公开(公告)号：US10479130B2

公开(公告)日：2019-11-19

申请号：US12460829

申请日：2009-07-24

申请人： John Herslow ,  Luis J. DaSilva

发明人： John Herslow ,  Luis J. DaSilva

IPC分类号： B32B37/02 ,  B42D25/46 ,  B32B3/30 ,  B32B15/08 ,  B32B27/06 ,  B32B27/08 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36 ,  B32B38/06 ,  B42D25/425 ,  B42D25/00 ,  B32B37/00 ,  B32B38/14 ,  B32B38/00 ,  B42D25/45 ,  B42D25/328

摘要： The invention includes a method for forming a card with an embedded three dimensional (3-D) image and the resultant card formed by the method. The method includes forming a first assembly which includes a layer of deformable material and an overlying layer of pattern conforming material. An engraved laminating plate is applied to the deformable layer during an engraving and laminating step applied to the first sub-assembly under predetermined pressure and selected temperature conditions for embossing the deformable layer with a well defined and sharp pattern. Then, a second assembly including a pattern conforming layer is laminated with the first assembly to embed and secure the pattern between the two conformable layers.

公开(公告)号：US09721200B2

公开(公告)日：2017-08-01

申请号：US14543495

申请日：2014-11-17

申请人： COMPOSECURE, LLC

发明人： John Herslow ,  Michele Logan ,  David Finn

IPC分类号： G06K19/02 ,  G06K19/06 ,  G06K19/077 ,  G01B7/06 ,  H01Q1/38 ,  H01Q1/22 ,  H01Q7/00

CPC分类号： G06K19/07722 ,  G01B7/06 ,  G06K19/07783 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  Y10T29/49016

摘要： In a smart card having an antenna structure and a metal layer, an insulator layer is formed between the antenna structure and the metal layer to compensate for the attenuation due to the metal layer. The thickness of the insulator layer affects the capacitive coupling between the antenna structure and the metal layer and is selected to have a value which optimizes the transmission/reception of signals between the card and a card reader.