公开(公告)号：US09297878B2

公开(公告)日：2016-03-29

申请号：US11399924

申请日：2006-04-07

申请人： Gang Chen ,  Oleg Mitrofanov ,  Ronen Rapaport

发明人： Gang Chen ,  Oleg Mitrofanov ,  Ronen Rapaport

IPC分类号： G02B6/28 ,  G02B6/04 ,  G01S3/781 ,  G01J1/04 ,  G01J1/42 ,  G02B6/02

CPC分类号： G01S3/781 ,  G01J1/04 ,  G01J1/0425 ,  G01J1/4228 ,  G02B6/02057 ,  G02B6/04

摘要： Apparatus including: an optical waveguide bundle including a plurality of optical waveguides substantially aligned along a waveguide bundle axis, each optical waveguide having a longitudinal core configured to transmit light; a plurality of the optical waveguides each including a Bragg reflector, the Bragg reflectors configured to couple light incident from a direction substantially transverse to the waveguide bundle axis into the optical waveguides in a propagating mode in the longitudinal cores; and each of a plurality of longitudinal cores being in optical communication with an optical detector configured to detect light transmitted in the longitudinal cores.

摘要翻译： 装置包括：光波导束，其包括沿着波导束轴线大致对准的多个光波导，每个光波导具有构造成透射光的纵向芯; 多个光波导，每个包括布拉格反射器，所述布拉格反射器被配置成将从基本上横向于波导束轴的方向入射的光以纵向芯中的传播模式耦合到光波导中; 并且多个纵向芯中的每一个与被配置成检测在所述纵向芯中透射的光的光学检测器光学连通。

公开(公告)号：US08844609B2

公开(公告)日：2014-09-30

申请号：US12381385

申请日：2009-03-11

申请人： Charles C. Byers ,  William H. Scofield

发明人： Charles C. Byers ,  William H. Scofield

IPC分类号： H01L23/473 ,  F28F7/02

CPC分类号： H01L23/473 ,  F28D15/0275 ,  F28F7/02 ,  H01L2924/0002 ,  H01L2924/00

摘要： Apparatus including cooling manifold, having metal cooling body and metal cooling block. Metal cooling body has internal passageway. Metal cooling block extends away from metal cooling body. Metal cooling block has surface oriented for being placed adjacent to and in substantially direct thermal communication with an electronic component located at distance away from metal cooling body. Cooling manifold is configured for circulating a working fluid through internal passageway and for precluding passage of the working fluid from metal cooling body into metal cooling block. Method that includes providing electronic component and cooling manifold. Provided cooling manifold includes metal cooling body and metal cooling block; metal cooling body has internal passageway; metal cooling block extends away from metal cooling body; metal cooling block has surface oriented adjacent to and in substantially direct thermal communication with electronic component being located at distance away from metal cooling body. Method also includes causing working fluid to be circulated through internal passageway while precluding passage of working fluid from metal cooling body into metal cooling block, such that heat is transferred from electronic component to working fluid.

摘要翻译： 装置包括具有金属冷却体和金属冷却块的冷却歧管。 金属冷却体有内部通道。 金属冷却块远离金属冷却体。 金属冷却块具有表面定向以便放置成与位于离金属冷却体远的电子部件相邻并且与之基本上直接热连通。 冷却歧管被构造成使工作流体通过内部通道循环并且用于阻止工作流体从金属冷却体通入金属冷却块。 包括提供电子部件和冷却歧管的方法。 提供的冷却歧管包括金属冷却体和金属冷却块; 金属冷却体有内部通道; 金属冷却块远离金属冷却体; 金属冷却块具有与电子部件相邻并且与电子部件基本上直接热连通的表面取向，远离金属冷却体。 方法还包括使工作流体通过内部通道循环，同时阻止工作流体从金属冷却体通入金属冷却块，使得热量从电子部件转移到工作流体。

公开(公告)号：US08425844B2

公开(公告)日：2013-04-23

申请号：US13284868

申请日：2011-10-28

申请人： Robert L. Willett ,  Kirk W. Baldwin ,  Loren N. Pfeiffer

发明人： Robert L. Willett ,  Kirk W. Baldwin ,  Loren N. Pfeiffer

IPC分类号： G01N15/06 ,  G01N33/00 ,  G01N33/48

CPC分类号： G01N33/5438 ,  B01J19/0046 ,  B01J2219/00317 ,  B01J2219/00443 ,  B01J2219/00533 ,  B01J2219/00585 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/00612 ,  B01J2219/00617 ,  B01J2219/00621 ,  B01J2219/0063 ,  B01J2219/00637 ,  B01J2219/00659 ,  B01J2219/00702 ,  B01J2219/00725 ,  B01J2219/0075 ,  C40B60/04 ,  C40B60/10 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49826 ,  Y10T436/11

摘要： Apparatus comprising surface site comprising substantially inorganic surface having chemical composition selected from group consisting of metals, semiconductors, insulators, and mixtures thereof, the surface positioned within polypeptide bonding region and having selective bonding affinity for polypeptide; plurality of interlayers between which surface site is interposed; distal site end on surface site and distanced from interlayers, the surface being provided on distal site end; surface site and interlayers being interposed between first and second supports; first and second conductors provided on first and second supports and having respective first and second distal conductor ends positioned within polypeptide bonding region; conductors being capable of applying external voltage potential across polypeptide bonding region. Apparatus, optionally comprising such first and second supports and conductors; and comprising third conductor in electrical communication with surface site, the third conductor positioned for electrical communication with source of an external bias voltage. Techniques for making apparatus.

摘要翻译： 包括表面位置的装置包括具有选自金属，半导体，绝缘体及其混合物的化学组成的基本上无机表面，所述表面位于多肽结合区域内并且对多肽具有选择性结合亲和力; 介于其间的多个中间层; 表面部位的远端位置远离中间层，表面位于远端位置; 表面部位和夹层介于第一和第二支撑之间; 第一和第二导体，其设置在第一和第二支撑上，并且具有位于多肽接合区域内的相应的第一和第二远端导体末端; 导体能够跨越多肽接合区域施加外部电压电位。 装置，可选地包括这样的第一和第二支撑件和导体; 并且包括与表面部位电连通的第三导体，所述第三导体定位成与外部偏置电压源电连通。 制造设备的技术。

公开(公告)号：US09751264B2

公开(公告)日：2017-09-05

申请号：US12577148

申请日：2009-10-09

申请人： Todd R. Salamon

发明人： Todd R. Salamon

IPC分类号： F28F7/00 ,  B29C70/58 ,  B29L31/18

CPC分类号： B29C70/58 ,  B29K2995/0013 ,  B29L2031/18 ,  Y10T428/23

摘要： A device including an enclosure that encapsulates a plurality of particles dispersed in a matrix material. The particles are formed of a material having substantial bulk thermal conductivity of at least about one watt per meter-Kelvin (1 W/[mK]) at a standardized measurement temperature of about 68° F. In the device, the enclosure is configured upon deformation to allow a portion of the matrix material to escape while retaining at least a portion of the particles within the enclosure. A system that includes an enclosure that encapsulates a plurality of such particles dispersed in a matrix material, the enclosure being located between first and second objects. In the system, the enclosure has through-pores communicating between an interior of the enclosure and an exterior of the enclosure, and at least a portion of the particles have diameters that are larger than a maximum diameter of the through-pores.

公开(公告)号：US08450723B2

公开(公告)日：2013-05-28

申请号：US10701183

申请日：2003-11-04

申请人： Hylke Akkerman ,  Howard Edan Katz

发明人： Hylke Akkerman ,  Howard Edan Katz

IPC分类号： H01L35/24

CPC分类号： H01L51/0036 ,  H01L51/0068 ,  H01L51/0516 ,  H01L51/0545

摘要： Semiconductor apparatus comprising: a dielectric layer comprising a surface, a portion of the surface having exposed aromatic groups; and a polycrystalline semiconductor layer comprising an organic semiconductor composition overlying and in contact with the portion of the surface, the organic semiconductor composition comprising a compound comprising a chain-like moiety, the chain-like moiety comprising a conjugated thiophene or phenyl group and comprising alkyl chains at ends of the chain-like moiety. Devices comprising semiconductor apparatus, methods for making semiconductor apparatus, and methods for making devices.

摘要翻译： 半导体装置，包括：介电层，包括表面，所述表面的一部分具有暴露的芳族基团; 所述有机半导体组合物包含覆盖所述表面的该部分并与其接触的多晶半导体层，所述有机半导体组合物包含包含链状部分的化合物，所述链状部分包含共轭噻吩或苯基并且包含烷基 链状部分末端的链。 包括半导体装置的装置，制造半导体装置的方法以及制造装置的方法。