Intubation System
    89.
    发明申请
    Intubation System 审中-公开

    公开(公告)号:US20180020902A1

    公开(公告)日:2018-01-25

    申请号:US15606974

    申请日:2017-05-26

    IPC分类号: A61B1/00 A61B1/267

    摘要: An intubation system includes an intubation instrument for capturing an image, wherein the intubation instrument has a first interface for providing an image signal representing the captured image, a display device with a second interface for receiving the image signal, wherein the display device is provided and designed to display the image captured by the intubation instrument, and a cable with a third interface at a first end of the cable and with a fourth interface at a second end of the cable. The first, second, third, and fourth interfaces are designed such that the first interface at the intubation instrument is connectable directly to the second interface at the display device and is alternatively connectable directly to the third interface at the cable, and such that the second interface at the display device is connectable directly to the first interface at the intubation instrument and is alternatively connectable directly to the fourth interface at the cable.

    Apparatus For Video-Endoscopy
    90.
    发明申请

    公开(公告)号:US20180000319A1

    公开(公告)日:2018-01-04

    申请号:US15637255

    申请日:2017-06-29

    IPC分类号: A61B1/00 H04N5/232 G02B23/24

    摘要: An apparatus for video endoscopy, in particular for industrial video endoscopy, has a device part which has a housing and an electronics component arrangement which is arranged in the housing. The electronics component arrangement is arranged within a sealed-off region in the housing. A heat sink is arranged in the housing, the said heat sink being thermally coupled to the electronics component arrangement in order to absorb heat from the electronics component arrangement. A fan for generating an air flow of ambient air is arranged in the housing, the said air flow flowing out of the housing along the heat sink in order to discharge the heat from the heat sink, wherein the air flow does not come into contact with the electronics component arrangement.