公开(公告)号：US4044937A

公开(公告)日：1977-08-30

申请号：US624632

申请日：1975-10-21

申请人： Thomas Hill ,  Ambrose Kennedy ,  Walter Grey Thomson

发明人： Thomas Hill ,  Ambrose Kennedy ,  Walter Grey Thomson

IPC分类号： B28D5/00 ,  H01L21/301 ,  B26F3/00

CPC分类号： B28D5/0029 ,  Y10T225/325 ,  Y10T225/329

摘要： An apparatus is disclosed for breaking apart, pre-scribed chips in a semiconductor wafer. The apparatus comprises a plurality of ball elements having a diameter substantially smaller than the diameter of the wafer, mounted in a support beneath the contacting plane. Located above and in spaced coaxial relationship with the ball elements is a plurality of purging gas/vacuum ports. The pre-scribed semiconductor wafer is mounted on an elastic film by means of an adhesive coating thereon.The wafer, so mounted, is attached to a sliding carriage disposed so as to permit the wafer to freely move within said contacting plane. When the wafer is disposed in said contacting plane, the support for said ball element is raised into contact with the wafer. The relatively small radius of curvature of the ball elements induces a relatively large bending moment and consequently breaks the chip in the wafer along the pre-scribed lines. Omni-directional motion of the carriage causes all portions of the wafer to be brought in to contact with the ball elements, thereby inducing total separation along all pre-scribed lines. The purging gas/vacuum ports located respectively above each ball element, serve to remove debris from the broken regions of the wafer.

摘要翻译： 公开了一种用于在半导体晶片中分离，预先划线的芯片的装置。 该装置包括多个球形元件，其直径基本上小于晶片的直径，安装在接触平面下方的支撑件中。 位于与球元件之间并与之隔开的同轴关系是多个吹扫气体/真空端口。 预先划线的半导体晶片通过其上的粘合剂涂层安装在弹性膜上。