Top or bottom part for a module chassis
    1.
    发明申请
    Top or bottom part for a module chassis 审中-公开
    模块底盘的顶部或底部

    公开(公告)号:US20060133054A1

    公开(公告)日:2006-06-22

    申请号:US10757966

    申请日:2004-01-15

    IPC分类号: H05K7/18 H05K7/14

    CPC分类号: H05K7/1418 H05K7/1425

    摘要: A top or bottom part made of sheet metal for a module chassis has a surrounding frame and guide rails that are positioned between the front and rear frame strip and aligned in the direction of insertion for the mounting of the circuit board of a plug-in module. The guide rails are U-shaped in cross section and include a bottom and two sidewalls. The sidewalls of the guide rails have at least one lateral void. The voids can be located on both sidewalls of the guide rail and can be opposite each other in pairs. The voids of the sidewalls correspond with at least one contact area at the lower edge of the circuit board.

    摘要翻译: 用于模块底盘的由金属板制成的顶部或底部具有定位在前框架带和后框架带之间并且在插入方向上对准以用于安装插入式模块的电路板的周围框架和导轨 。 导轨横截面为U形,包括底部和两个侧壁。 导轨的侧壁具有至少一个侧向空隙。 空隙可以位于导轨的两个侧壁上并且可以成对地相对。 侧壁的空隙对应于电路板的下边缘处的至少一个接触区域。