IC layout parsing for multiple masks
    2.
    发明授权
    IC layout parsing for multiple masks 有权
    IC布局解析多个掩码

    公开(公告)号:US08713483B2

    公开(公告)日:2014-04-29

    申请号:US11758510

    申请日:2007-06-05

    CPC classification number: G03F1/70 G03F1/26

    Abstract: A method for separating features in a target layout into different mask layouts for use in a photolithographic process. Features of a target layer are searched for features having a predefined shape. In one embodiment, portions of the feature having the predefined shape divided into two or more sub-features and at least one sub-feature are not considered when separating the features into two or more mask layouts. In another embodiment, features having a predefined shape are cut to form two or more sub-features and all features and sub-features are considered when separating the features of the target layout into the two or more mask layouts.

    Abstract translation: 用于将目标布局中的特征分离成用于光刻工艺的不同掩模布局的方法。 搜索具有预定义形状的特征的目标层的特征。 在一个实施例中,当将特征分成两个或更多个掩模布局时,不考虑具有划分为两个或更多个子特征和至少一个子特征的预定形状的特征的部分。 在另一个实施例中,切割具有预定形状的特征以形成两个或更多个子特征,并且当将目标布局的特征分成两个或更多个掩模布局时,考虑所有特征和子特征。

    IC LAYOUT PARSING FOR MULTIPLE MASKS
    3.
    发明申请
    IC LAYOUT PARSING FOR MULTIPLE MASKS 有权
    用于多个屏蔽的IC布局分配

    公开(公告)号:US20080307381A1

    公开(公告)日:2008-12-11

    申请号:US11758510

    申请日:2007-06-05

    CPC classification number: G03F1/70 G03F1/26

    Abstract: A method for separating features in a target layout into different mask layouts for use in a photolithographic process. Features of a target layer are searched for features having a predefined shape. In one embodiment, portions of the feature having the predefined shape divided into two or more sub-features and at least one sub-feature are not considered when separating the features into two or more mask layouts. In another embodiment, features having a predefined shape are cut to form two or more sub-features and all features and sub-features are considered when separating the features of the target layout into the two or more mask layouts.

    Abstract translation: 用于将目标布局中的特征分离成用于光刻工艺的不同掩模布局的方法。 搜索具有预定义形状的特征的目标层的特征。 在一个实施例中,当将特征分成两个或更多个掩模布局时,不考虑具有划分为两个或更多个子特征和至少一个子特征的预定形状的特征的部分。 在另一个实施例中,切割具有预定形状的特征以形成两个或更多个子特征,并且当将目标布局的特征分成两个或更多个掩模布局时,考虑所有特征和子特征。

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