公开(公告)号：US5465217A

公开(公告)日：1995-11-07

申请号：US106852

申请日：1993-08-16

申请人： Wai-Yeung Yip ,  Arijit Chandra ,  Chi-Taou Tsai

发明人： Wai-Yeung Yip ,  Arijit Chandra ,  Chi-Taou Tsai

IPC分类号： G06F17/50 ,  H01L23/498 ,  H01L23/48

CPC分类号： G06F17/5068 ,  H01L23/49838 ,  H01L2924/0002

摘要： A method for automated artwork building which comprises determining a desired die pad pitch, assigning inner lead bonding positions for each lead based on the average die pitch. The desired outer lead bonding position is then determined for each lead. The allowable range of fan in and fan out angles for each lead is computed according to design and manufacturing constraints. An electrical cost function is formulated based on signal lead crosstalk and ground lead simultaneous switching noise. Each lead is then routed. The routing is repeated for each lead for each allowable combination of fan in and fan out angles. Finally the optimal routing is selected based on electrical characteristics.

摘要翻译： 一种用于自动化图形构建的方法，包括确定期望的管芯焊盘间距，基于平均管芯间距为每个引线分配内引线接合位置。 然后为每个引线确定所需的外部引线键合位置。 根据设计和制造限制计算每个引线的风扇进风扇和风扇角度的允许范围。 基于信号引线串扰和接地引线同时开关噪声来制定电气成本函数。 然后每个引线被路由。 对于每个允许的风扇和扇出角度的组合，每个引线重复布线。 最后，根据电气特性选择最优路由。

公开(公告)号：US5694344A

公开(公告)日：1997-12-02

申请号：US491195

申请日：1995-06-15

申请人： Wai-Yeung Yip ,  Arijit Chandra

发明人： Wai-Yeung Yip ,  Arijit Chandra

IPC分类号： G06F17/50

CPC分类号： G06F17/5036 ,  G06F2217/40

摘要： A method of electrically modeling a semiconductor package is provided. The method reduces computation time for mutual inductance calculations between interconnect lines of the semiconductor package. Only interconnect within a predetermined distance of an interconnect line being modeled is calculated for mutual inductance. The predetermined distance is selected such that any interconnect line greater than the predetermined distance away from the interconnect line being modeled produces a negligible or small mutual inductance. This greatly reduces the number of calculations for semiconductor packages having a large number of interconnect lines. Each interconnect line modeled is broken into segments for calculating mutual inductance. An algorithm is used that calculates the mutual inductance between a pair of arbitrarily oriented straight line metal segments. The algorithm requires a single integration which significantly reduces computation time when compared with systems solving Maxwell's equation in three dimensions.

摘要翻译： 提供了一种对半导体封装进行电气建模的方法。 该方法减少了半导体封装的互连线之间的互感计算的计算时间。 对于互感，仅计算被建模的互连线的预定距离内的互连。 选择预定距离使得大于距建模的互连线的预定距离的任何互连线产生可忽略或小的互感。 这大大减少了具有大量互连线的半导体封装的计算次数。 建模的每个互连线被分成用于计算互感的段。 使用一种计算一对任意取向的直线金属片段之间的互感的算法。 与三维解决麦克斯韦方程的系统相比，该算法需要单次集成，显着减少了计算时间。