公开(公告)号：US06496534B1

公开(公告)日：2002-12-17

申请号：US08883959

申请日：1997-06-27

申请人： Satoru Shimizu ,  Eiichiro Kawakami ,  Kiyohito Tokuda

发明人： Satoru Shimizu ,  Eiichiro Kawakami ,  Kiyohito Tokuda

IPC分类号： H04B1500

CPC分类号： H04B1/712 ,  H04B1/71075

摘要： A code division multiple access receiver estimates symbol values transmitted by different stations by despreading a combined received signal, weights the estimated symbol values by use of weighting factors calculated for the different stations, respreads the weighted symbol values to estimate the interference due to each station, and subtracts the estimated interference from the received signal to produce a residual signal. The weighting factors can be calculated from the residual signal; the weighting factors are calculated so as to minimize the power of the residual signal. The weighting factors are adjusted at certain intervals, preferably at intervals determined from the rate of fading of the received signal.

摘要翻译： 码分多址接收机通过解扩组合接收信号来估计由不同台发射的符号值，通过使用为不同台计算的加权因子加权所估计的符号值，再次加权加权符号值以估计由于每个台站造成的干扰， 并从接收信号中减去估计的干扰，产生残留信号。 加权因子可以从剩余信号中计算出来; 计算加权系数，以使剩余信号的功率最小化。 加权因子以某些间隔进行调整，优选地以从接收信号的衰落速率确定的间隔进行调整。

公开(公告)号：US06389081B1

公开(公告)日：2002-05-14

申请号：US09468919

申请日：1999-12-22

申请人： Satoru Shimizu ,  Eiichiro Kawakami ,  Atsuhiko Sugitani ,  Kiyohito Tokuda

发明人： Satoru Shimizu ,  Eiichiro Kawakami ,  Atsuhiko Sugitani ,  Kiyohito Tokuda

IPC分类号： H04L2720

CPC分类号： H04L27/2082

摘要： The signal transmission equipment is comprised such that a signal point does not cross the origin of the constellation by selecting signals to be input to the QPSK modulator, and the positions of the signal points in the constellation.

摘要翻译： 信号传输设备包括使得信号点不通过选择要输入到QPSK调制器的信号以及星座中的信号点的位置与星座的原点相交。

公开(公告)号：US06193789B1

公开(公告)日：2001-02-27

申请号：US09194434

申请日：1998-12-01

申请人： Hideo Honma ,  Tomoyuki Fujinami ,  Yoshitaka Terashima ,  Shinji Hayashi ,  Satoru Shimizu

发明人： Hideo Honma ,  Tomoyuki Fujinami ,  Yoshitaka Terashima ,  Shinji Hayashi ,  Satoru Shimizu

IPC分类号： C23C1838

CPC分类号： H05K3/384 ,  C23C18/40 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/072

摘要： An electroless copper plating solution which is based on an electroless copper plating solution comprising a copper ion, a complexing agent, a hypophosphorous acid compound as a reducing agent, and a metallic catalyst for initiating a reductive reaction, as characterized by further comprising a lithium ion or both a lithium ion and a polyoxyethylene type surfactant, and a method for electroless copper plating using the same, as well as a plated product made by such a process. The electroless copper plating solution in the present invention enables a uniform and acicular copper film to be deposited on the surface of a plating object, and therefore can be used for improving the strength of adhesion between various metals and resins, including bonding of a copper foil to a resin as applied in a conductive circuit such as a multi-layer printed circuit board or in a copper-plated laminate.

摘要翻译： 一种基于包含铜离子，络合剂，次磷酸化合物作为还原剂的化学镀铜溶液和用于引发还原反应的金属催化剂的化学镀铜溶液，其特征在于还包括锂离子 或锂离子和聚氧乙烯型表面活性剂，以及使用该方法的无电镀铜方法，以及通过这种方法制成的镀覆物。 本发明的化学镀铜溶液能够在电镀对象的表面上沉积均匀的针状铜膜，因此可以用于提高各种金属和树脂之间的粘合强度，包括将铜箔 适用于诸如多层印刷电路板的导电电路中或在镀铜层压板中的树脂。