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1.发明授权Method for contactless testing of conducting paths in a substrate using photon-assisted tunneling 失效使用光子辅助隧道对基板中导电路径进行非接触测试的方法
公开(公告)号：US4999577A
公开(公告)日：1991-03-12
申请号：US366572
申请日：1989-06-15
IPC分类号： H01L21/66 , G01N23/225 , G01R31/02 , G01R31/308 , H05K3/00
CPC分类号： G01R31/308
摘要： For testing the integrity of conducting lines on or in a substrate, the following steps are executed: (I) Selected pads are irradiated by a focused optical beam so that they are positively charged due to photon-assisted tunneling of electrons from those pads. The charges propagate through existing conductors so that all selected pads and all pads connected to them assume a specific voltage. (II) The whole surface is irradiated by a flooding optical beam. Photon-assisted tunneling of electrons will now occur from those pads which were not charged previously. (III) The tunneling electrons excite an electroluminescent layer whose illumination reveals the spatial distribution of uncharged pads. This method is performed in air under atmospheric conditions and allows completely contactless testing of circuitry to detect line interruptions as well as shortcuts between separate lines. It is suited for surface lines, buried lines and for via connections.
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2.发明授权Method for investigating surfaces at nanometer and picosecond resolution and laser-sampled scanning tunneling microscope for performing said method 失效用于研究纳米和皮秒分辨率的表面的方法和用于执行所述方法的激光取样扫描隧道显微镜
公开(公告)号：US4918309A
公开(公告)日：1990-04-17
申请号：US209403
申请日：1988-06-20
IPC分类号： H01J37/00 , G01B7/34 , G01N23/00 , G01N23/227 , G01N37/00 , G01Q10/00 , G01Q20/00 , G01Q20/02 , G01Q60/10 , G01Q60/12 , G01Q60/16
CPC分类号： G01Q60/12 , B82Y35/00 , G01Q60/16 , Y10S977/861 , Y10S977/868
摘要： For observing material structures and/or dynamic processes at surfaces, the known scanning tunneling microscope (STM) is combined with a photoexcitation process leading to photon-assisted tunneling. Thereby, the very fine spatial resolution of the STM is combined with the picosecond or even femtosecond time resolution of laser pulses. The tunnel tip of a scanning tunneling microscope is positioned at tunnel distance with respect to the surface of the sample to be investigated, with an appropriate potential applied across the gap between the tunnel tip and the sample. The tunneling current is gated by means of at least one pulsed laser beam directed at the tuneling region and/or at the tunnel tip.
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3.发明授权Method for contactless testing of conducting paths in a substrate using photo-assisted tunneling 失效使用光辅助隧道对基板中的导电路径进行非接触测试的方法
公开(公告)号：US4868492A
公开(公告)日：1989-09-19
申请号：US107441
申请日：1987-10-09
IPC分类号： H01L21/66 , G01N23/225 , G01R31/02 , G01R31/308 , H05K3/00
CPC分类号： G01R31/308
摘要： For testing the integrity of conducting lines on or in a substrate, the following steps are executed: (I) Selected pads are irradiated by a focused optical beam so that they are positively charged due to photon-assisted tunneling of electrons from those pads. The charges propagate through existing conductors so that all selected pads and all pads connected to them assume a specific voltage. (II) The whole surface is irradiated by a flooding optical beam. Photon-assisted tunneling of electrons will now occur from those pads which were not charged previously. (III) The tunneling electrons excite an electroluminescent layer whose illumination reveals the spatial distribution of uncharged pads. This method is performed in air under atmospheric conditions and allows completely contactless testing of circuitry to detect line interruptions as well as shortcuts between separate lines. It is suited for surface lines, buried lines and for via connections.
摘要翻译： 为了测试衬底上或衬底中的导线的完整性，执行以下步骤：（I）由聚焦光束照射所选择的焊盘，使得它们由于来自这些焊盘的电子的光子辅助隧穿而带正电荷。 电荷通过现有导体传播，使得所有选定的焊盘和连接到它们的所有焊盘都具有特定的电压。 （II）整个表面被淹没光束照射。 电子的光子辅助隧道现在将从以前没有充电的那些焊盘发生。 （III）隧道电子激发电致发光层，其照明显示不带电垫的空间分布。 该方法在大气条件下在空气中进行，并允许电路完全非接触测试，以检测线路中断以及分离线路之间的快捷方式。 适用于表面线，埋线和通孔连接。
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4.发明授权Method for contactless testing for electrical opens and short circuits in conducting paths in a substrate 失效用于非接触式测试的方法，用于在基板中的导电路径中的电开路和短路
公开(公告)号：US4843329A
公开(公告)日：1989-06-27
申请号：US107433
申请日：1987-10-09
IPC分类号： H01L21/66 , G01N23/22 , G01R31/02 , G01R31/308 , H05K3/00
CPC分类号： G01R31/308
摘要： A method for contactlessly testing for opens and shorts in conducting paths within or on a nonconducting substrate. There are a plurality of conducting pads on the surface of the substrate. Charges are contactlessly generated, e.g., by an optical beam, in at least one selected pad inducing a voltage thereon and on pads electrically connected therewith through one of the conducting paths. A two dimensional electron flux is contactlessly caused to be emitted from the selected pad and at least one other pad of the plurality of pads, e.g., by an optical beam. The flux emitted from the pads depends on the voltage on each pad. The flux is detected to distinguish pads in electrical connection.
摘要翻译： 一种用于非接触测试非导电衬底内或之上的导通路径中的开路和短路的方法。 在基板的表面上有多个导电焊盘。 在至少一个所选择的焊盘中，例如通过光束，通过其中一个导电路径与其电连接的焊盘上无接触地产生电荷。 二维电子通量被非接触地引起，例如通过光束从所选择的焊盘和多个焊盘中的至少一个其它焊盘发射。 从焊盘发射的焊剂取决于每个焊盘上的电压。 检测通量以区分电连接的焊盘。
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