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公开(公告)号：US20230313383A1
公开(公告)日：2023-10-05
申请号：US18024550
申请日：2021-08-23
发明人： Vinith Bejugam , Thorsten Teutsch
CPC分类号： C23C18/1893 , C23C18/2086 , C23C18/30 , C23C18/40
摘要： A method for electrolessly depositing a metal layer onto a substrate, including the following chronological steps:
a) treating the substrate surface to be plated with an etching solution;
b) treating the substrate surface to be plated with a polyelectrolyte or an organosilane compound;
c) treating the surface to be plated with a solution containing metal particles;
d) treating the surface to be plated with a solution containing at least one salt of the metal to be deposited onto the substrate.-
公开(公告)号：US20180122641A1
公开(公告)日：2018-05-03
申请号：US15857774
申请日：2017-12-29
发明人： Tomohisa Hoshino , Keiichi Fujita , Masato Hamada
IPC分类号： H01L21/288 , H01L21/768 , C23C18/16 , H01L21/3205
CPC分类号： H01L21/288 , C23C18/1619 , C23C18/1633 , C23C18/1653 , C23C18/1675 , C23C18/1696 , C23C18/1879 , C23C18/40 , C25D7/123 , H01L21/32051 , H01L21/76873 , H01L21/76874 , H01L21/76898
摘要： A substrate processing method is provided for performing a plating processing on a substrate having, on a surface thereof, an impurity-doped polysilicon film containing a high concentration of impurities. The substrate processing method includes forming a catalyst layer by supplying, onto the substrate, an alkaline catalyst solution containing a complex of a palladium ion and a monocyclic 5- or 6-membered heterocyclic compound having one or two nitrogen atoms as a heteroatom; and forming a plating layer through electroless plating by supplying a plating liquid onto the substrate after the forming of the catalyst layer.
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公开(公告)号：US09951433B2
公开(公告)日：2018-04-24
申请号：US15034424
申请日：2014-11-18
发明人： Yukiya Takeuchi , Junji Yoshikawa , Koji Kita
IPC分类号： C23C18/40 , C23C18/16 , C23C18/20 , C23C18/24 , C23C18/28 , C23C18/30 , C25D3/38 , C25D3/04 , C25D3/12 , C25D5/14 , C25D5/34 , C25D5/54 , C25D1/18
CPC分类号： C25D3/38 , C23C18/16 , C23C18/1653 , C23C18/2086 , C23C18/285 , C23C18/30 , C23C18/40 , C25D3/04 , C25D3/12 , C25D5/14
摘要： An object of the present invention is to provide a novel conductive film-forming bath comprising an alkaline aqueous solution that can be used to form a film by electroplating on a non-conductive plastic material, the conductive film-forming bath being capable of forming a film by electroplating that has an excellent appearance and that does not suffer from reduced adhesiveness with respect to a non-conductive plastic material. The present invention relates to a conductive film-forming bath comprising an aqueous solution containing a copper compound, a complexing agent, an alkali metal hydroxide, and a water-soluble polymer having a polyoxyalkylene structure.
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公开(公告)号：US09869026B2
公开(公告)日：2018-01-16
申请号：US14332326
申请日：2014-07-15
CPC分类号： C23C18/40 , C23C18/1633 , C23C18/54 , H05K3/00 , H05K3/0094 , H05K3/181 , H05K3/187 , H05K3/422
摘要： Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.
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5.发明申请公开(公告)号：US20170350016A1
公开(公告)日：2017-12-07
申请号：US15616540
申请日：2017-06-07
摘要： The present invention relates to the use of water soluble lanthanide compounds as stabilizer in electrolytes for electroless metal deposition, an electrolyte as well as a method for the electroless deposition of metals, particularly layers of nickel, copper, cobalt, boron, silver, palladium or gold, as well as layers of alloys comprising at least one of the aforementioned metals as alloying metal.
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6.发明申请公开(公告)号：US20170342567A1
公开(公告)日：2017-11-30
申请号：US15165276
申请日：2016-05-26
发明人： Benjamin Naab
CPC分类号： C23C18/42 , C23C18/1608 , C23C18/1635 , C23C18/1893 , C23C18/2086 , C23C18/30 , C23C18/40
摘要： Walls of through-holes and vias of substrates with dielectric material are electroless plated with copper using tin-free ionic silver catalysts. Conductive polymers are first formed on the substrates by treating the substrates with a permanganate solution containing complexing anions followed by applying monomers, oligomers or conductive polymers to the substrate to form a conductive polymer coating on the dielectric of the substrate as well as on the walls of through-holes and vias of the substrate. A tin-free ionic silver catalyst is then applied to the treated substrate. Optionally, the tin-free ionic silver catalyst can include a ligand agent to form a coordination entity with the silver ions of the tin-free catalyst. The silver ions of the tin-free catalyst are reduced by the conductive polymer and then an electroless metal copper bath is applied to the treated substrate to copper plate the dielectric and walls of the through-holes and vias of the substrate.
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7.发明申请公开(公告)号：US20170204519A1
公开(公告)日：2017-07-20
申请号：US15326583
申请日：2015-06-30
发明人： Gyu Beom KWAG , Seung Won KANG , Nam Kwi LEE , Min Hwan CHANG , Jong Gil LEE , Soo Hyung HUR , Min Young PARK , Byung Rok KANG , Ji Hun KANG
CPC分类号： C23C18/1653 , C23C18/1641 , C23C18/1886 , C23C18/2086 , C23C18/24 , C23C18/30 , C23C18/40 , C23C18/405 , C23C28/023 , C25D3/12 , C25D5/54 , C25D7/00
摘要： The present invention relates to: a method for plating nonwoven fabric with metals (copper and nickel, or nickel and nickel) by electroless and electrolytic continuous processes; and a nonwoven fabric plated by the method. The present invention can prepare a metal-plated nonwoven fabric by electrolytic plating a space of metal ions, which are formed by performing electroless plating with copper or nickel, with nickel in a short amount of time, thereby filling up the space, and thus has excellent conductivity while being thin. A desired conductivity can be obtained by changing the composition of a plating solution or controlling the plating velocity, and a line capable of performing plating with copper and nickel, nickel and nickel, nickel alone, or copper alone, in combination, can be manufactured. In addition, a highly conductive nonwoven fabric having no difference in plating thickness of nonwoven fabric performed by only electroless plating can be produced.
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公开(公告)号：US20170175270A1
公开(公告)日：2017-06-22
申请号：US15447522
申请日：2017-03-02
申请人： BYD COMPANY LIMITED
发明人： WEI ZHOU , BIFENG MAO
IPC分类号： C23C18/16 , C23C18/40 , C23C18/18 , B01J37/08 , B01J35/00 , B01J35/02 , B01J37/00 , C23C18/20 , B01J23/20
CPC分类号： C23C18/1612 , B01J23/20 , B01J35/0013 , B01J35/026 , B01J37/0072 , B01J37/08 , C08K3/22 , C08K9/02 , C08K2003/2231 , C08L77/06 , C09D11/03 , C09D11/10 , C09D11/102 , C09D11/322 , C09D11/38 , C09D11/52 , C09D167/02 , C09D169/00 , C09D177/10 , C23C18/1608 , C23C18/1633 , C23C18/1641 , C23C18/1646 , C23C18/1653 , C23C18/1655 , C23C18/1893 , C23C18/20 , C23C18/204 , C23C18/2066 , C23C18/40 , C25D3/12 , H05K3/182 , H05K3/185 , H05K2201/0236 , H05K2203/0709 , H05K2203/107
摘要： A polymer product with a metal layer coated on the surface thereof is provided. The polymer product includes a polymer substrate and a metal layer formed on at least a part of a surface of the polymer substrate. The surface of the polymer substrate covered by the metal layer is formed by a polymer composition comprising a polymer and a doped tin oxide. A doping element of the doped tin oxide comprises niobium. The doped tin oxide has a coordinate L* value of about 70 to about 100, a coordinate a value of about −5 to about 5, and a coordinate b value of about −5 to about 5 in a CIELab color space.
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公开(公告)号：US09617644B2
公开(公告)日：2017-04-11
申请号：US13636087
申请日：2011-03-21
IPC分类号： C23C18/54 , C23C18/28 , C23C18/30 , C23C18/40 , C23C18/16 , C23C18/20 , C23C18/34 , C23C18/36 , C23C18/44 , C23C18/52 , C25D11/00
CPC分类号： C23C18/54 , C23C18/1651 , C23C18/1653 , C23C18/208 , C23C18/285 , C23C18/30 , C23C18/34 , C23C18/36 , C23C18/40 , C23C18/44 , C23C18/52 , C25D11/00
摘要： The present invention relates to a method for direct metallization of non-conductive substrates as well as a conductor solution used in such a method. According to the invention, it is proposed to contact a non-conductive substrate surface after activation by a noble metal colloid-containing activator solution with a conductor solution, which comprises a metal that is reducible by a metal of the activator solution, a complexing agent and a reducing agent.
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公开(公告)号：US20170096566A1
公开(公告)日：2017-04-06
申请号：US15317076
申请日：2015-08-03
申请人： LG CHEM, LTD.
发明人： Chee-Sung PARK , Han Nah JEONG , Eun Kyu SEONG , Su Jeong LEE , Ha Na LEE
CPC分类号： C09D5/24 , C08K3/16 , C23C18/1608 , C23C18/1612 , C23C18/204 , C23C18/40 , H01B1/22 , H01B5/14 , H01B13/0026 , H05K1/0373 , H05K1/09 , H05K3/185 , H05K2201/0236 , H05K2201/09118 , H05K2203/107
摘要： Provided are a composition for forming a conductive pattern, which enables formation of a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simplified process, a method of forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming the conductive pattern includes a polymer resin; and a non-conductive metal compound including a coinage metal element [Group 11 (Group IB)] and a non-metal element, the non-conductive metal compound having a three-dimensional structure formed by vertex sharing of tetrahedrons including the Group 11 metal element, in which a metal core including the Group 11 metal element or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.
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