THROUGH SILICON VIA STRUCTURE FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGING AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20230099959A1

    公开(公告)日:2023-03-30

    申请号:US17052853

    申请日:2020-07-02

    IPC分类号: H01L23/48 H01L21/768

    摘要: The present disclosure belongs to the technical field of integrated circuit packaging, and specifically relates to a through silicon via structure for three-dimensional integrated circuit packaging and a manufacturing method thereof. The method of the present disclosure includes the following steps: lifting off a silicon wafer by implanting hydrogen ions into the silicon wafer to obtain a substrate for making a through silicon via; performing double-sided plasma etching on the substrate to form a through silicon via penetrating the substrate; depositing an insulating medium, a copper diffusion barrier layer, and a seed layer; and removing parts of the copper diffusion barrier layer and the seed layer by photolithography and etching processes, leaving only parts of the copper diffusion barrier layer and the seed layer on a sidewall of the through silicon via; forming a sacrificial layer on the upper and lower surfaces of the resulting structure, completely filling in the through silicon via with conductive metal material, and then removing the sacrificial layer, upper and lower surfaces of the conductive metal material respectively protruding from upper and lower surfaces of the insulating medium; and forming a contact pad on a surface of the conductive metal material. The present disclosure can effectively improve production efficiency and lower the cost.

    THREE-DIMENSIONAL INTEGRATED SYSTEM OF DRAM CHIP AND PREPARATION METHOD THEREOF

    公开(公告)号:US20230098556A1

    公开(公告)日:2023-03-30

    申请号:US17052861

    申请日:2020-07-02

    摘要: Disclosed is a three-dimensional integrated system for DRAM chips and a fabrication method thereof. A plurality of trench structures are etched on the front and back of a silicon wafer; then, a TSV structure is etched between the two upper and lower trenches opposite to each other for electrical connection; then, DRAM chips are placed in the trenches, and copper-copper bonding is used to make the chips electrically connected to the TSV structure in a vertical direction; finally, redistribution is done to make the chips in a horizontal direction electrically connected. The invention can make full use of silicon materials, and can avoid problems such as warpage and deformation of an interposer. In addition, placing the chips in the trenches will not increase the overall package thickness, while protecting the chips from external impact.

    FURANEOL GLYCOSIDE COMPOUND, PHARMACEUTICAL COMPOSITION THEREOF, PREPARATION METHOD THEREFOR, AND APPLICATION THEREOF

    公开(公告)号:US20230092001A1

    公开(公告)日:2023-03-23

    申请号:US17786133

    申请日:2020-12-18

    申请人: FUDAN UNIVERSITY

    IPC分类号: C07H17/04

    摘要: Disclosed are a furaneol glycoside compound, a pharmaceutical composition thereof, a preparation method therefor, and an application thereof. Specifically disclosed are a compound as represented by formula A-1, a pharmaceutically acceptable salt thereof or a crystal form thereof. Also disclosed is a pharmaceutical composition, which comprises the compound as represented by formula A-1, the pharmaceutically acceptable salt thereof, and a pharmaceutical adjuvant. Also disclosed is an application of the compound as represented by formula A-1, the pharmaceutically acceptable salt thereof, the crystal form thereof, or the pharmaceutical composition in the preparation of drugs. The drugs are drugs for treating inflammatory bowel diseases. The furaneol glycoside compound has a good effect of treating inflammatory bowel diseases, particularly ulcerative colitis.

    USE OF WNT INHIBITOR WNT-C59 IN PREPARATION OF DRUG FOR TREATING SCN5A MUTATION-INDUCED DILATED CARDIOMYOPATHY

    公开(公告)号:US20220370428A1

    公开(公告)日:2022-11-24

    申请号:US17637455

    申请日:2021-08-06

    IPC分类号: A61K31/444 A61P9/04

    摘要: The use of a Wnt inhibitor Wnt-C59 in the preparation of a drug for treating SCN5A mutation-induced dilated cardiomyopathy (DCM) is provided. With SCN5A genotype detection as a breakthrough point, a Wnt pathway-specific inhibitor Wnt-C59 is used to inhibit the abnormal activation of the Wntβ-Catenin pathway caused by SCN5A gene mutation, thereby improving the prognosis of cardiac function in a patient with SCN5A gene mutation-induced DCM. In experiments, aging and adriamycin-induced DCM models are constructed, and the therapeutic effect of Wnt-C59 on DCM is detected through indexes such as changes in cardiac function and activation of related signal molecules, which provides a theoretical basis for use of Wnt-C59 in the clinical treatment of DCM. A new treatment method for SCN5A mutation-induced DCM is provided to bring dawn to such patients and has promising application prospects.

    METHODS AND SYSTEMS FOR TREATING AN OBJECT

    公开(公告)号:US20220314025A1

    公开(公告)日:2022-10-06

    申请号:US17305051

    申请日:2021-06-29

    IPC分类号: A61N5/10

    摘要: The present disclosure may disclose methods and systems for treating an object. The method may include imaging an object fixed on a positioning device using an imaging device. The method may include obtaining a plan image of the object. The method may include generating information of a region of interest (ROI) of the object based on the plan image of the object. The method may include generating a treatment plan based on the information of the ROI. The treatment plan may include a plan isocenter on the plan image. The method may further include treating a target portion of the object based on the treatment plan using a treatment device. The object may be fixed on the positioning device from a moment that the object is started to fixed on the positioning device to an end of the treatment of the target portion.

    FULL CONTINUOUS-FLOW PREPARATION METHOD OF L-CARNITINE

    公开(公告)号:US20220267253A1

    公开(公告)日:2022-08-25

    申请号:US17741112

    申请日:2022-05-10

    申请人: Fudan University

    IPC分类号: C07C227/12 B01J19/00

    摘要: A full continuous-flow preparation method of L-carnitine, including: mixing chlorine gas and a diketene solution via a first micromixer followed by transportation to a first microchannel reactor for continuous chlorination and esterification reaction to obtain 4-chloroacetoacetate; feeding the 4-chloroacetoacetate and a reductase to a second micromixer and a second microchannel reactor in sequence for continuous catalytic reaction to obtain (R)-4-chloro-3-hydroxybutyrate; simultaneously transporting the (R)-4-chloro-3-hydroxybutyrate and a trimethylamine solution to a third micromixer and a third microchannel reactor for continuous substitution and hydrolysis reaction; and subjecting the reaction mixture to desalination and concentration to obtain the L-carnitine.

    Omnidirectional beamforming method
    10.
    发明授权

    公开(公告)号:US11368194B2

    公开(公告)日:2022-06-21

    申请号:US17317830

    申请日:2021-05-11

    申请人: FUDAN UNIVERSITY

    摘要: The present disclosure provides an omnidirectional beamforming method. In the omnidirectional beamforming method, a space-time block coding is performed on a data stream to be sent to obtain the coded data stream. Omnidirectional beamforming matrices corresponding to a uniform rectangular antenna array are constructed. The beamforming is performed on the coded data stream through the omnidirectional beamforming matrices, to generate a signal to be sent of the uniform rectangular antenna array.