Light emitting diode system packages
    1.
    发明申请
    Light emitting diode system packages 审中-公开
    发光二极管系统封装

    公开(公告)号:US20060044806A1

    公开(公告)日:2006-03-02

    申请号:US10925477

    申请日:2004-08-25

    IPC分类号: F21V5/04

    摘要: Light emitting diode systems disclosed include semiconductor diodes arranged in cooperation with electrical contacts, mounting provisions, and optical couplings; where the optical couplings include at least a Fresnel lens. A Fresnel lens is further coupled to additional optical elements such as a concave or ‘negative’ lens and still further to a reflector operating via principles of total internal reflection. Both the concave lens and the reflector are aspherical in preferred versions. A cover element of single piece plastic may be formed in a molding process whereby all three of these optical elements, i.e. the Fresnel lens, the negative lens and the reflector, are formed into the single plastic piece. Further, the plastic piece may be arranged to also accommodate auxiliary systems such as alignment indexing and fastening means as well as interlocking peripheral configurations.

    摘要翻译: 公开的发光二极管系统包括与电触点,安装配置和光耦合配合布置的半导体二极管; 其中光耦合器至少包括菲涅尔透镜。 菲涅耳透镜进一步耦合到诸如凹面或“负”透镜的附加光学元件,并且还通过全内反射原理进行操作。 凹透镜和反射镜在优选的形式中都是非球面的。 可以在模制过程中形成单件塑料的盖元件,由此将这些光学元件中的所有三个,即菲涅耳透镜,负透镜和反射器形成为单个塑料件。 此外,塑料片可以布置成还适应辅助系统,例如对准分度和紧固装置以及互锁的外围构造。