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公开(公告)号:US11686599B2
公开(公告)日:2023-06-27
申请号:US17647350
申请日:2022-01-07
Applicant: Allegro MicroSystems, LLC
Inventor: Rémy Lassalle-Balier , Jeffrey Eagen , Damien Dehu , Paul A. David , Andrea Foletto , Maxime Rioult
CPC classification number: G01D5/16 , G01R33/091
Abstract: Methods and apparatus that can include a rotatable target to generate a sinusoidal signal in a magnetic field sensor, wherein the target includes a plurality of sinusoidal teeth to reduce angular error. A magnetic field sensor can be configured to determine a position of the target. In embodiments, a rotatable target to generate a sinusoidal signal in a magnetic field sensor can include a plurality of sinusoidal teeth and a number of harmonics to reduce angular error.
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公开(公告)号:US20220333951A1
公开(公告)日:2022-10-20
申请号:US17232440
申请日:2021-04-16
Applicant: Allegro MicroSystems, LLC
Inventor: Aurelian Diaconu , Paul A. David
Abstract: A system and a method can use a magnetic field sensor to measure rotation angles of a ferromagnetic object in the form of a screw having screw threads. The magnetic field sensor can use a plurality of correction coefficients to improve an accuracy of the measured rotation angles of the ferromagnetic object. The magnetic field sensor can be disposed to a side of the screw.
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公开(公告)号:US11307054B2
公开(公告)日:2022-04-19
申请号:US16899702
申请日:2020-06-12
Applicant: Allegro MicroSystems, LLC
Inventor: Paul A. David , William P. Taylor
Abstract: A magnetic field sensor has a plurality of magnetic field sensing elements and operates as a motion detector for sensing a rotation or other movement of a target object.
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公开(公告)号:US20210285794A1
公开(公告)日:2021-09-16
申请号:US16818199
申请日:2020-03-13
Applicant: Allegro MicroSystems, LLC
Inventor: Robert A. Briano , Paul A. David
Abstract: Methods and apparatus for a current sensor having an elongate current conductor having an input and an output and a longitudinal axis. First, second, third and fourth magnetic field sensing elements are coupled in a bridge configuration and positioned in a plane parallel to a surface of the current conductor such that the second and fourth magnetic field sensing elements comprise inner elements and the first and third magnetic field sensing elements comprise outer elements. Embodiments of the sensor reduce the effects of stray fields on the sensor.
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公开(公告)号:US20210057314A1
公开(公告)日:2021-02-25
申请号:US16547814
申请日:2019-08-22
Applicant: Allegro MicroSystems, LLC
Inventor: Paul A. David , Harry Chandra , William P. Taylor
IPC: H01L23/495 , H01L23/31 , H01L21/56 , G01R33/07 , H01L43/06 , H01L43/12 , H01L25/065
Abstract: A method of providing a sensor IC package can include applying a film to a leadframe having first and second surfaces, mounting at least one component to the film, and applying a pre-mold material to cover at least a portion of the leadframe and the passive component while leaving a first side of the leadframe exposed. The film can be removed and a die attached to the first side of the leadframe. At least one electrical connection can be formed between the die and the leadframe. The assembly of the die, the leadframe, and the pre-mold material can be encapsulated with a final mold material to provide a low profile IC package.
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公开(公告)号:US10916665B2
公开(公告)日:2021-02-09
申请号:US16252789
申请日:2019-01-21
Applicant: Allegro MicroSystems, LLC
Inventor: Ravi Vig , William P. Taylor , Paul A. David , P. Karl Scheller , Andreas P. Friedrich
Abstract: A magnetic field sensor includes a lead frame, a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second surface attached to the lead frame, and a non-conductive mold material enclosing the die and at least a portion of the lead frame. The sensor may include a ferromagnetic mold material secured to a portion of the non-conductive mold material. Features include a multi-sloped taper to an inner surface of a non-contiguous central region of the ferromagnetic mold material, a separately formed element disposed in the non-contiguous central region, one or more slots in the lead frame, a molded ferromagnetic suppression device spaced from the non-conductive mold material and enclosing a portion of a lead, a passive device spaced from the non-conductive mold material and coupled to a plurality of leads, and a ferromagnetic bead coupled to a lead. Also described is a coil secured to the non-conductive mold material and a lead having at least two separated portions with a passive component coupled across the two portions.
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公开(公告)号:US20210025735A1
公开(公告)日:2021-01-28
申请号:US16522810
申请日:2019-07-26
Applicant: Allegro MicroSystems, LLC
Inventor: Paul A. David , William P. Taylor
IPC: G01D5/244
Abstract: A magnetic field sensor includes a substrate first and second magnetic field sensing elements, comprising first and second magnetoresistance elements, respectively. The first and second magnetic field sensing elements are responsive to the magnet. At or more positions of the magnet relative to the first and second magnetic field sensing elements while the magnet is stopped moving, at least one of the first magnetic field sensing element or the second magnetic field sensing element is in saturation in response to the magnet. The magnetic field sensor also includes a third magnetic field sensing element proximate to the first and second magnetoresistance elements, the third magnetic field sensing element operable to generate a third magnetic field sensing element signal responsive to the magnet, wherein, at the one or more positions while the magnet is stopped moving, the third magnetic field sensing element is not in saturation in response to the magnet or saturates at a higher magnetic field than the first and second magnetic field sensing elements in response to the magnet.
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公开(公告)号:US10809094B2
公开(公告)日:2020-10-20
申请号:US15883721
申请日:2018-01-30
Applicant: Allegro MicroSystems, LLC
Inventor: Andrea Foletto , Rémy Lassalle-Balier , Yannick Vuillermet , Paul A. David , Jeffrey Eagen
IPC: G01B7/14 , G01D5/14 , G01D5/165 , G01R33/09 , G01R33/025
Abstract: Methods and apparatus for a sensor system having a first magnetic field sensing element with first and second segments where the first and second segments are located at positions to generate magnetic field bias in opposite directions for reducing sensitivity due to misalignment of the first and second segments. A processing module is configured to receive an output of the magnetic field sensing element.
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公开(公告)号:US10753769B2
公开(公告)日:2020-08-25
申请号:US16136844
申请日:2018-09-20
Applicant: Allegro MicroSystems, LLC
Inventor: Paul A. David , William P. Taylor
Abstract: A magnetic field sensor has a plurality of magnetic field sensing elements and operates as a motion detector for sensing a rotation or other movement of a target object.
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公开(公告)号:US20200209017A1
公开(公告)日:2020-07-02
申请号:US16232348
申请日:2018-12-26
Applicant: Allegro MicroSystems, LLC
Inventor: Jeffrey Eagen , Paul A. David
IPC: G01D5/245 , G01M13/021 , G01D5/14
Abstract: A magnetic field sensor for sensing a movement of a target object an include a substrate having a major planar surface and three or more magnetic field sensing elements disposed upon the major planar surface of the substrate. The three or more magnetic field sensing elements can have respective major response axes, each major response axis parallel to the major planar surface of the substrate. The three or more magnetic field sensing elements comprise first and third magnetic field sensing elements and a second magnetic field sensing element disposed between the first and third magnetic field sensing elements. A first spacing between the first and second magnetic field sensing elements is less than a second spacing between the second and third magnetic field sensing elements. No other magnetic field sensing elements are disposed between the first and third magnetoresistance elements.
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