公开(公告)号：US5840129A

公开(公告)日：1998-11-24

申请号：US692594

申请日：1996-08-06

申请人： Albert M. Saenz ,  David L. Thrasher ,  Wilbur C. Krusell ,  William G. Drapak

发明人： Albert M. Saenz ,  David L. Thrasher ,  Wilbur C. Krusell ,  William G. Drapak

IPC分类号： A47L15/42 ,  B08B11/02 ,  H01L21/00 ,  H01L21/687 ,  C03C23/00 ,  A47L15/00 ,  A47L25/00 ,  B08B7/00

CPC分类号： H01L21/68728 ,  A47L15/42 ,  B08B11/02 ,  H01L21/67046

摘要： A method and apparatus for rotating wafers in a double sided scrubber without slipping or hesitating. A rotating roller imparts rotary motion to a semiconductor wafer during a double sided cleaning process. The rotating roller and wafer contact at their outer edges and the friction between their outer edges causes the wafer to rotate. The roller has an outer edge with a groove. The wafer edge is pinched inside the groove to create enough friction that when cleaning solutions are applied the wafer does not slip and continues to rotate. Also, the groove allows the roller to pinch the wafer just enough so that when the roller reaches the flat of the wafer, the roller may regain the radius of the wafer without hesitating.

摘要翻译： 一种用于在双面洗涤器中旋转晶片而不会发生滑动或犹豫的方法和装置。 旋转辊在双面清洁过程中向半导体晶片施加旋转运动。 在其外边缘处的旋转辊和晶片接触以及它们的外边缘之间的摩擦导致晶片旋转。 辊具有带有凹槽的外边缘。 晶片边缘被夹在凹槽内以产生足够的摩擦力，当施加清洁溶液时，晶片不会滑动并继续旋转。 此外，凹槽允许辊足够地夹紧晶片，使得当辊到达晶片的平面时，辊可以重新获得晶片的半径而不会犹豫。

公开(公告)号：US6003185A

公开(公告)日：1999-12-21

申请号：US691450

申请日：1996-08-01

申请人： Albert M. Saenz ,  David L. Thrasher ,  Wilbur C. Krusell ,  William G. Drapak

发明人： Albert M. Saenz ,  David L. Thrasher ,  Wilbur C. Krusell ,  William G. Drapak

IPC分类号： A47L15/42 ,  B08B11/02 ,  H01L21/00 ,  H01L21/687

CPC分类号： H01L21/68728 ,  A47L15/42 ,  B08B11/02 ,  H01L21/67046

摘要： A method and apparatus for rotating wafers in a scrubber, wherein both sides of a wafer are scrubbed without slipping or hesitating. A rotating roller imparts rotary motion to a semiconductor wafer during a cleaning process wherein both sides of a wafer are scrubbed. The rotating roller and wafer contact at their outer edges and the friction between their outer edges causes the wafer to rotate. The roller has an outer edge with a groove. The wafer edge is pinched inside the groove to create enough friction that when cleaning solutions are applied the wafer does not slip and continues to rotate. Also, the groove allows the roller to pinch the wafer just enough so that when the roller reaches the flat of the wafer, the roller may regain the radius of the wafer without hesitating.

摘要翻译： 一种用于在洗涤器中旋转晶片的方法和装置，其中晶片的两侧被擦洗而没有滑动或犹豫。 在清洁工艺期间，旋转辊将旋转运动提供给半导体晶片，其中清洗晶片的两侧。 在其外边缘处的旋转辊和晶片接触以及它们的外边缘之间的摩擦导致晶片旋转。 辊具有带有凹槽的外边缘。 晶片边缘被夹在凹槽内以产生足够的摩擦力，当施加清洁溶液时，晶片不会滑动并继续旋转。 此外，凹槽允许辊足够地夹紧晶片，使得当辊到达晶片的平面时，辊可以重新获得晶片的半径而不会犹豫。