公开(公告)号：US20070094977A1

公开(公告)日：2007-05-03

申请号：US11245306

申请日：2005-10-06

申请人： Allan Zuehlsdorf ,  Igor Vinokur

发明人： Allan Zuehlsdorf ,  Igor Vinokur

IPC分类号： E04B9/00

CPC分类号： H04B1/40 ,  H04B15/00 ,  H05K9/0032 ,  Y10T29/49002 ,  Y10T29/4902

摘要： An electromagnetic interference (EMI) shield according to one embodiment generally includes a frame and a cover. The frame includes peripheral walls each having at least one folded portion forming an outer sidewall and an inner sidewall. The cover includes a lid portion and a plurality of edge portions extending downwardly from the lid portion. The shield includes at least one dimple configured to be engagingly received in at least one opening for releasably retaining the cover to the frame.

摘要翻译： 根据一个实施例的电磁干扰（EMI）屏蔽通常包括框架和盖。 框架包括各自具有形成外侧壁和内侧壁的至少一个折叠部分的周壁。 盖子包括盖部分和从盖部分向下延伸的多个边缘部分。 所述护罩包括至少一个凹部，其构造成可啮合地容纳在至少一个开口中，用于可释放地将盖保持在框架上。

公开(公告)号：US07491899B2

公开(公告)日：2009-02-17

申请号：US11245306

申请日：2005-10-06

申请人： Allan Zuehlsdorf ,  Igor Vinokur

发明人： Allan Zuehlsdorf ,  Igor Vinokur

IPC分类号： H01R4/56 ,  H05K9/00

CPC分类号： H04B1/40 ,  H04B15/00 ,  H05K9/0032 ,  Y10T29/49002 ,  Y10T29/4902

摘要： An electromagnetic interference (EMI) shield according to one embodiment generally includes a frame and a cover. The frame includes peripheral walls each having at least one folded portion forming an outer sidewall and an inner sidewall. The cover includes a lid portion and a plurality of edge portions extending downwardly from the lid portion. The shield includes at least one dimple configured to be engagingly received in at least one opening for releasably retaining the cover to the frame.

摘要翻译： 根据一个实施例的电磁干扰（EMI）屏蔽通常包括框架和盖。 框架包括各自具有形成外侧壁和内侧壁的至少一个折叠部分的周壁。 盖子包括盖部分和从盖部分向下延伸的多个边缘部分。 所述护罩包括至少一个凹部，其构造成可啮合地容纳在至少一个开口中，用于可释放地将盖保持在框架上。

公开(公告)号：US20090119903A1

公开(公告)日：2009-05-14

申请号：US12353048

申请日：2009-01-13

申请人： Allan Zuehlsdorf ,  Igor Vinokur

发明人： Allan Zuehlsdorf ,  Igor Vinokur

IPC分类号： B23P17/00

CPC分类号： H04B1/40 ,  H04B15/00 ,  H05K9/0032 ,  Y10T29/49002 ,  Y10T29/4902

摘要： An electromagnetic interference (EMI) shield according to one embodiment generally includes a frame and a cover. The frame includes peripheral walls each having at least one folded portion forming an outer sidewall and an inner sidewall. The cover includes a lid portion and a plurality of edge portions extending downwardly from the lid portion. The shield includes at least one dimple configured to be engagingly received in at least one opening for releasably retaining the cover to the frame.

摘要翻译： 根据一个实施例的电磁干扰（EMI）屏蔽通常包括框架和盖。 框架包括各自具有形成外侧壁和内侧壁的至少一个折叠部分的周壁。 盖子包括盖部分和从盖部分向下延伸的多个边缘部分。 所述护罩包括至少一个凹部，其构造成可啮合地容纳在至少一个开口中，用于可释放地将盖保持在框架上。

公开(公告)号：US07926166B2

公开(公告)日：2011-04-19

申请号：US12353048

申请日：2009-01-13

申请人： Allan Zuehlsdorf ,  Igor Vinokur

发明人： Allan Zuehlsdorf ,  Igor Vinokur

IPC分类号： H01F7/06

CPC分类号： H04B1/40 ,  H04B15/00 ,  H05K9/0032 ,  Y10T29/49002 ,  Y10T29/4902

摘要： An electromagnetic interference (EMI) shield according to one embodiment generally includes a frame and a cover. The frame includes peripheral walls each having at least one folded portion forming an outer sidewall and an inner sidewall. The cover includes a lid portion and a plurality of edge portions extending downwardly from the lid portion. The shield includes at least one dimple configured to be engagingly received in at least one opening for releasably retaining the cover to the frame.

摘要翻译： 根据一个实施例的电磁干扰（EMI）屏蔽通常包括框架和盖。 框架包括各自具有形成外侧壁和内侧壁的至少一个折叠部分的周壁。 盖子包括盖部分和从盖部分向下延伸的多个边缘部分。 所述护罩包括至少一个凹部，其构造成可啮合地容纳在至少一个开口中，用于可释放地将盖保持在框架上。

公开(公告)号：US20080080160A1

公开(公告)日：2008-04-03

申请号：US11838801

申请日：2007-08-14

申请人： Gerald English ,  Allan Zuehlsdorf ,  Peter Doyle ,  Aleksey Pirkhalo

发明人： Gerald English ,  Allan Zuehlsdorf ,  Peter Doyle ,  Aleksey Pirkhalo

IPC分类号： H05K9/00

CPC分类号： H05K9/0032

摘要： In one exemplary embodiment, an EMI shield assembly generally includes a frame adapted to be secured to a mounting surface, a cover attachable to the frame, and at least one resilient electrically-conductive member disposed on an inner side of the cover. The at least one resilient electrically-conductive member may be configured to contact at least one electrically-conductive surface on the mounting surface, to establish a current-conducting path from the electrically-conductive surface to the cover when the cover is attached to the frame. The at least one resilient electrically-conductive member may be configured to be compressed against at least one electrically-conductive surface on the mounting surface when the cover is attached to the frame. This compression may help provide an effective amount of contact pressure against the at least one electrically-conductive surface to establish a predetermined or desirable level of electrical conductivity.

摘要翻译： 在一个示例性实施例中，EMI屏蔽组件通常包括适于固定到安装表面的框架，可附接到框架的盖以及设置在盖的内侧上的至少一个弹性导电构件。 所述至少一个弹性导电构件可以构造成接触安装表面上的至少一个导电表面，以便当盖附接到框架时建立从导电表面到盖的导电路径 。 所述至少一个弹性导电构件可构造成当所述盖附接到所述框架时抵靠所述安装表面上的至少一个导电表面被压缩。 该压缩可以帮助提供有效量的针对至少一个导电表面的接触压力，以建立预定或期望的电导率水平。

公开(公告)号：US20070210082A1

公开(公告)日：2007-09-13

申请号：US11440618

申请日：2006-05-25

申请人： Gerald English ,  Allan Zuehlsdorf

发明人： Gerald English ,  Allan Zuehlsdorf

IPC分类号： B65D6/28

CPC分类号： H05K9/0032

摘要： According to various aspects of the present disclosure, exemplary embodiments are of assemblies capable of providing board level EMI shielding and heat dissipation of one or more electrical components. Other aspects relate to components of such assemblies. Further aspects relate to methods of using EMI shielding and thermal management assemblies. Additional aspects relate to methods of making EMI shielding and thermal management assemblies, and methods of making the components thereof.

摘要翻译： 根据本公开的各个方面，示例性实施例是能够提供一个或多个电气部件的板级EMI屏蔽和散热的组件。 其他方面涉及这种组件的部件。 其他方面涉及使用EMI屏蔽和热管理组件的方法。 另外的方面涉及制造EMI屏蔽和热管理组件的方法，以及制造其组件的方法。

公开(公告)号：US20070139904A1

公开(公告)日：2007-06-21

申请号：US11514071

申请日：2006-08-31

申请人： Gerald English ,  Allan Zuehlsdorf

发明人： Gerald English ,  Allan Zuehlsdorf

IPC分类号： H05K9/00

CPC分类号： H05K9/0032

摘要： An EMI shielding assembly generally includes a frame attachable to the board's first side, and first and second covers configured to be respectively positioned on generally opposite sides of the board. The first cover is configured to cover at least one opening along an upper portion of the frame. The second cover is attachable to the first cover with the first and second covers respectively positioned along the board's generally opposite first and second sides. Accordingly, the assembly is operable for shielding one or more electrical components on the board's first side that are within a first interior defined by the frame's walls, first cover, and at least a portion of the board's first side, and one or more electrical components on the board's second side that are within a second interior defined by the second cover and at least a portion of the board's second side.

摘要翻译： EMI屏蔽组件通常包括可附接到板的第一侧的框架，以及构造成分别位于板的大致相对侧上的第一和第二盖。 第一盖构造成沿着框架的上部覆盖至少一个开口。 第二盖可附接到第一盖，其中第一和第二盖分别沿着板的大致相对的第一和第二侧定位。 因此，组件可操作用于屏蔽板的第一侧上的一个或多个电气部件，该电气元件位于由框架的壁，第一盖和板的第一侧的至少一部分以及一个或多个电气部件 在板的第二侧上，其位于由第二盖限定的第二内部和板的第二侧的至少一部分中。