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公开(公告)号：US20220359459A1
公开(公告)日：2022-11-10
申请号：US17307028
申请日：2021-05-04
发明人： Jiapei DING , Rolan Ocuaman CAMBA , Teng Hock KUAH , Jian LIAO , Kar Weng YAN
摘要： An apparatus having a seal plate which includes rigid hard portions and one or more flexible soft portions located between the hard portions is used for bonding at least one semiconductor device onto a substrate that is supported on a platform. The seal plate is movable between a first position which is spaced from the substrate and a second position whereat a first side of the seal plate is configured to be in contact with the substrate. A diaphragm covers a second side of the seal plate opposite to the first side. A fluid pressure generator exerts a fluid pressure onto the diaphragm to actuate the diaphragm to compress the one or more soft portions to transmit a bonding force onto the at least one semiconductor device during bonding.
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公开(公告)号：US20220336254A1
公开(公告)日：2022-10-20
申请号：US17232220
申请日：2021-04-16
发明人： Ngai Tat MAN , Yiu Ming CHEUNG , Jun QI , Chi Yung LEE
IPC分类号： H01L21/683
摘要： When picking a die from an adhesive tape, a collet of a pick arm is positioned at a distance over the die, the die being mounted on a first surface of the adhesive tape. A flow of air is then generated onto a second surface of the adhesive surface opposite to the first surface for blowing the adhesive tape to displace the die towards a die-holding surface of the collet. Thereafter, the die is retained on the die-holding surface of the collet while the adhesive tape separates from the die.
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公开(公告)号：US20220037213A1
公开(公告)日：2022-02-03
申请号：US16944206
申请日：2020-07-31
发明人： Shun Yan LEE , Sai Kit WONG , Chi Wah YUEN , Ka Yee MAK , Gary Peter WIDDOWSON
摘要： A pick and place LED testing apparatus, comprising: a test station operative in use to power a group of LEDs; a bondhead operative in use to pick said group of LEDs from a source wafer and place said group of LEDs on said test station for testing; and an optical sensor operative in use to measure an optical characteristic of said group of LEDs when tested, wherein at least a portion of said bondhead is translucent to provide an optical path from said group of LEDs to said optical sensor.
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公开(公告)号：US20210356758A1
公开(公告)日：2021-11-18
申请号：US15930546
申请日：2020-05-13
发明人： Po Lam AU , Liancheng YANG , Chun Ting TANG , Fan Leuk LAI , Chi Piu WONG
摘要： A lens assembly is separated into a first lens module including at least one lens element and a second lens module including at least one other lens element during alignment of its lens elements. Coarse alignment is conducted by aligning an optical axis of at least one lens element within the first lens module with an optical axis of at least one lens element within the second lens module. For conducting fine alignment, an image sensor views a test chart with while the first and second lens modules are positioned between the test chart and the image sensor. Image quality indices are obtained from the image sensor of the test chart at different relative alignments between the first and second lens modules, before the first lens module is fixed to the second lens module at a relative alignment therebetween where the image quality indices are optimized.
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公开(公告)号：US20210354355A1
公开(公告)日：2021-11-18
申请号：US15930533
申请日：2020-05-13
发明人： Chi Wah CHENG , Wan Yin YAU , Kwok Pun LAW
IPC分类号： B29C45/40 , H01L21/683 , H01L21/687 , B65G49/06 , H01L21/67
摘要： A die ejection apparatus operable to eject a die from a support has at least two ejector components configured to lift a die located on the support. The ejector components are moveable to a position in which a lifting force is exertable by the ejector components on the support, so as to lift a die located on the support. Movement of the die ejector components is initiated towards the support, and a moment when each of the die ejector components reaches the position is determined. A height offset of each die ejector component relative to a height of another die ejector component is determined upon reaching the said position, and relative heights of the die ejector components are adjusted in dependence upon the evaluated height offset.
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公开(公告)号：US11121113B2
公开(公告)日：2021-09-14
申请号：US16744280
申请日：2020-01-16
发明人： Ming Yeung Wan , Wai Kin Cheung , Yu Fu Cheung
摘要： A bonding apparatus includes a holding element, holding element actuators, sensors, a controller and bond force adjusting actuators. In use, the holding element holds an electrical component and is moved by the holding element actuators in one or more actuating directions to contact the electrical component with a base member. The sensors measure reaction forces exerted on the holding element in response to contact between the electrical component and the base member. The controller determines bond forces to be exerted on actuating areas of the holding element during a bonding process based on the measured reaction forces, and the bond force adjusting actuators exert these bond forces on the actuating areas of the holding element during the bonding process, so as to adjust a tilt of the electrical component relative to the base member.
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公开(公告)号：US10882298B2
公开(公告)日：2021-01-05
申请号：US15344947
申请日：2016-11-07
发明人： Shui Cheung Woo , Liang Hong Tang , Wan Yin Yau , Wai Yuen Cheung , Kui Kam Lam
摘要： A bonding apparatus comprises a movable bond head collet, a reference marker configured to move with the bond head collet, a flip head collet, first and second imaging devices and an adjusting mechanism. In use, the first imaging device captures one or more images of the reference marker and the flip head collet, and the second imaging device captures one or more images of the reference marker and the bond head collet. The adjusting mechanism aligns a position of the bond head collet with a position of the flip head collet based on an offset that is determined from the images of the flip head collet, bond head collet and reference marker. The flip head collet retrieves an electrical component and transfers the electrical component to the bond head collet at the alignment position.
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公开(公告)号：US10659699B2
公开(公告)日：2020-05-19
申请号：US14326630
申请日：2014-07-09
申请人： Jiangwen Deng , Wui Fung Sze , Qi Lang
发明人： Jiangwen Deng , Wui Fung Sze , Qi Lang
摘要： Disclosed is an apparatus for reconstructing a three-dimensional profile of a target surface of an object. The apparatus comprises: i) a lighting apparatus having at least two modes of illumination to illuminate the target surface, wherein a first mode of illumination produces a pattern onto the target surface and a second mode of illumination illuminates every part of the target surface; ii) an imaging device for capturing respective images of the target surface upon a sequential activation of the first and second modes of illumination of the target surface by the lighting apparatus; and iii) a processor for reconstructing the three-dimensional profile of the target surface based on the images of the target surface as captured by the imaging device. A method of reconstructing a 3D profile of a target surface of an object is also disclosed.
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公开(公告)号：US10476364B2
公开(公告)日：2019-11-12
申请号：US15183497
申请日：2016-06-15
发明人： Yue Zhang , Weihuan Luo , Libang Zeng
摘要： A magnet assembly for a linear motor, the magnet assembly including one or more permanent magnets, a mounting plate having a mounting portion that is configured for arranging and mounting the one or more permanent magnets along a direction of elongation of the mounting plate, and at least one elongate member that extends at least partially through the mounting plate between a first end and second end thereof, the at least one elongate member extending at least partially through the or each magnet for fixing the or each magnet with respect to the mounting plate.
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公开(公告)号：US10307867B2
公开(公告)日：2019-06-04
申请号：US14533204
申请日：2014-11-05
申请人： Franz Hollinger , Karel Maykel Richard Van Der Stam , Dick Verhaart , Guido Martinus Henricus Knippels
发明人： Franz Hollinger , Karel Maykel Richard Van Der Stam , Dick Verhaart , Guido Martinus Henricus Knippels
IPC分类号： B23K26/06 , B23K26/067 , B23K26/364 , H01L21/67 , B23K103/00
摘要： An apparatus for cutting a substrate comprises first and second lasers, and first and second optical fibers each having an input end and an output end opposite to the input end, wherein the input ends of the first and second optical fibers are connected to the first and second lasers respectively. The output ends of the first and second optical fibers are movable relative to the substrate and are configured to image first and second laser beams onto the substrate simultaneously for cutting the substrate.
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