公开(公告)号：US20210057314A1

公开(公告)日：2021-02-25

申请号：US16547814

申请日：2019-08-22

Applicant: Allegro MicroSystems, LLC

Inventor： Paul A. David ,  Harry Chandra ,  William P. Taylor

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  G01R33/07 ,  H01L43/06 ,  H01L43/12 ,  H01L25/065

Abstract: A method of providing a sensor IC package can include applying a film to a leadframe having first and second surfaces, mounting at least one component to the film, and applying a pre-mold material to cover at least a portion of the leadframe and the passive component while leaving a first side of the leadframe exposed. The film can be removed and a die attached to the first side of the leadframe. At least one electrical connection can be formed between the die and the leadframe. The assembly of the die, the leadframe, and the pre-mold material can be encapsulated with a final mold material to provide a low profile IC package.

公开(公告)号：US20250140673A1

公开(公告)日：2025-05-01

申请号：US18495060

申请日：2023-10-26

Applicant: Allegro MicroSystems, LLC

Inventor： Vijay Mangtani ,  Paul A. David ,  William P. Taylor ,  Harianto Wong ,  Natasha Healey ,  Harry Chandra

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/29

Abstract: According to one aspect of the present disclosure, a voltage isolated integrated circuit (IC) package configuration includes a first package comprising a transformer and a mold material enclosing the transformer to form a first package body, wherein the first package comprises a first lead set to permit electrical connection to the transformer. In some embodiments, a second package comprising a lead frame, two or more semiconductor die supported by the lead frame, and a mold material enclosing the two or more semiconductor die to form a second package body, wherein the lead frame comprises a second lead set to permit electrical connection to the two or more semiconductor die. In some embodiments, the one or more leads of the first lead set is directly electrically connected to one or more leads of the second lead set, wherein the first package and the second package are mechanically coupled together.

公开(公告)号：US10991644B2

公开(公告)日：2021-04-27

申请号：US16547814

申请日：2019-08-22

Applicant: Allegro MicroSystems, LLC

Inventor： Paul A. David ,  Harry Chandra ,  William P. Taylor

IPC: H01L21/00 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01L43/06 ,  H01L43/12 ,  H01L25/065 ,  G01R33/07 ,  G01R33/00 ,  H01L31/0203

Abstract: A method of providing a sensor IC package can include applying a film to a leadframe having first and second surfaces, mounting at least one component to the film, and applying a pre-mold material to cover at least a portion of the leadframe and the passive component while leaving a first side of the leadframe exposed. The film can be removed and a die attached to the first side of the leadframe. At least one electrical connection can be formed between the die and the leadframe. The assembly of the die, the leadframe, and the pre-mold material can be encapsulated with a final mold material to provide a low profile IC package.

公开(公告)号：US20220406830A1

公开(公告)日：2022-12-22

申请号：US17352937

申请日：2021-06-21

Applicant: Allegro MicroSystems, LLC

Inventor： Bryan Cadugan ,  Harry Chandra ,  William P. Taylor

IPC: H01L27/146 ,  H04N5/378

Abstract: Methods and apparatus for a first photodetector array die having pixels from a first end to a second end and a second photodetector array die having pixels from a first end to a second end. A readout integrated circuit (ROIC) can be electrically coupled to the first and second photodetector array die. One or more microlenses can steer light onto the photodetector arrays.