LIGHT-EMITTING DEVICE
    4.
    发明公开

    公开(公告)号:US20240339573A1

    公开(公告)日:2024-10-10

    申请号:US18745364

    申请日:2024-06-17

    Inventor: Norimasa YOSHIDA

    CPC classification number: H01L33/58 H01L25/0753 H01L25/167 H01L27/156

    Abstract: A light-emitting device includes: an array light source comprising a plurality of light-emitting units arranged in an array pattern, each light-emitting unit including a light-emitting surface, wherein the light-emitting surfaces of adjacent ones of the light-emitting units are located at a first light-emitting surface interval; a first lens configured to cause light emitted by the array light source to irradiate a region to be irradiated; a movement mechanism configured to cause the first lens and the array light source to move relative to each other along a direction intersecting an optical axis of the first lens; and a control unit comprising one or more electrical circuits or one or more central processing units, the control unit configured to: control light emission of each of the plurality of light-emitting units in a predetermined period, and control operation of the movement mechanism.

    METHOD OF PRODUCING MICRO-LED PANEL
    5.
    发明公开

    公开(公告)号:US20240339440A1

    公开(公告)日:2024-10-10

    申请号:US18603263

    申请日:2024-03-13

    CPC classification number: H01L25/0753 H01L33/58 H01L2933/0058

    Abstract: Provided is a method of producing a micro-LED panel that can produce a micro-LED panel with excellent display quality by reducing misalignment of micro-LED chips and can achieve an increased yield. The method of producing a micro-LED panel includes: producing a micro-LED chip including a micro-LED, a first contact electrode, and a light blocking component; producing an array substrate including a switching element, a second contact electrode, and an insulating film; and placing the micro-LED chip on the array substrate. The light blocking component includes a bump with an inclined surface. The insulating film includes a dent with an inclined surface. The placing of the micro-LED chip includes electrically connecting the first contact electrode to the second contact electrode by making the bump of the light blocking component opposite to the dent of the insulating film.

    Light-emitting element lamp and method for manufacturing the same

    公开(公告)号:US12107199B2

    公开(公告)日:2024-10-01

    申请号:US17597396

    申请日:2020-07-10

    CPC classification number: H01L33/58 G02B7/021 G02B7/027 G02B27/0916 F21V19/001

    Abstract: Provided is a light-emitting element lamp capable of increasing a light extraction efficiency and its manufacturing method. The light-emitting element lamp according to the present invention includes: a light-emitting element having a semiconductor layer provided on a substrate; a first lens of spherical segment shape provided by protruding from a surface on the opposite side of the semiconductor layer of the substrate and having a spherical cap that includes a bottom surface consisting of an attaching surface to the surface and a protruding surface from the surface and a radius of curvature R1; and a second lens attached to the side of the light-emitting element and the protruding surface of the first lens, in which the second lens has a concave curve from a peripheral side of the bottom surface of the first lens to the semiconductor layer side on the side of the light-emitting element.

    SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH VERTICAL LIGHT EMISSION

    公开(公告)号:US20240322104A1

    公开(公告)日:2024-09-26

    申请号:US18679943

    申请日:2024-05-31

    Abstract: A micro multi-color LED device includes two or more LED structures for emitting a range of colors. The two or more LED structures are vertically stacked to combine light from the two or more LED structures. Light from the micro multi-color LED device is emitted substantially vertically upward through each of the LED structures. In some embodiments, each LED structure is connected to a pixel driver and/or a common electrode. The LED structures are bonded together through bonding layers. In some embodiments, planarization layers enclose each of the LED structures or the micro multi-color LED device. In some embodiments, one or more of reflective layers, refractive layers, micro-lenses, spacers, and reflective cup structures are implemented in the device to improve the LED emission efficiency. A display panel comprising an array of the micro tri-color LED devices has a high resolution and a high illumination brightness.

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