a first surface; a resin unit sealing the chip; a wiring pattern that is formed on a second surface and electrically connected to at least one of resonators; a ground pattern that is formed on the second surface along a part of the wiring pattern, and is away from the wiring pattern; and an external terminal that is formed on a third surface and electrically connected to the wiring pattern and the ground pattern, the third surface being disposed on an opposite side of the first surface with respect to the second surface; wherein a part of the wiring pattern that comes closest to the ground pattern is substantially formed in parallel with the ground pattern.

    摘要翻译： 声波装置包括：多层结构，其具有多层提供的主表面的多个表面; 包括声波滤波器并安装在第一表面上的芯片; 密封芯片的树脂单元; 形成在第二表面上并与至少一个谐振器电连接的布线图案; 沿着所述布线图形的一部分形成在所述第二表面上并且远离所述布线图案的接地图案; 以及外部端子，其形成在第三表面上并且电连接到所述布线图案和所述接地图案，所述第三表面相对于所述第二表面设置在所述第一表面的相对侧上; 其中最靠近接地图案的布线图案的一部分基本上与接地图形平行地形成。

    Elastic-wave filter device
    8.
    发明授权
    Elastic-wave filter device 有权
    弹性波滤波装置

    公开(公告)号：US08283997B2

    公开(公告)日：2012-10-09

    申请号：US13079882

    申请日：2011-04-05

    申请人： Shigeyuki Fujita

    发明人： Shigeyuki Fujita

    IPC分类号： H03H9/72 ,  H03H9/64

    CPC分类号： H03H9/0571 ,  H03H9/0085 ,  H03H9/0576

    摘要： An elastic-wave filter device includes a package substrate and filter mounting pattern provided on a first main surface of the package substrate on which a longitudinally coupled resonator-type elastic-wave filter is mounted, a back-side terminal pattern is provided on a second main surface thereof, and an internal electrode pattern is provided inside the package substrate. When seen in plan view from a direction perpendicular or substantially perpendicular to the first main surface of the substrate body, first via conductors electrically connecting a ground pattern element of the filter mounting pattern connected to a ground pad of the longitudinally coupled resonator-type elastic-wave filter and an internal ground pattern element of the internal electrode pattern are arranged asymmetrically with respect to a center line X-X passing through an input pattern element of the filter mounting pattern and through two output pattern elements.

    摘要翻译： 弹性波滤波器装置包括：封装基板和滤波器安装图案，设置在其上安装有纵向耦合的谐振器型弹性波滤波器的封装基板的第一主表面上，第二侧设置有背面端子图案 主表面，内部电极图案设置在封装基板的内部。 当从垂直于或基本垂直于基板主体的第一主表面的方向的平面图中观察时，第一通孔导体将连接到纵向耦合的谐振器型弹性连接器的接地焊盘的滤波器安装图案的接地图形元件电连接， 内部电极图案的内部接地图形元件相对于穿过滤色器安装图案的输入图案元件的中心线XX并且通过两个输出图案元件非对称布置。

    DUPLEXER AND ELECTRONIC DEVICE HAVING THE SAME
    9.
    发明申请
    DUPLEXER AND ELECTRONIC DEVICE HAVING THE SAME 有权
    具有相同功能的双工器和电子器件

    公开(公告)号：US20120112854A1

    公开(公告)日：2012-05-10

    申请号：US13277866

    申请日：2011-10-20

    申请人： Masafumi IWAKI ,  Motoaki HARA ,  Tokihiro NISHIHARA

    发明人： Masafumi IWAKI ,  Motoaki HARA ,  Tokihiro NISHIHARA

    IPC分类号： H03H9/70

    CPC分类号： H03H9/0571 ,  H03H9/0576 ,  H03H9/706 ,  H03H9/725

    摘要： In one aspect of the invention, a duplexer including a multilayer substrate with multiple stacked layers and a back surface with a rectangular shape is disclosed. An antenna terminal, a transmission terminal, a reception terminal, a ground terminal, and a conductor are provided in various positions on the multilayer substrate for improved performance.

    摘要翻译： 在本发明的一个方面，公开了一种包括具有多层叠层的多层基板和具有矩形形状的背面的双工器。 在多层基板上的各个位置设置天线端子，发送端子，接收端子，接地端子和导体，以提高性能。

    Duplexer, substrate for duplexer, and electronic apparatus
    10.
    发明授权
    Duplexer, substrate for duplexer, and electronic apparatus 有权
    双工器，双工器基板和电子设备

    公开(公告)号：US08174339B2

    公开(公告)日：2012-05-08

    申请号：US12564648

    申请日：2009-09-22

    申请人： Takashi Matsuda ,  Kazunori Inoue ,  Shogo Inoue

    发明人： Takashi Matsuda ,  Kazunori Inoue ,  Shogo Inoue

    IPC分类号： H01P5/12 ,  H04B1/50 ,  H03H9/70

    CPC分类号： H03H9/706 ,  H03H9/0571 ,  H03H9/0576 ,  H03H9/725

    摘要： A duplexer includes a transmit filter connected between a common terminal and a transmission terminal, a receive filter connected between the common terminal and a reception terminal, a capacitor connected in parallel with one of the transmit filter and the receive filter and provided between two terminals of the common terminal, the transmission terminal, and the reception terminal, and a package. The package includes an insulating layer, foot pads that include the common terminal, the transmission terminal and the reception terminal and are formed on one surface of the insulating layer, and interconnections formed on another surface opposite to the one surface of the insulating layer. The capacitor is composed of two capacitor forming units that are connected in parallel with each other and are formed with at least one foot pad of the foot pads and two of the interconnections that overlap with two opposing sides of the at least one food pad respectively.

    摘要翻译： 双工器包括连接在公共端子和发送端子之间的发送滤波器，连接在公共端子和接收端子之间的接收滤波器，与发射滤波器和接收滤波器之一并联连接的电容器， 公共终端，发送终端和接收终端，以及包。 封装包括绝缘层，包括公共端子，发送端子和接收端子并且形成在绝缘层的一个表面上的脚垫以及形成在与绝缘层的一个表面相对的另一表面上的互连。 电容器由两个电容器形成单元组成，两个电容器形成单元彼此并联连接并且形成有足垫的至少一个脚垫和分别与至少一个食物垫的两个相对侧重叠的两个互连。