公开(公告)号：US09929187B2

公开(公告)日：2018-03-27

申请号：US14296800

申请日：2014-06-05

申请人： Shuwei Sun ,  Francois-Charles Dary ,  Marc Abouaf ,  Patrick Hogan ,  Qi Zhang

发明人： Shuwei Sun ,  Francois-Charles Dary ,  Marc Abouaf ,  Patrick Hogan ,  Qi Zhang

IPC分类号： H01B1/02 ,  H01L27/12 ,  B81C1/00 ,  C22F1/04 ,  C22F1/00 ,  C22F1/08 ,  C22F1/14 ,  C21D1/00 ,  C21D9/00 ,  H01L29/66 ,  G06F3/041 ,  H01L29/49 ,  H01L23/532 ,  H01L29/786 ,  G06F3/044

CPC分类号： H01L27/1244 ,  B81C1/00 ,  B81C1/00031 ,  B81C1/00404 ,  B81C1/00523 ,  B81C1/00547 ,  C21D1/00 ,  C21D9/00 ,  C21D2201/00 ,  C21D2211/00 ,  C21D2251/00 ,  C22F1/00 ,  C22F1/04 ,  C22F1/08 ,  C22F1/14 ,  G06F3/041 ,  G06F3/0412 ,  G06F3/044 ,  G06F2203/04103 ,  H01B1/026 ,  H01L23/53238 ,  H01L29/4908 ,  H01L29/6675 ,  H01L29/78603 ,  H01L29/78666 ,  H01L2924/0002 ,  Y10T428/12611 ,  Y10T428/1266 ,  Y10T428/12681 ,  Y10T428/12687 ,  Y10T428/12694 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12743 ,  Y10T428/1275 ,  Y10T428/12806 ,  Y10T428/12812 ,  Y10T428/12819 ,  Y10T428/12826 ,  Y10T428/1284 ,  Y10T428/12847 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12931 ,  H01L2924/00

摘要： In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

公开(公告)号：US20170370015A1

公开(公告)日：2017-12-28

申请号：US15542946

申请日：2016-01-15

申请人： DOWA METALTECH CO., LTD.

发明人： Shunki Sadamori ,  Hiroshi Miyazawa ,  Masafumi Ogata ,  Keisuke Shinohara

IPC分类号： C25D3/46 ,  H01R4/58 ,  H01H1/025 ,  C25D7/00 ,  C25D5/00 ,  H01R13/03 ,  B32B15/01

CPC分类号： C25D3/46 ,  B32B15/018 ,  C25D3/12 ,  C25D5/00 ,  C25D5/12 ,  C25D7/00 ,  H01H1/025 ,  H01H2011/046 ,  H01R4/58 ,  H01R13/03 ,  Y10T428/12896

摘要： A silver-plated product is produced by forming a surface layer of silver on a base material by electroplating at a liquid temperature of 10 to 35° C. and a current density of 3 to 15 A/dm2 in a silver plating solution so as to satisfy (32.6x−300)≦y≦(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and a current density is y (g·A/L·dm2) and that a liquid temperature of the silver plating solution is x (° C.), the silver plating solution containing 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium.

公开(公告)号：US09755343B2

公开(公告)日：2017-09-05

申请号：US14390108

申请日：2012-12-20

申请人： AUTONETWORKS TECHNOLOGIES, LTD. ,  SUMITOMO WIRING SYSTEMS, LTD. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

发明人： Takahiro Sunaga ,  Yoshifumi Saka ,  Yasushi Saitou

IPC分类号： H01R13/03 ,  H01R43/16 ,  B32B15/01 ,  C23C28/00 ,  C25D5/10 ,  C25D5/50 ,  C25D5/12 ,  C23C14/16 ,  C23C14/58 ,  C23C28/02 ,  C23C30/00 ,  C22C5/06

CPC分类号： H01R13/03 ,  B32B15/01 ,  B32B15/018 ,  C22C5/06 ,  C23C14/16 ,  C23C14/165 ,  C23C14/58 ,  C23C14/5806 ,  C23C28/00 ,  C23C28/02 ,  C23C28/021 ,  C23C28/023 ,  C23C30/00 ,  C23C30/005 ,  C25D5/10 ,  C25D5/12 ,  C25D5/50 ,  H01R43/16 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12896 ,  Y10T428/1291 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24975 ,  Y10T428/26 ,  Y10T428/263 ,  Y10T428/264 ,  Y10T428/265

摘要： It is aimed to provide a plated member and a plated terminal for connector, to which a large current can be applied and which have both a low friction coefficient and high heat resistance, at low cost and provide a method for producing such a plated member and a method for producing such a plated terminal for connector. A silver-tin alloy layer for coating a surface of a base material made of copper or copper alloy and a silver coating layer for coating the silver-tin alloy layer and to be exposed on an outermost surface are simultaneously formed by heating to obtain a plated member after tin and silver plating layers are alternately laminated on the surface of the base material with the outermost surface formed by the silver plating layer.

公开(公告)号：US09726271B2

公开(公告)日：2017-08-08

申请号：US14789903

申请日：2015-07-01

申请人： United Technologies Corporation

发明人： Thomas R. Hanlon ,  William P. Ogden ,  Eli N. Ross

IPC分类号： C25D3/64 ,  C25D5/18 ,  C25D7/10 ,  F16H55/06 ,  F16C33/12 ,  C25D5/10 ,  C25D11/02 ,  C22C5/06 ,  C25D3/60 ,  C25D11/34

CPC分类号： F16H55/06 ,  C22C5/06 ,  C25D3/60 ,  C25D3/64 ,  C25D5/10 ,  C25D5/18 ,  C25D7/10 ,  C25D11/02 ,  C25D11/024 ,  C25D11/34 ,  F16C33/121 ,  Y10T74/19949 ,  Y10T428/12896

摘要： An article comprises a metal alloy substrate and a plated wear interface layer disposed over a surface of the metal alloy substrate. The wear interface layer has a chemical composition including between about 0.005 wt % and about 0.050 wt % of antimony (Sb), and the balance silver (Ag) and incidental impurities.

公开(公告)号：US20170200689A1

公开(公告)日：2017-07-13

申请号：US15107421

申请日：2015-07-22

申请人： NIPPON MICROMETAL CORPORATION ,  NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.

发明人： Takashi YAMADA ,  Daizo ODA ,  Teruo HAIBARA ,  Ryo OISHI ,  Kazuyuki SAITO ,  Tomohiro UNO

IPC分类号： H01L23/00 ,  C22C9/04 ,  C22C9/06 ,  B23K35/02 ,  B23K35/30

CPC分类号： B23K35/0227 ,  B23K35/3013 ,  B23K35/302 ,  B23K2101/40 ,  B32B15/00 ,  B32B15/01 ,  B32B15/018 ,  C22C5/04 ,  C22C9/00 ,  C22C9/04 ,  C22C9/06 ,  C23C30/00 ,  C23C30/005 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/4312 ,  H01L2224/43125 ,  H01L2224/4321 ,  H01L2224/4382 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45 ,  H01L2224/45005 ,  H01L2224/45015 ,  H01L2224/45105 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45113 ,  H01L2224/45118 ,  H01L2224/4512 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45178 ,  H01L2224/45541 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48463 ,  H01L2224/48824 ,  H01L2224/78 ,  H01L2224/78251 ,  H01L2224/85 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85203 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01034 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/0665 ,  H01L2924/0705 ,  H01L2924/10253 ,  H01L2924/186 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/265 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/01045 ,  H01L2924/01049 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01031 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/01029 ,  H01L2924/01202 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/00015 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/20105 ,  H01L2924/01001 ,  H01L2924/01007 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01027 ,  H01L2924/01047 ,  H01L2924/01013

摘要： A bonding wire includes a Cu alloy core material, and a Pd coating layer formed on the Cu alloy core material. The bonding wire contains at least one element selected from Ni, Zn, Rh, In, Ir, and Pt. A concentration of the elements in total relative to the entire wire is 0.03% by mass or more and 2% by mass or less. When measuring crystal orientations on a cross-section of the core material in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation angled at 15 degrees or less to a wire axis direction has a proportion of 50% or more among crystal orientations in the wire axis direction. An average crystal grain size in the cross-section of the core material in the direction perpendicular to the wire axis of the bonding wire is 0.9 μm or more and 1.3 μm or less.

公开(公告)号：US20170067166A1

公开(公告)日：2017-03-09

申请号：US15354733

申请日：2016-11-17

申请人： C3Nano Inc.

发明人： Yongxing Hu ,  Xiqiang Yang ,  Ying-Syi Li ,  Alexander Seung-il Hong ,  Melanie Mariko Inouye ,  Yadong Cao ,  Ajay Virkar

IPC分类号： C23C18/44 ,  H01B1/22 ,  C09D11/52 ,  H05K1/02 ,  C23C18/16 ,  B32B15/01 ,  H01B13/30 ,  H05K1/09

CPC分类号： C23C18/44 ,  B32B9/045 ,  B32B15/018 ,  B32B15/04 ,  B32B15/08 ,  B32B27/08 ,  B32B27/20 ,  B32B27/28 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2262/103 ,  B32B2262/12 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/414 ,  B32B2457/20 ,  B82Y20/00 ,  B82Y30/00 ,  C09D11/52 ,  C09D101/02 ,  C09D105/08 ,  C09D133/06 ,  C09D139/06 ,  C23C18/1635 ,  C23C18/1637 ,  C23C18/42 ,  C23C18/54 ,  H01B1/22 ,  H01B13/30 ,  H05K1/02 ,  H05K1/0274 ,  H05K1/097 ,  H05K3/10 ,  H05K3/105 ,  H05K3/1283 ,  H05K2201/0108 ,  H05K2201/026 ,  Y10T428/12444 ,  Y10T428/12479 ,  Y10T428/12486 ,  Y10T428/12889 ,  Y10T428/12896

摘要： Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network.

摘要翻译： 描述了具有均匀的贵金属涂层的金属纳米线。 公开了两种方法，电镀交换和直接沉积，以成功形成均匀的贵金属涂层。 电化学交换反应和直接沉积方法均受益于包含适当强结合配体以控制或介导涂覆方法以提供均匀涂层的形成。 贵金属涂覆的纳米线对于生产稳定的透明导电膜是有效的，其可以包括熔融金属纳米结构网络。

公开(公告)号：US09558859B2

公开(公告)日：2017-01-31

申请号：US14183492

申请日：2014-02-18

申请人： RSM Electron Power, Inc.

发明人： Ching Au ,  Manhong Zhao ,  Robert Conte

IPC分类号： H01B1/02 ,  H05K3/24 ,  H01L23/373

CPC分类号： H01B1/02 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/0002 ,  H05K3/244 ,  H05K2201/0341 ,  H05K2201/068 ,  Y10T428/12743 ,  Y10T428/1275 ,  Y10T428/12847 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/1291 ,  H01L2924/00

摘要： The invention provides a slip layer substrate which can reduce the thermal residual stresses between components induced by their mismatch of thermal expansion, thus greatly improve the reliability of electronic packages. The slip layer substrate comprises: a base material; a first metallization layer formed on the base material; a first diffusion barrier layer formed on the first metallization layer; a slip layer formed on the first diffusion barrier layer; a second diffusion barrier layer formed on the slip layer; and a second metallization layer formed on the second diffusion barrier layer.

摘要翻译： 本发明提供了一种滑动层基材，其可以降低由它们的热膨胀失配引起的组分之间的热残余应力，从而大大提高电子封装的可靠性。 滑动层基材包括：基材; 形成在基材上的第一金属化层; 形成在第一金属化层上的第一扩散阻挡层; 形成在第一扩散阻挡层上的滑移层; 形成在滑动层上的第二扩散阻挡层; 以及形成在第二扩散阻挡层上的第二金属化层。

公开(公告)号：US09552986B2

公开(公告)日：2017-01-24

申请号：US14253649

申请日：2014-04-15

申请人： MICRON TECHNOLOGY, INC.

发明人： Jiutao Li ,  Keith Hampton ,  Allen McTeer

IPC分类号： H01L21/02 ,  C23C14/06 ,  C23C14/00 ,  C23C14/34 ,  C23C14/54

CPC分类号： H01L21/02631 ,  C23C14/0021 ,  C23C14/0623 ,  C23C14/3407 ,  C23C14/3492 ,  C23C14/548 ,  H01L21/02266 ,  Y10S428/938 ,  Y10T428/12896

摘要： A method of sputter depositing silver selenide and controlling the stoichiometry and nodular defect formations of a sputter deposited silver-selenide film. The method includes depositing silver-selenide using a sputter deposition process at a pressure of about 0.3 mTorr to about 10 mTorr. In accordance with one aspect of the invention, an RF sputter deposition process may be used preferably at pressures of about 2 mTorr to about 3 mTorr. In accordance with another aspect of the invention, a pulse DC sputter deposition process may be used preferably at pressures of about 4 mTorr to about 5 mTorr.

摘要翻译： 溅射沉积硒化银并控制溅射沉积的硒化银膜的化学计量和结节缺陷形成的方法。 该方法包括在约0.3mTorr至约10mTorr的压力下使用溅射沉积工艺沉积硒化银。 根据本发明的一个方面，RF溅射沉积工艺可以优选地在约2mTorr至约3mTorr的压力下使用。 根据本发明的另一方面，脉冲DC溅射沉积工艺可优选地在约4mTorr至约5mTorr的压力下使用。

公开(公告)号：US20160293288A1

公开(公告)日：2016-10-06

申请号：US14823001

申请日：2015-08-11

申请人： C3Nano Inc.

发明人： Yongxing Hu ,  Xiqiang Yang ,  Ying-Syi Li ,  Alexander Seung-il Hong ,  Melanie Mariko Inouye ,  Yadong Cao ,  Ajay Virkar

IPC分类号： H01B1/22 ,  C23C18/16 ,  C23C18/42

CPC分类号： C23C18/44 ,  B32B9/045 ,  B32B15/018 ,  B32B15/04 ,  B32B15/08 ,  B32B27/08 ,  B32B27/20 ,  B32B27/28 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2262/103 ,  B32B2262/12 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/414 ,  B32B2457/20 ,  B82Y20/00 ,  B82Y30/00 ,  C09D11/52 ,  C09D101/02 ,  C09D105/08 ,  C09D133/06 ,  C09D139/06 ,  C23C18/1635 ,  C23C18/1637 ,  C23C18/42 ,  C23C18/54 ,  H01B1/22 ,  H01B13/30 ,  H05K1/02 ,  H05K1/0274 ,  H05K1/097 ,  H05K3/10 ,  H05K3/105 ,  H05K3/1283 ,  H05K2201/0108 ,  H05K2201/026 ,  Y10T428/12444 ,  Y10T428/12479 ,  Y10T428/12486 ,  Y10T428/12889 ,  Y10T428/12896

摘要： Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network.

摘要翻译： 描述了具有均匀的贵金属涂层的金属纳米线。 公开了两种方法，电镀交换和直接沉积，以成功形成均匀的贵金属涂层。 电化学交换反应和直接沉积方法均受益于包含适当强结合配体以控制或介导涂覆方法以提供均匀涂层的形成。 贵金属涂覆的纳米线对于生产稳定的透明导电膜是有效的，其可以包括熔融金属纳米结构网络。

公开(公告)号：US20160250390A1

公开(公告)日：2016-09-01

申请号：US15151631

申请日：2016-05-11

申请人： Bactiguard AB

发明人： Mattias Ohrlander ,  Billy Södervall

IPC分类号： A61L31/08 ,  A61L31/06 ,  A61L31/02 ,  A61L31/04

CPC分类号： A61L31/088 ,  A01N25/08 ,  A01N59/16 ,  A61K9/00 ,  A61K33/24 ,  A61K33/38 ,  A61L2/238 ,  A61L26/0004 ,  A61L27/30 ,  A61L27/306 ,  A61L27/50 ,  A61L29/10 ,  A61L29/106 ,  A61L31/022 ,  A61L31/024 ,  A61L31/026 ,  A61L31/042 ,  A61L31/048 ,  A61L31/06 ,  A61L31/08 ,  A61L33/0076 ,  A61L2400/18 ,  A61L2420/02 ,  B05D3/0254 ,  B32B5/16 ,  B32B5/30 ,  B32B9/005 ,  B32B15/16 ,  B32B27/00 ,  B32B27/14 ,  B32B27/16 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2264/105 ,  B32B2307/7145 ,  B32B2307/73 ,  B32B2535/00 ,  C23C18/1635 ,  C23C18/1646 ,  C23C18/1689 ,  C23C18/18 ,  C23C18/42 ,  C23C18/44 ,  C23C26/00 ,  C23C30/00 ,  Y10T428/12569 ,  Y10T428/12875 ,  Y10T428/12896 ,  Y10T428/256 ,  Y10T428/27 ,  Y10T428/273 ,  Y10T428/29 ,  Y10T428/2991 ,  Y10T428/31667 ,  Y10T428/31678 ,  A01N25/10 ,  A01N25/34 ,  A01N2300/00

摘要： There is disclosed a substrate with an electron donating surface, characterized in having metal particles on said surface, said metal particles comprising palladium and at least one metal selected from the group consisting of gold, ruthenium, rhodium, osmium, iridium, and platinum, wherein the amount of said metal particles is from about 0.001 to about 8 μg/cm2. Examples of coated objects include contact lenses, pacemakers, pacemaker electrodes, stents, dental implants, rupture nets, rupture mesh, blood centrifuge equipment, surgical instruments, gloves, blood bags, artificial heart valves, central venous catheters, peripheral venous catheters, vascular ports, haemodialysis equipment, peritoneal dialysis equipment, plasmapheresis devices, inhalation drug delivery devices, vascular grafts, arterial grafts, cardiac assist devices, wound dressings, intermittent catheters, ECG electrodes, peripheral stents, bone replacing implants, orthopaedic implants, orthopaedic devices, tissue replacing implants, intraocular lenses, sutures, needles, drug delivery devices, endotracheal tubes, shunts, drains, suction devices, hearing aid devices, urethral medical devices, and artificial blood vessels.

摘要翻译： 公开了具有给电子表面的基材，其特征在于在所述表面上具有金属颗粒，所述金属颗粒包含钯和选自金，钌，铑，锇，铱和铂中的至少一种金属，其中 所述金属颗粒的量为约0.001至约8μg/ cm 2。 涂覆物体的实例包括隐形眼镜，起搏器，起搏器电极，支架，牙植入物，破裂网，破裂网，血液离心机设备，手术器械，手套，血袋，人造心脏瓣膜，中心静脉导管，外周静脉导管，血管端口 ，血液透析设备，腹膜透析设备，血浆置换装置，吸入药物递送装置，血管移植物，动脉移植物，心脏辅助装置，伤口敷料，间歇导管，ECG电极，外周支架，骨置换植入物，整形外科植入物，整形外科装置，组织替代 植入物，眼内透镜，缝线，针，药物输送装置，气管内导管，分流器，排水管，抽吸装置，助听器装置，尿道医疗装置和人造血管。