公开(公告)号：US20080064185A1

公开(公告)日：2008-03-13

申请号：US11926668

申请日：2007-10-29

申请人： Allan Abrams ,  Donald Brouillette ,  Joseph Danaher ,  Timothy Krywanczyk ,  Rene Lamothe ,  Ivan Stone ,  Matthew Whalen

发明人： Allan Abrams ,  Donald Brouillette ,  Joseph Danaher ,  Timothy Krywanczyk ,  Rene Lamothe ,  Ivan Stone ,  Matthew Whalen

IPC分类号： H01L21/30

CPC分类号： H01L21/3081 ,  H01L21/304 ,  H01L2221/6834

摘要： There is provided a method for making a wafer comprising the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region adjacent to the first peripheral region. The method includes applying a fluid to the first surface and the first peripheral region of the at least one side edge and removing the opposite second surface and the second peripheral region of the at least one side edge to form a third surface. A semiconductor chip made from the method for making the wafer is also provided.

摘要翻译： 提供了一种用于制造晶片的方法，包括以下步骤：提供具有第一表面，相对的第二表面和限定衬底的厚度的至少一个侧边缘的衬底，所述至少一个侧边缘具有第一周边区域 以及与第一周边区域相邻的第二周边区域。 该方法包括将流体施加到至少一个侧边缘的第一表面和第一周边区域，并且移除至少一个侧边缘的相对的第二表面和第二周边区域以形成第三表面。 还提供了由制造晶片的方法制成的半导体芯片。

公开(公告)号：US20050202678A1

公开(公告)日：2005-09-15

申请号：US11117122

申请日：2005-04-28

申请人： Allan Abrams ,  Donald Brouillette ,  Joseph Danaher ,  Timothy Krywanczyk ,  Rene Lamothe ,  Ivan Stone ,  Matthew Whalen

发明人： Allan Abrams ,  Donald Brouillette ,  Joseph Danaher ,  Timothy Krywanczyk ,  Rene Lamothe ,  Ivan Stone ,  Matthew Whalen

IPC分类号： H01L21/301 ,  H01L21/304 ,  H01L21/461 ,  H01L21/302 ,  H01L21/78

CPC分类号： H01L21/3081 ,  H01L21/304 ,  H01L2221/6834

摘要： There is provided a method for making a wafer comprising the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region adjacent to the first peripheral region. The method includes applying a fluid to the first surface and the first peripheral region of the at least one side edge and removing the opposite second surface and the second peripheral region of the at least one side edge to form a third surface. A semiconductor chip made from the method for making the wafer is also provided.

摘要翻译： 提供了一种用于制造晶片的方法，包括以下步骤：提供具有第一表面，相对的第二表面和限定衬底的厚度的至少一个侧边缘的衬底，所述至少一个侧边缘具有第一周边区域 以及与第一周边区域相邻的第二周边区域。 该方法包括将流体施加到至少一个侧边缘的第一表面和第一周边区域，并且移除至少一个侧边缘的相对的第二表面和第二周边区域以形成第三表面。 还提供了由制造晶片的方法制成的半导体芯片。

公开(公告)号：US20070111186A1

公开(公告)日：2007-05-17

申请号：US11340780

申请日：2006-01-26

申请人： William Newman ,  Marie Bostrom ,  Allan Abrams ,  Joshua Abrams

发明人： William Newman ,  Marie Bostrom ,  Allan Abrams ,  Joshua Abrams

IPC分类号： G09B3/00

CPC分类号： G09B19/0007 ,  G09B19/0023

摘要： A system for teaching a user to identify a family of items is provided including a matching symbol having an identifiable family indicator and a teaching symbol indicating a matching of the family indicator to the family of items. The teaching further illustrates compatibility of the family of items with the family indicator.

摘要翻译： 提供了一种用于教导用户识别物品系列的系统，包括具有可识别家庭指示符的匹配符号和指示家庭指示符与家庭家庭匹配的教学符号。 该教学进一步说明了家庭家庭与家庭指标的兼容性。