专利检索 ap:"Akira Maruoka" 第 1 页

1.

发明授权
Mold for polyimide, polyamide, or polyamide-imide resin which has noble metal layer on its surface to be in contact with resin 失效
标题翻译：在其表面上具有与树脂接触的贵金属层的聚酰亚胺，聚酰胺或聚酰胺酰亚胺树脂的模具

公开(公告)号：US3966390A

公开(公告)日：1976-06-29

申请号：US389659

申请日：1973-08-21

申请人： Mineo Nakano , Takeshi Koyama , Yoshiro Matsumoto , Akira Maruoka

发明人： Mineo Nakano , Takeshi Koyama , Yoshiro Matsumoto , Akira Maruoka

IPC分类号： B29C33/60 , B29C41/28 , B29C1/02 , B29C1/04

CPC分类号： B29C41/28 , B29C33/60 , B29K2077/00 , B29K2079/00 , Y10S425/055 , Y10T428/12889 , Y10T428/12896 , Y10T428/12937 , Y10T428/12979 , Y10T428/31681

摘要： In making films or molded articles from polyamide, polyimide, or polyamide-imide resins, the problem of stripping or release is successfully solved by applying a noble metal layer on the surface of a film-casting belt or plate or a casting mold to be in contact with the resins.

摘要翻译： 在由聚酰胺，聚酰亚胺或聚酰胺 - 酰亚胺树脂制造薄膜或模塑制品时，通过在铸塑带或板或铸模的表面上施加贵金属层成功解决了剥离或脱模的问题与树脂接触。