公开(公告)号：US20060018097A1

公开(公告)日：2006-01-26

申请号：US11168068

申请日：2005-06-28

申请人： Hsieh-Kun Lee ,  Wan-Lin Xia ,  Bao-Chun Chen ,  Neng-Bin Li

发明人： Hsieh-Kun Lee ,  Wan-Lin Xia ,  Bao-Chun Chen ,  Neng-Bin Li

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation assembly includes a heat sink, a retention module and a clip for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating device. The retention module includes a bottom wall and a first sidewall defining a slot therein and extending from the bottom wall. The clip includes a connecting portion pivotably connected to the retention module. The heat sink rests on the bottom wall of the retention module with an end thereof fitting in the slot, and an opposite end thereof being pressed by the clip. The clip can be in a released position that the clip is pivotable, so that the heat sink is removable from the retention module, and a locked position that the clip presses the heat sink. Thus, the heat sink can be secured to the heat generating device expediently.

摘要翻译： 散热组件包括散热器，保持模块和用于将散热器固定到保持模块的夹子。 散热器包括用于与发热装置接触的基座。 保持模块包括底壁和在其中限定槽并从底壁延伸的第一侧壁。 夹具包括可枢转地连接到保持模块的连接部分。 散热片搁置在保持模块的底壁上，其一端装配在槽中，其相对端由夹子按压。 夹子可以处于释放位置，夹子可枢转，使得散热器可从保持模块移除，以及夹子按压散热器的锁定位置。 因此，散热器可以方便地固定到发热装置。

公开(公告)号：US07310229B2

公开(公告)日：2007-12-18

申请号：US11065387

申请日：2005-02-24

申请人： Hsieh-Kun Lee ,  Wan-Lin Xia ,  Bao-Chun Chen

发明人： Hsieh-Kun Lee ,  Wan-Lin Xia ,  Bao-Chun Chen

IPC分类号： H05K7/20 ,  H01L23/40

CPC分类号： H01L23/4093 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipating device of the present invention includes a heat sink (20) and two locking devices (10) for securing the heat sink. The heat sink includes a base (22) for contacting an electronic component. Each locking device includes a spring member, a post (12) and a sleeve (18). The spring member elastically rests on the base. The post extends through the sleeve. The post has one end engaging with the spring member, and an opposite end thereof extending beyond the sleeve for locking the combination. The sleeve has one end tightly grasping the post, and an opposite end thereof preventing the locking device from departing from the heat sink.

摘要翻译： 本发明的散热装置包括散热器（20）和用于固定散热器的两个锁定装置（10）。 散热器包括用于接触电子部件的基座（22）。 每个锁定装置包括弹簧构件，柱（12）和套筒（18）。 弹簧构件弹性地靠在基座上。 柱穿过套筒。 该柱具有与弹簧构件接合的一端，并且其一端延伸超过套筒以锁定组合。 套筒的一端紧紧地抓住柱子，其另一端阻止锁定装置离开散热器。

公开(公告)号：US07286363B2

公开(公告)日：2007-10-23

申请号：US11168068

申请日：2005-06-28

申请人： Hsieh-Kun Lee ,  Wan-Lin Xia ,  Bao-Chun Chen ,  Neng-Bin Li

发明人： Hsieh-Kun Lee ,  Wan-Lin Xia ,  Bao-Chun Chen ,  Neng-Bin Li

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation assembly includes a heat sink, a retention module and a clip for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating device. The retention module includes a bottom wall and a first sidewall defining a slot therein and extending from the bottom wall. The clip includes a connecting portion pivotably connected to the retention module. The heat sink rests on the bottom wall of the retention module with an end thereof fitting in the slot, and an opposite end thereof being pressed by the clip. The clip can be in a released position that the clip is pivotable, so that the heat sink is removable from the retention module, and a locked position that the clip presses the heat sink. Thus, the heat sink can be secured to the heat generating device expediently.

摘要翻译： 散热组件包括散热器，保持模块和用于将散热器固定到保持模块的夹子。 散热器包括用于与发热装置接触的基座。 保持模块包括底壁和在其中限定槽并从底壁延伸的第一侧壁。 夹具包括可枢转地连接到保持模块的连接部分。 散热片搁置在保持模块的底壁上，其一端装配在槽中，其相对端由夹子按压。 夹子可以处于释放位置，夹子可枢转，使得散热器可从保持模块移除，以及夹子按压散热器的锁定位置。 因此，散热器可以方便地固定到发热装置。

公开(公告)号：US07142422B2

公开(公告)日：2006-11-28

申请号：US10900953

申请日：2004-07-27

申请人： Hsieh Kun Lee ,  Wan-Lin Xia ,  He-Ben Liu

发明人： Hsieh Kun Lee ,  Wan-Lin Xia ,  He-Ben Liu

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a mounting plate (21) for mounting the heat dissipation device to a circuit board (3) on which a CPU (4) and a plurality of capacitors (31) are mounted, a heat sink (20), a core (25), and a fan (1) mounted on the heat sink. The heat sink locates above the mounting plate and includes a hollow cylinder (202) and a plurality of curved fins (204) extending outwardly from the cylinder. The core includes a base (26) for contacting the CPU and a post (27) extending from the base through the mounting plate to be received in the cylinder. The mounting plate is spaced from the circuit board to allow the capacitors to locate between the mounting plate and the circuit board. The mounting plate defines a plurality of openings (23) for providing access for cooled air from the fan to the CPU and the capacitors.

摘要翻译： 散热装置包括：安装板（21），用于将散热装置安装到安装有CPU（4）和多个电容器（31）的电路板（3）上，散热片（20）， （25）和安装在散热器上的风扇（1）。 散热器位于安装板的上方，并且包括中空圆柱体（202）和从气缸向外延伸的多个弯曲翅片（204）。 芯部包括用于接触CPU的基座（26）和从底座延伸穿过安装板的柱（27），以被接收在气缸中。 安装板与电路板间隔开，以使电容器位于安装板和电路板之间。 安装板限定多个开口（23），用于提供从风扇到CPU和电容器的冷却空气的通路。

公开(公告)号：US20060126305A1

公开(公告)日：2006-06-15

申请号：US11209214

申请日：2005-08-23

申请人： Wan-Lin Xia ,  Bo-Yong Yang ,  Min-Qi Xiao

发明人： Wan-Lin Xia ,  Bo-Yong Yang ,  Min-Qi Xiao

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  F28D15/0275 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for dissipating heat from an electronic device includes a base for contacting the electronic device. A U-shaped heat pipe is fixed to the base and includes an evaporating portion contacting the base and two condensing portion extending from opposite ends of the evaporating portion and through a plurality of first fins stacked together parallel to each other. A plurality of second fins extends from the base towards the first fins and supports the first fins. A reinforcement is fixed on the base and joins with some of the first fins, thereby enhancing integrity of the first fins.

摘要翻译： 用于从电子设备散热的散热器包括用于接触电子设备的基座。 U形热管固定在底座上，包括一个与底座接触的蒸发部分和从蒸发部分两端延伸的两个冷凝部分，并通过彼此平行堆叠的多个第一散热片。 多个第二散热片从基座朝向第一散热片延伸并且支撑第一散热片。 加强件固定在基座上并与一些第一翅片连接，从而增强第一翅片的完整性。

公开(公告)号：US20050036289A1

公开(公告)日：2005-02-17

申请号：US10900953

申请日：2004-07-27

申请人： Hsieh Lee ,  Wan-Lin Xia ,  He-Ben Liu

发明人： Hsieh Lee ,  Wan-Lin Xia ,  He-Ben Liu

IPC分类号： G06F1/20 ,  H01L23/40 ,  H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a mounting plate (21) for mounting the heat dissipation device to a circuit board (3) on which a CPU (4) and a plurality of capacitors (31) are mounted, a heat sink (20), a core (25), and a fan (1) mounted on the heat sink. The heat sink locates above the mounting plate and includes a hollow cylinder (202) and a plurality of curved fins (204) extending outwardly from the cylinder. The core includes a base (26) for contacting the CPU and a post (27) extending from the base through the mounting plate to be received in the cylinder. The mounting plate is spaced from the circuit board to allow the capacitors to locate between the mounting plate and the circuit board. The mounting plate defines a plurality of openings (23) for providing access for cooled air from the fan to the CPU and the capacitors.

摘要翻译： 散热装置包括：安装板（21），用于将散热装置安装到安装有CPU（4）和多个电容器（31）的电路板（3）上，散热片（20）， （25）和安装在散热器上的风扇（1）。 散热器位于安装板的上方，并且包括中空圆柱体（202）和从气缸向外延伸的多个弯曲翅片（204）。 芯部包括用于接触CPU的基座（26）和从底座延伸穿过安装板的柱（27），以被接收在气缸中。 安装板与电路板间隔开，以使电容器位于安装板和电路板之间。 安装板限定多个开口（23），用于提供从风扇到CPU和电容器的冷却空气的通路。