公开(公告)号：US5621245A

公开(公告)日：1997-04-15

申请号：US741526

申请日：1996-10-31

申请人： Willy Agatstein ,  Mostafa Aghazadeh ,  Chia-pin Chiu ,  Amar Ghori ,  James R. Neal ,  Gregory Turturio

发明人： Willy Agatstein ,  Mostafa Aghazadeh ,  Chia-pin Chiu ,  Amar Ghori ,  James R. Neal ,  Gregory Turturio

IPC分类号： G06F1/26 ,  H01L23/498 ,  H01L23/50 ,  H01L25/16 ,  H01L23/34

CPC分类号： H01L25/16 ,  G06F1/26 ,  H01L23/49811 ,  H01L23/50 ,  H01L2924/0002

摘要： A very large scale integrated (VLSI) chip designed to operate at 3.3 volts is modified to be compatible with prior systems having a 5 volt voltage supply. A central processing unit (CPU) is fabricated at a center position on an integrated circuit chip that has an operating voltage of 3.3 volts. The chip is soldered into a pin grid array (PGA) package and a heat sink is attached on the PGA package above the CPU. A 5 volt-to-3.3 volt voltage regulator having a 5 volt input and a 3.3 volt output is placed at an edge of the PGA package. The 3.3 volt output of the voltage regulator is connected to the 3.3 volt operating voltage input of the chip. The VCC 5 V on board pins are connected to the 5 volt input of the voltage regulator and the 3.3 volt output of the voltage regulator is connected to the VCC pins of the chip. VSS ground on board pins are connected in common to both the ground terminal of the voltage regulator and the VSS pads of the chip. High performance capacitors are used to improve the transient response of the on-package voltage regulator. Dual voltage operation of the voltage regulated package is achieved by making the output of the voltage regulator available at the pins of the pin grid array (PGA) package.

摘要翻译： 设计用于3.3伏工作的非常大规模的集成（VLSI）芯片被修改为与具有5伏特电压的现有系统兼容。 中央处理单元（CPU）制造在集成电路芯片的中心位置，该集成电路芯片的工作电压为3.3伏。 该芯片被焊接到引脚格栅阵列（PGA）封装中，散热片连接在CPU上方的PGA封装上。 具有5伏特输入和3.3伏特输出的5伏至3.3伏电压调节器位于PGA封装的边缘。 电压调节器的3.3伏特输出端连接到芯片的3.3伏工作电压输入端。 VCC 5 V板载引脚连接到电压调节器的5 V输入，3.3 V稳压器输出端连接到芯片的VCC引脚。 VSS接地板上的引脚共同连接到电压调节器的接地端子和芯片的VSS焊盘。 高性能电容器用于改善封装内稳压器的瞬态响应。 电压调节封装的双电压工作是通过使引脚格栅阵列（PGA）封装引脚上的电压调节器的输出可用来实现的。

公开(公告)号：US5556811A

公开(公告)日：1996-09-17

申请号：US468972

申请日：1995-06-06

申请人： Willy Agatstein ,  Mostafa Aghazadeh ,  Chia-pin Chiu ,  Amar Ghori ,  James R. Neal ,  Gregory Turturio

发明人： Willy Agatstein ,  Mostafa Aghazadeh ,  Chia-pin Chiu ,  Amar Ghori ,  James R. Neal ,  Gregory Turturio

IPC分类号： G06F1/26 ,  H01L23/498 ,  H01L23/50 ,  H01L25/16 ,  H01L21/60

CPC分类号： H01L25/16 ,  G06F1/26 ,  H01L23/49811 ,  H01L23/50 ,  H01L2924/0002

摘要： A very large scale integrated (VLSI) chip designed to operate at 3.3 volts is modified to be compatible with prior systems having a 5 volt voltage supply. A central processing unit (CPU) is fabricated at a center position on an integrated circuit chip that has an operating voltage of 3.3 volts. The chip is soldered into a pin grid array (PGA) package and a heat sink is attached on the PGA package above the CPU. A 5 volt- to- 3.3 volt voltage regulator having a 5 volt input and a 3.3 volt output is placed at an edge of the PGA package. The 3.3 volt output of the voltage regulator is connected to the 3.3 volt operating voltage input of the chip. The VCC 5V on board pins are connected to the 5 volt input of the voltage regulator and the 3.3 volt output of the voltage regulator is connected to the VCC pins of the chip. VSS ground on board pins are connected in common to both the ground terminal of the voltage regulator and the VSS pads of the chip, High performance capacitors are used to improve the transient response of the on-package voltage regulator. Dual voltage operation of the voltage regulated package is achieved by making the output of the voltage regulator available at the pins of the pin grid array (PGA) package.

摘要翻译： 设计用于3.3伏工作的非常大规模的集成（VLSI）芯片被修改为与具有5伏特电压的现有系统兼容。 中央处理单元（CPU）制造在集成电路芯片的中心位置，该集成电路芯片的工作电压为3.3伏。 该芯片被焊接到引脚格栅阵列（PGA）封装中，散热片连接在CPU上方的PGA封装上。 具有5伏输入和3.3伏输出的5伏至3.3伏稳压器放置在PGA封装的边缘。 电压调节器的3.3伏特输出端连接到芯片的3.3伏工作电压输入端。 VCC 5V板载引脚连接到电压调节器的5伏特输入端，稳压器的3.3伏特输出端连接到芯片的VCC引脚。 VSS接地板上的引脚共同连接到电压调节器的接地端子和芯片的VSS焊盘，高性能电容器用于提高封装电压调节器的瞬态响应。 电压调节封装的双电压工作是通过使引脚格栅阵列（PGA）封装引脚上的电压调节器的输出可用来实现的。

公开(公告)号：US5808875A

公开(公告)日：1998-09-15

申请号：US939235

申请日：1997-09-29

申请人： John Francis McMahon ,  Mostafa Aghazadeh ,  Frank Kolman

发明人： John Francis McMahon ,  Mostafa Aghazadeh ,  Frank Kolman

IPC分类号： H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/20

CPC分类号： H05K3/3436 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K2201/049 ,  H05K2201/10378 ,  H05K2201/10477 ,  H05K3/326 ,  H05K3/4038 ,  Y02P70/613

摘要： An integrated circuit package that has no internal routing or vias within the substrate of the package. The package includes a substrate that has a plurality of bond pads and connecting contact pads located on an outer first surface of the substrate. An integrated circuit is mounted to the first surface and coupled to the bond pads. Mounted to the substrate is a solder rack which contains a plurality of contacts that couple the contact pads to an external printed circuit board.

摘要翻译： 集成电路封装，在封装的衬底内没有内部布线或通孔。 封装包括具有多个接合焊盘和位于衬底的外部第一表面上的连接接触焊盘的衬底。 集成电路安装到第一表面并且耦合到接合焊盘。 安装到基板的是一种焊盘，其包含将接触焊盘耦合到外部印刷电路板的多个触点。

公开(公告)号：US5621613A

公开(公告)日：1997-04-15

申请号：US683022

申请日：1996-07-15

申请人： Kevin Haley ,  Mostafa Aghazadeh ,  Hong Xie

发明人： Kevin Haley ,  Mostafa Aghazadeh ,  Hong Xie

IPC分类号： G06F1/16 ,  G06F1/20 ,  H05K7/20

CPC分类号： G06F1/203

摘要： A heat transfer apparatus providing thermal coupling between a first and a second hinged member. The first hinged member is a first computer housing member, and the second hinged member is a second computer housing member. The first and the second computer housing members are rotatably attached allowing pivotal motion along an axis substantially parallel to the first edge. A first embodiment has a spiraled heat transfer element with a inner edge thermally coupled to a heat conductive mounting element mounted along the first edge of the first computer housing member. The spiraled heat transfer element forms at least one turn around the heat conductive mounting element and has outer edge affixed to the second computer housing member. A second embodiment provides heat transfer between the first and second computer housing members through the gudgeon and the pintle of the hinge.

摘要翻译： 一种在第一和第二铰接构件之间提供热耦合的传热装置。 第一铰链构件是第一计算机外壳构件，第二铰接构件是第二计算机外壳构件。 第一和第二计算机外壳构件可旋转地附接，允许沿着基本上平行于第一边缘的轴线枢转运动。 第一实施例具有螺旋传热元件，其内边缘热耦合到沿着第一计算机外壳构件的第一边缘安装的导热安装元件。 螺旋传热元件围绕导热安装元件形成至少一匝，并且具有固定到第二计算机外壳构件的外边缘。 第二实施例通过铰链和铰链的枢轴提供第一和第二计算机外壳构件之间的热传递。

公开(公告)号：US5513070A

公开(公告)日：1996-04-30

申请号：US357449

申请日：1994-12-16

申请人： Hong Xie ,  Mostafa Aghazadeh ,  Gregory Turturro ,  Chia-Pin Chiu

发明人： Hong Xie ,  Mostafa Aghazadeh ,  Gregory Turturro ,  Chia-Pin Chiu

IPC分类号： G06F1/20 ,  H05K1/02 ,  H05K7/20

CPC分类号： H05K1/0206 ,  G06F1/203 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/10681

摘要： An improved heat dissipation device particularly suited for removing heat from a surface mounted integrated circuit component coupled to a printed circuit board in a portable computer. Vias, which are at least partially filled with a heat conductive material, improve heat transfer between a component and a heat conductive block mounted on opposite surfaces of the circuit board. A first section near one end of the heat pipe is attached to the heat conductive block in a channel formed receptive to the heat pipe. A second section of the heat pipe including the second end is attached to a metal plate which is affixed beneath the keyboard. Heat from the component flows through the vias to the block and is transferred by the heat pipe to the metal plate where it is dissipated.

摘要翻译： 一种改进的散热装置，特别适用于从便携式计算机中耦合到印刷电路板的表面安装集成电路部件去除热量。 至少部分地填充有导热材料的通孔改善了组件与安装在电路板的相对表面上的导热块之间的热传递。 在热管的一端附近的第一部分在与热管接收的通道中连接到导热块。 包括第二端的热管的第二部分附接到固定在键盘下面的金属板。 来自组分的热量流过通孔到块体，并被热管转移到金属板上，在其上消散。

公开(公告)号：US5289337A

公开(公告)日：1994-02-22

申请号：US839859

申请日：1992-02-21

申请人： Mostafa Aghazadeh ,  Mark Palmer

发明人： Mostafa Aghazadeh ,  Mark Palmer

IPC分类号： H01L23/433 ,  H01L25/065 ,  H05K7/20

CPC分类号： H01L23/433 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195

摘要： A converging design multi-chip module having semiconductor chips connected to a substrate recessed into a cavity of the MCM package body, the chips being interconnected using flip chip and control collapse chip connection, wherein a metal heatspreader plate is adapted to engage the backside of the chips and is held in place by an attachment ring welded to the package body. Alternatively, the heatspreader plate can be glued directly to the backside of the chips using a high thermal conductivity and low modulus cement. One or more electrically passive thermal shunt chips are disposed between the substrate and the heatspreader plate for additional heat conduction. In a preferred embodiment, the attachment ring is made from KOVAR.RTM. and has a thermal coefficient of expansion that is about the same as that of the package body. Thermal grease is interposed between the heatspreader plate and the semiconductor chips for improved heat transfer. In an alternative embodiment, the heatspreader plate is directly shunted to the substrate. In another alternative embodiment, the heatspreader plate is urged against the chips by a spring plate or a coiled spring against a lid for the package cavity.

摘要翻译： 一种会聚设计多芯片模块，其具有连接到凹入到MCM封装体的空腔中的衬底的半导体芯片，所述芯片使用倒装芯片和控制崩溃芯片连接互连，其中金属散热板适于接合所述MCM封装体的背面 并且通过焊接到包装主体的附接环保持在适当位置。 或者，可以使用高导热率和低模量水泥将散热板直接胶合到芯片的背面。 一个或多个电动热分流片设置在衬底和散热板之间用于额外的热传导。 在优选实施例中，连接环由KOVAR（商标）制成，并且具有与包装体大致相同的热膨胀系数。 散热片介于散热板和半导体芯片之间，以改善传热。 在替代实施例中，散热板被直接分流到基板。 在另一替代实施例中，散热板通过弹簧板或螺旋弹簧抵靠封盖腔的盖板抵靠着芯片。

公开(公告)号：US20210101175A1

公开(公告)日：2021-04-08

申请号：US16913986

申请日：2020-06-26

申请人： Kyle Jordan Arrington ,  Joseph Blaine Petrini ,  Aaron McCann ,  Shankar Devasenathipathy ,  James Christopher Matayabas, JR. ,  Mostafa Aghazadeh ,  Jerrod Peterson

发明人： Kyle Jordan Arrington ,  Joseph Blaine Petrini ,  Aaron McCann ,  Shankar Devasenathipathy ,  James Christopher Matayabas, JR. ,  Mostafa Aghazadeh ,  Jerrod Peterson

IPC分类号： B05D1/28

摘要： To address technical problems facing silicon transient thermal management, a thermal interface material (TIM) may be used to provide improved thermal conduction. The TIM may include a liquid metal (LM) TIM, which may provide a significant reduction in thermal resistance, such as a thermal resistance RTIM≈0.01-0.025 ° C.-cm2/W. The LM TIM may be applied using a presoaked applicator, such as an open-cell polyurethane foam applicator that has been presoaked in a controlled amount of LM TIM. This LM presoaked applicator is then used to apply the LM TIM to one or more target thermal surfaces, thereby providing thermal and mechanical coupling between the LM TIM and the thermal surface. The resulting thermal surface and thermally conductive LM TIM may be used to improve thermal conduction for various silicon-based devices, including various high-power, high-performance system-on-chip (SoC) packages, such as may be used in portable consumer products.