公开(公告)号：US5513070A

公开(公告)日：1996-04-30

申请号：US357449

申请日：1994-12-16

申请人： Hong Xie ,  Mostafa Aghazadeh ,  Gregory Turturro ,  Chia-Pin Chiu

发明人： Hong Xie ,  Mostafa Aghazadeh ,  Gregory Turturro ,  Chia-Pin Chiu

IPC分类号： G06F1/20 ,  H05K1/02 ,  H05K7/20

CPC分类号： H05K1/0206 ,  G06F1/203 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/10681

摘要： An improved heat dissipation device particularly suited for removing heat from a surface mounted integrated circuit component coupled to a printed circuit board in a portable computer. Vias, which are at least partially filled with a heat conductive material, improve heat transfer between a component and a heat conductive block mounted on opposite surfaces of the circuit board. A first section near one end of the heat pipe is attached to the heat conductive block in a channel formed receptive to the heat pipe. A second section of the heat pipe including the second end is attached to a metal plate which is affixed beneath the keyboard. Heat from the component flows through the vias to the block and is transferred by the heat pipe to the metal plate where it is dissipated.

摘要翻译： 一种改进的散热装置，特别适用于从便携式计算机中耦合到印刷电路板的表面安装集成电路部件去除热量。 至少部分地填充有导热材料的通孔改善了组件与安装在电路板的相对表面上的导热块之间的热传递。 在热管的一端附近的第一部分在与热管接收的通道中连接到导热块。 包括第二端的热管的第二部分附接到固定在键盘下面的金属板。 来自组分的热量流过通孔到块体，并被热管转移到金属板上，在其上消散。