公开(公告)号：US08052300B2

公开(公告)日：2011-11-08

申请号：US12274358

申请日：2008-11-20

申请人： Yi Zhang ,  Jin-Song Feng ,  Cheng-Tien Lai

发明人： Yi Zhang ,  Jin-Song Feng ,  Cheng-Tien Lai

IPC分类号： F21S4/00 ,  F21V29/00

CPC分类号： F21V29/004 ,  F21S2/005 ,  F21V19/001 ,  F21V29/713 ,  F21V29/75 ,  F21V29/76 ,  F21Y2115/10 ,  Y10S362/80

摘要： An LED lamp includes a heat sink, a plurality of fin arrays mounted on the heat sink, and a plurality of LED modules mounted on the fin arrays. The heat sink includes a base and a plurality of heat dissipating fins extending from the base. The fin arrays are mounted on a top surface of the base of the heat sink. Each fin array consists of a plurality of fins interlocked together. Each fin array has a bottom mounting surface in contact with the top surface of the base and a top engaging surface defined at an acute angle with respect to the top surface of the base. The LED modules are mounted on the engaging surfaces of the fin arrays, respectively, via heat absorbing plates.

摘要翻译： LED灯包括散热器，安装在散热器上的多个散热片阵列和安装在散热片阵列上的多个LED模块。 散热器包括基部和从基部延伸的多个散热翅片。 翅片阵列安装在散热器底座的顶表面上。 每个翅片阵列由互锁在一起的多个翅片组成。 每个翅片阵列具有与基部的顶表面接触的底部安装表面和相对于基部的顶部表面以锐角限定的顶部接合表面。 LED模块分别通过吸热板安装在翅片阵列的接合表面上。

公开(公告)号：US07942196B2

公开(公告)日：2011-05-17

申请号：US11964912

申请日：2007-12-27

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： F28D15/00 ,  H05K7/20

CPC分类号： F28D15/0233 ,  F28D15/046 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat spreader for cooling an electronic component includes a lower plate defining a chamber, an upper plate fixed on the lower plate to seal the chamber, a first wick layer and a second wick layer sandwiched between the lower plate and the upper plate, and a working liquid contained in the chamber. The first wick layer and the second wick layer respectively define a plurality of apertures, which include right-angled triangle, acute-angled triangle, and rhomboid apertures communicating with each other for containing the working liquid therein.

摘要翻译： 用于冷却电子部件的散热器包括限定室的下板，固定在下板上以密封室的上板，夹在下板和上板之间的第一芯芯层和第二芯芯层， 包含在室内的工作液体。 第一芯线层和第二芯线层分别限定多个孔，其包括彼此连通的直角三角形，锐角三角形和菱形孔，用于在其中容纳工作液体。

公开(公告)号：US07789242B2

公开(公告)日：2010-09-07

申请号：US12200872

申请日：2008-08-28

申请人： Chun-Jiang Shuai ,  Guang Yu ,  Cheng-Tien Lai

发明人： Chun-Jiang Shuai ,  Guang Yu ,  Cheng-Tien Lai

IPC分类号： B65D85/00

CPC分类号： F21V17/007 ,  B65D43/12 ,  B65D2585/86 ,  F21S4/20 ,  F21Y2115/10

摘要： A protective packaging for protecting an LED module from being damaged during transportation, includes a housing containing the LED module therein and a cover slidably fixed in the housing to cover a top opening of the housing. The housing defines a room to receive the LED module therein. A bottom portion of the housing is concaved to form a space, in which a thermal interface material bonded on the LED module is accommodated. An end of the housing is closed to abut against an end of the cover, and an opposite end of the housing is partially opened to receive an opposite end of the cover. The protective packaging is made from an antistatic plastic and has a wall thickness larger than 0.5 mm.

摘要翻译： 用于保护LED模块在运输过程中不被损坏的保护性包装包括其中包含LED模块的壳体和可滑动地固定在壳体中以覆盖壳体的顶部开口的盖子。 壳体定义了在其中接收LED模块的房间。 壳体的底部凹陷以形成容纳结合在LED模块上的热界面材料的空间。 壳体的端部被封闭以抵靠盖的端部，并且壳体的相对端部分地打开以容纳盖的相对端。 保护性包装由防静电塑料制成，壁厚大于0.5mm。

公开(公告)号：US07762689B2

公开(公告)日：2010-07-27

申请号：US11933996

申请日：2007-11-01

申请人： Fang-Wei Xu ,  Guang Yu ,  Cheng-Tien Lai

发明人： Fang-Wei Xu ,  Guang Yu ,  Cheng-Tien Lai

IPC分类号： F21V29/00

CPC分类号： F21V29/763 ,  F21K9/00 ,  F21V29/51 ,  F21V29/75 ,  F21Y2115/10

摘要： An LED lamp includes a heat dissipation apparatus with a base, an LED module mounted on the base, and an AC-DC converter electrically connected to the LED module. The AC-DC converter is mounted on the base near the LED module. Heat generated by the LED module and heat-generating components of the AC-DC converter is transferred to the base from which the heat is dissipated by the heat dissipation apparatus. Heat pipes are embedded in the base of the heat dissipation apparatus.

摘要翻译： LED灯包括具有基座的散热装置，安装在基座上的LED模块以及与LED模块电连接的AC-DC转换器。 AC-DC转换器安装在LED模块附近的基座上。 由LED模块产生的热量和AC-DC转换器的发热部件传递到由散热装置散热的基座。 热管埋在散热装置的底部。

公开(公告)号：US07744247B2

公开(公告)日：2010-06-29

申请号：US11964847

申请日：2007-12-27

申请人： Wen-Xiang Zhang ,  Xu-Hua Xiao ,  Guang Yu ,  Cheng-Tien Lai

发明人： Wen-Xiang Zhang ,  Xu-Hua Xiao ,  Guang Yu ,  Cheng-Tien Lai

IPC分类号： F21V29/00 ,  F21S8/00

CPC分类号： F21S8/086 ,  F21V29/75 ,  F21V29/763 ,  F21W2131/103 ,  F21Y2105/10 ,  F21Y2115/10

摘要： An LED lamp includes a heat sink having a base and a plurality of fins extending from the base. A plurality of LED modules is thermally attached to the base of the heat sink. A lamp frame surrounds the LED modules on the heat sink and is hermetically mounted to the heat sink. A lens is hermetically attached to the lamp frame and covers the LED modules. The fins includes a plurality of first fins extending from a first face of the base of the heat sink, and second fins extending from a second face of the base. The LED modules are located between the second fins. A pole has a top end engages with the lamp frame. The pole is used for mounting the LED lamp at a desired position, for example, a sidewalk of a street.

摘要翻译： LED灯包括具有底座和从基座延伸的多个翅片的散热器。 多个LED模块热连接到散热器的基座。 灯框围绕散热器上的LED模块，并且气密地安装在散热器上。 透镜气密地连接到灯框架并且覆盖LED模块。 翅片包括从散热片的基座的第一面延伸的多个第一翅片，以及从基座的第二面延伸的第二翅片。 LED模块位于第二散热片之间。 杆具有与灯框架接合的顶端。 杆用于将LED灯安装在期望的位置，例如街道的人行道上。

公开(公告)号：US07729118B2

公开(公告)日：2010-06-01

申请号：US11556618

申请日：2006-11-03

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： H05K7/20 ,  F04B35/04 ,  F28F7/00 ,  H02K9/00 ,  F28D15/00 ,  F25D17/02

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid cooling device includes a casing having an outer wall, a bottom base attached to a bottom end of the outer wall and a top cover attached to a top end of the outer wall. The casing defines a receiving space therein for receiving an impeller therein. A sealed chamber is defined in the casing and isolated from the receiving space. A motor driving unit is received in the sealed chamber and magnetically interacts with the impeller to drive the impeller to rotate. The motor driving unit comprises a motor having a stator and a printed circuit board electrically connecting with the stator. The top cover covers the motor driving unit and thermally contacts with electronic components on the printed circuit board for dissipating heat generated by the electronic components when the motor driving unit is operated.

摘要翻译： 液体冷却装置包括具有外壁，附接到外壁的底端的底部基座和附接到外壁的顶端的顶盖的壳体。 壳体在其中限定了容纳空间，用于在其中容纳叶轮。 密封室限定在外壳中并与接收空间隔离。 马达驱动单元被容纳在密封室中并且与叶轮磁力相互作用以驱动叶轮旋转。 马达驱动单元包括具有定子和与定子电连接的印刷电路板的马达。 顶盖覆盖电动机驱动单元并与印刷电路板上的电子部件热接触，用于在电动机驱动单元操作时散发由电子部件产生的热量。

公开(公告)号：US07682055B2

公开(公告)日：2010-03-23

申请号：US12184260

申请日：2008-08-01

申请人： Chun-Jiang Shuai ,  Guang Yu ,  Cheng-Tien Lai

发明人： Chun-Jiang Shuai ,  Guang Yu ,  Cheng-Tien Lai

IPC分类号： F21V29/00

CPC分类号： F21V29/763 ,  F21S8/086 ,  F21V29/004 ,  F21V29/51 ,  F21V29/76 ,  F21W2131/103 ,  F21Y2115/10 ,  Y10S362/80

摘要： An LED lamp includes a bracket and a heat sink mounted on a top side of the bracket. The heat sink includes a base. A plurality of LED module assemblies is mounted to a bottom surface of the base of the heat sink. Each of the LED module assemblies includes a heat absorbing plate located below the bottom surface of the base of the heat sink, an LED module mounted on a bottom surface of the heat absorbing plate and a heat pipe interconnecting the bottom surface of the base and a top surface of the heat absorbing plate. The heat pipes are U-shaped and horizontally positioned and have different heights.

摘要翻译： LED灯包括安装在托架顶部的支架和散热器。 散热器包括一个基座。 多个LED模块组件安装到散热器的底部的底表面。 每个LED模块组件包括位于散热器底座的底表面下方的吸热板，安装在吸热板的底表面上的LED模块和将底座的底表面和 吸热板的顶面。 热管是U形和水平定位的，具有不同的高度。

公开(公告)号：US07597133B2

公开(公告)日：2009-10-06

申请号：US11306359

申请日：2005-12-25

申请人： Hsieh-Kun Lee ,  Cheng-Tien Lai ,  Zhi-Bin Tan ,  Zhi-Yong Zhou ,  Jiang-Jian Wen

发明人： Hsieh-Kun Lee ,  Cheng-Tien Lai ,  Zhi-Bin Tan ,  Zhi-Yong Zhou ,  Jiang-Jian Wen

IPC分类号： F28F7/00

CPC分类号： H01L23/467 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a fin set, first and second base plates and first and second heat pipes. The first base plate has a face for contacting a heat generating electronic device. The first heat pipe includes first and second sections sandwiching the fin set between the first and second sections and engaging with the fin set. The first and second base plates sandwich the first heat pipe and the fin set between the first and second base plates and engage with the first heat pipe and the fin set. The second heat pipe includes first and second sections sandwiching the first heat pipe, the fin set, the first and second base plates between the first and second sections of the second heat pipe and engaging with the first and second base plates.

摘要翻译： 散热装置包括翅片组，第一和第二基板以及第一和第二热管。 第一基板具有用于接触发热电子装置的面。 第一热管包括将翅片组夹在第一和第二部分之间并与翅片组接合的第一和第二部分。 第一和第二基板将第一热管和翅片组夹在第一和第二基板之间并与第一热管和翅片组接合。 第二热管包括将第一热管，翅片组，第一和第二基板夹在第二热管的第一和第二部分之间并与第一和第二基板接合的第一和第二部分。

公开(公告)号：US20090213592A1

公开(公告)日：2009-08-27

申请号：US12034665

申请日：2008-02-21

申请人： Wen-Xiang Zhang ,  Guang Yu ,  Cheng-Tien Lai

发明人： Wen-Xiang Zhang ,  Guang Yu ,  Cheng-Tien Lai

IPC分类号： F21V21/00 ,  F21V29/00 ,  F21S4/00

CPC分类号： F21V29/51 ,  F21S8/032 ,  F21S8/083 ,  F21V15/01 ,  F21V29/004 ,  F21V29/713 ,  F21V29/74 ,  F21V29/763 ,  F21Y2103/10 ,  F21Y2115/10 ,  Y10S362/80

摘要： An LED lamp includes a support, an envelope, a heat sink assembly and a plurality of LED modules. The envelope is coupled to the support. The heat sink assembly includes a first heat sink mounted on the envelope, a cylindrical second heat sink attached to a bottom surface of the first heat sink and positioned in the envelope, and a plurality of heat pipes. The LED modules are mounted on an outside wall of the second heat sink. The heat pipes have condensing portions embedded in the bottom surface of the first heat sink and evaporating portions sandwiched between the outside wall of the second heat sink and the LED modules.

摘要翻译： LED灯包括支撑件，信封，散热器组件和多个LED模块。 信封耦合到支撑。 散热器组件包括安装在外壳上的第一散热器，附接到第一散热器的底表面并且定位在外壳中的圆柱形第二散热器和多个热管。 LED模块安装在第二散热器的外壁上。 热管具有嵌入在第一散热器的底表面中的冷凝部分和夹在第二散热器的外壁和LED模块之间的蒸发部分。

公开(公告)号：US07534015B2

公开(公告)日：2009-05-19

申请号：US11942175

申请日：2007-11-19

申请人： Fang-Wei Xu ,  Guang Yu ,  Cheng-Tien Lai

发明人： Fang-Wei Xu ,  Guang Yu ,  Cheng-Tien Lai

IPC分类号： F21V29/00

CPC分类号： F21V29/67 ,  F21K9/00 ,  F21V29/677 ,  F21V29/74 ,  F21V29/75 ,  F21V29/76 ,  F21V29/77 ,  F21V29/89 ,  F21Y2107/30 ,  F21Y2115/10

摘要： An LED lamp includes a hollow, prism-shaped heat sink (30), a plurality of LED modules (20) attached on sidewalls (320) of the heat sink, a cover (40) mounted on a top of the heat sink, a lampshade (10) secured to a bottom of the heat sink, and a fan (50) fixed on the top of the heat sink and through the cover. A plurality of fins (340) extends inwardly from inner faces of the heat sink to cooperatively define two crossed slots in the heat sink. When the fan is in operation, an airflow produced by the fan flows through the fins from the top through the bottom of the heat sink, thereby dissipating heat absorbed by the heat sink from the LED modules rapidly and efficiently.

摘要翻译： LED灯包括中空的棱柱形散热器（30），附接在散热器的侧壁（320）上的多个LED模块（20），安装在散热器顶部的盖子（40）， 固定在散热器底部的灯罩（10）和固定在散热器顶部并通过盖子的风扇（50）。 多个翅片（340）从散热器的内表面向内延伸，以协同地限定散热器中的两个交叉的狭槽。 当风扇运行时，由风扇产生的气流从散热器的顶部到底部流过翅片，从而快速有效地散发来自LED模块的散热片吸收的热量。