公开(公告)号：US20170365519A1

公开(公告)日：2017-12-21

申请号：US15628254

申请日：2017-06-20

申请人： DISCO CORPORATION

发明人： Karl Priewasser ,  Hitoshi Hoshino

IPC分类号： H01L21/8222 ,  B28D5/00 ,  B23K26/364 ,  B23K26/08 ,  H01L27/01 ,  H01L21/76

CPC分类号： H01L21/8222 ,  B23K26/0006 ,  B23K26/0622 ,  B23K26/08 ,  B23K26/083 ,  B23K26/359 ,  B23K26/364 ,  B23K26/402 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/52 ,  B28D5/0011 ,  B28D5/0029 ,  B28D5/0082 ,  H01L21/76 ,  H01L27/01

摘要： A wafer has a device area on one side with a plurality of devices partitioned by a plurality of division lines. Either side of the wafer is attached to an adhesive tape supported by a first annular frame. A modified region is formed in the wafer along the division lines by a laser. The wafer is placed on a support member whose outer diameter is smaller than an inner diameter of the first annular frame. After applying the laser beam, the adhesive tape is expanded thereby dividing the wafer along the division lines. A second annular frame is attached to a portion of the expanded adhesive tape. An inner diameter of the second annular frame is smaller than the outer diameter of the support member and smaller than the inner diameter of the first annular frame.

公开(公告)号：US20150321941A1

公开(公告)日：2015-11-12

申请号：US14801279

申请日：2015-07-16

申请人： Corning Incorporated

发明人： Keith Mitchell Hill ,  Ritesh Satish Lakhkar ,  Mark Thomas Massaro ,  Liming Wang ,  Naiyue Zhou

IPC分类号： C03B33/02 ,  C03B33/033 ,  C03B33/023 ,  B28D5/00

CPC分类号： C03B33/0207 ,  B28D5/0029 ,  C03B33/0235 ,  C03B33/033 ,  Y02P40/57 ,  Y10T225/12 ,  Y10T225/329 ,  Y10T225/371

摘要： Methods and apparatuses for separating sheets of brittle material are disclosed. According to one embodiment, a separation apparatus for separating a sheet of brittle material includes a first separation cam positioned adjacent to a sheet conveyance pathway and a second separation cam positioned opposite from and downstream of the first separation cam. The first and second separation cams may be rotated such that the contact faces of the separation cams periodically extend across a centerline of the conveyance pathway. Rotation of the first and second separation cams may be synchronized such that at least the portion of the contact face of the first separation cam and at least the portion of the contact face of the second separation cam periodically extend across the centerline of the conveyance pathway at a separation time and periodically do not extend across the centerline of the conveyance pathway at a non-separation time.

摘要翻译： 公开了用于分离脆性材料片的方法和装置。 根据一个实施例，用于分离脆性材料片的分离装置包括邻近片材传送路径定位的第一分离凸轮和与第一分离凸轮相对和下游定位的第二分离凸轮。 第一和第二分离凸轮可以旋转，使得分离凸轮的接触面周期性地延伸越过输送路径的中心线。 第一和第二分离凸轮的旋转可以是同步的，使得第一分离凸轮的接触面的至少部分和第二分离凸轮的接触面的至少部分周期性延伸穿过输送路径的中心线 分离时间并且在非分离时间周期性地不延伸穿过输送路径的中心线。

公开(公告)号：US6098861A

公开(公告)日：2000-08-08

申请号：US63144

申请日：1998-04-20

申请人： Eiji Inoue

发明人： Eiji Inoue

IPC分类号： B26F3/04 ,  B26F3/00 ,  B28D5/00 ,  H01C17/06 ,  H05K1/03 ,  H05K3/00

CPC分类号： B28D5/0029 ,  B26F3/002 ,  H05K1/0306 ,  H05K3/0052 ,  Y10T225/30 ,  Y10T225/325

摘要： A breaking apparatus for a ceramic board includes a feeding belt having plural rack-shaped tooth rows each comprising many teeth formed on the lower surface of the feeding belt, and a break pulley having plural pinion-shaped tooth rows each comprising many teeth which are engaged with the respective teeth in the tooth rows and provided on the peripheral surface of the break pulley, the engagement position between each tooth in the plural tooth rows of the feeding belt and each tooth of the plural tooth rows of the break pulley being positionally arranged in an offset manner every row.

摘要翻译： 用于陶瓷板的断开装置包括：馈送带，其具有多个齿条齿排，每个齿形齿列包括形成在馈送带的下表面上的许多齿;以及断裂带轮，具有多个小齿轮齿排，每个小齿轮齿排均包括许多齿， 在齿排中的各个齿设置在断裂带轮的周面上，馈送带的多个齿排中的每个齿之间的接合位置和断开带轮的多个齿排的每个齿的位置上布置在 每行偏移方式。

公开(公告)号：US3206088A

公开(公告)日：1965-09-14

申请号：US23687262

申请日：1962-11-13

申请人： SIEMENS AG

发明人： AUGUST MEYER ,  WERNER STEGER

IPC分类号： B28D5/00 ,  H01L21/00 ,  H01L21/301 ,  H01L21/304

CPC分类号： H01L21/67092 ,  B28D5/0029 ,  H01L21/3043 ,  Y10T29/4979 ,  Y10T156/1052 ,  Y10T225/12 ,  Y10T225/329 ,  Y10T225/371

公开(公告)号：US20100065599A1

公开(公告)日：2010-03-18

申请号：US11915894

申请日：2006-05-26

申请人： Yuki Nishisaka ,  Kenji Otoda ,  Shuichi Inoue ,  Toru Kumagai

发明人： Yuki Nishisaka ,  Kenji Otoda ,  Shuichi Inoue ,  Toru Kumagai

IPC分类号： B26F3/00 ,  B26D3/08 ,  B31B1/25

CPC分类号： C03B33/033 ,  B28D1/222 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0029 ,  B65G2249/04 ,  Y02P40/57 ,  Y10T83/0333 ,  Y10T225/30 ,  Y10T225/325

摘要： A brittle material substrate cutting method and cutting apparatus are provided, which prevent cut faces of a brittle material substrate from contacting each other after the cutting in a break step of continuously cutting the brittle material substrate, so that a damage or contamination on the brittle material substrate due to the contact can be prevented. A brittle material substrate cutting apparatus includes: a cutting section (112, 122) for applying a pressing force in a vicinity of a scribe line S formed on a substrate G and cutting the pressed portion of the substrate G; and a holding section moving parallel to the scribe line S while holding the cutting section. The brittle material substrate cutting apparatus continuously cuts the substrate G along the scribe line S. The brittle material substrate cutting apparatus further includes: a cut-face separating section (113, 123), provided in the holding section, for holding and pressing at least one part of cut substrate portions of the substrate G, wherein the cut substrate portions are generated as a result of the cutting and they oppose each other, and moving cut faces of the cut substrate portions approximately parallel to a main face of the substrate G and in directions to separate the cut faces from each other.

摘要翻译： 提供了一种脆性材料基板切割方法和切割装置，其在连续切割脆性材料基板的断裂步骤中，在脆性材料基板的切割面彼此接触之后彼此接触，从而对脆性材料造成损坏或污染 可以防止由于接触引起的基板。 脆性材料基板切割装置包括：切割部分，用于在形成在基板G上的划线S附近施加按压力，并切割基板G的按压部分; 以及在保持切割部的同时平行于划线S移动的保持部。 脆性材料基板切断装置沿着切割线S连续地切断基板G.脆性材料基板切断装置还具备：切割面分离部（113,123），设置在保持部中，用于至少保持和按压 衬底G的切割衬底部分的一部分，其中由于切割而产生切割的衬底部分并且它们彼此相对，并且将切割的衬底部分的切割面大致平行于衬底G的主面移动;以及 在将切割面彼此分开的方向上。

公开(公告)号：US07622328B2

公开(公告)日：2009-11-24

申请号：US11529137

申请日：2006-09-28

申请人： Takatoshi Masuda

发明人： Takatoshi Masuda

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/67132 ,  B28D5/0029 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834

摘要： A separation groove having a depth corresponding to a finished thickness of a semiconductor chip is formed in a boundary between a device region and an outer peripheral surplus region of a wafer, a protection tape whose adhesion is deteriorated by irradiation of ultraviolet rays is adhered on a surface, a portion of a back surface corresponding to the device region is ground, a thick reinforcing portion is formed on a portion corresponding to the outer peripheral surplus region. Next, only a portion of the protection tape adhered on the reinforcing portion is irradiated with ultraviolet rays, the reinforcing portion 8 is separated from the protection tape and is separated from the device region. A dicing frame is mounted on the back surface of the wafer having only the device region through a dicing tape, and the wafer is divided into semiconductor chips.

摘要翻译： 在晶片的器件区域和外周剩余区域之间的边界处形成具有对应于半导体芯片的成品厚度的深度的分离槽，通过紫外线的照射使粘合性劣化的保护带粘附在 表面，对应于器件区域的后表面的一部分被研磨，在对应于外周剩余区域的部分上形成厚的加强部分。 接下来，只有一部分粘附在加强部分上的保护带被紫外线照射，加强部分8与保护带分离并与装置区域分离。 切割框架通过切割带安装在仅具有器件区域的晶片的背面上，并且晶片被分成半导体芯片。

公开(公告)号：US20060162173A1

公开(公告)日：2006-07-27

申请号：US11326204

申请日：2006-01-05

申请人： Paul Lindsey

发明人： Paul Lindsey

IPC分类号： B43L13/00 ,  H01L21/78

CPC分类号： H01L21/67092 ,  B26D3/085 ,  B27B5/30 ,  B27B5/32 ,  B28D1/225 ,  B28D5/0029 ,  B28D5/022 ,  B28D7/02 ,  H01L21/78 ,  Y10T83/0333 ,  Y10T83/0341 ,  Y10T83/0385 ,  Y10T83/9372 ,  Y10T83/9403

摘要： Particle removal structure is employed with a scribing tool to remove particles from the surface of a semiconductor wafer being scribed and transport the particles to another location.

摘要翻译： 使用划线工具去除颗粒去除结构，以从被划线的半导体晶片的表面去除颗粒并将颗粒输送到另一位置。

公开(公告)号：US5277952A

公开(公告)日：1994-01-11

申请号：US921938

申请日：1992-07-29

申请人： Edward W. Watras

发明人： Edward W. Watras

IPC分类号： B28D5/00 ,  B32B3/10 ,  B32B17/10 ,  B44F1/04

CPC分类号： B28D5/0029 ,  B32B17/10247 ,  B32B3/10 ,  B44F1/04 ,  Y10T428/162 ,  Y10T428/166 ,  Y10T428/24471

摘要： Construction and method of making a decorative cracked glass laminate in tile, panel, sheet, plate, veneer or in situ form. It comprises three layers laminated together, an inner backing layer, a substantially light-transparent outer layer, and a decoratively cracked glass intermediate layer sandwiched between the inner and outer layers. The intermediate layer, preferably a mirror, is made of tempered glass and the outer layer is made of annealed glass. The laminate is made by laminating the inner and outer layers to the intermediate layer while it is in uncracked condition, and then causing it to crack in situ as by cutting into an exposed edge. Alternatively, the two glass layers may be laminated together and then laid in a backing material such as plastics which then forms the backing layer of the two-glass laminate.

摘要翻译： 瓦片，面板，板，板，单板或原位形式的装饰性裂纹玻璃层压板的制造和方法。 它包括层压在一起的三层，内背衬层，基本上透明的外层，以及夹在内层和外层之间的装饰性裂纹玻璃中间层。 中间层，优选反射镜由钢化玻璃制成，外层由退火玻璃制成。 层压体通过将内层和外层层压到中间层而不破裂的状态下制成，然后通过切割成暴露的边缘使其原位裂开。 或者，两个玻璃层可以层压在一起，然后铺设在诸如塑料的背衬材料中，然后形成双层玻璃层压板的背衬层。

公开(公告)号：US3970819A

公开(公告)日：1976-07-20

申请号：US526988

申请日：1974-11-25

申请人： Gerald Alan Gates ,  William John Ryan

发明人： Gerald Alan Gates ,  William John Ryan

IPC分类号： B23K26/00 ,  B23K26/40 ,  B28D5/00 ,  H01L21/268 ,  H01L21/301

CPC分类号： H01L21/268 ,  B23K26/40 ,  B28D5/0011 ,  B28D5/0029 ,  B23K2201/40 ,  B23K2203/50 ,  H01L2224/13 ,  Y10T225/12

摘要： A wafer of semiconductor material having a plurality of units defined on its face is subdivided by treating the wafer, on its back or reverse side, in the kerf regions between the units, where division of the units is desired, such that the material of the wafer in the treated kerf regions is converted to a material having a breaking strength lower than the breaking strength of the semiconductor material.

摘要翻译： 在其表面上具有多个单元的半导体材料晶片通过在其单元之间的切割区域中在其背面或反面上处理晶片来细分，其中希望单元的划分，使得 经处理的切口区域中的晶片转变为具有低于半导体材料的断裂强度的断裂强度的材料。

公开(公告)号：US3626492A

公开(公告)日：1971-12-07

申请号：US3626492D

申请日：1969-11-25

申请人： PHILIPS CORP

发明人： HOBBS KENNETH

IPC分类号： B28D5/00 ,  H01L21/301 ,  B26F3/00

CPC分类号： H01L21/67092 ,  B28D5/0029 ,  Y10S100/917 ,  Y10T225/325 ,  Y10T225/371

摘要： A roller arrangement suitable for fracturing into dice semiconductor wafers is described comprising an unpivoted working roller of 2 mm. diameter and two backing rollers of 5 mm. diameter. The working and backing rollers are of magnetic material and the working roller is held against the backing rollers using a magnet. Such a roller arrangement is satisfactory when the surface area of the dice is only 350 microns by 350 microns.