Process for joining alumina ceramic bodies
    1.
    发明授权
    Process for joining alumina ceramic bodies 失效
    氧化铝陶瓷体的接合方法

    公开(公告)号:US5954900A

    公开(公告)日:1999-09-21

    申请号:US935417

    申请日:1997-09-23

    摘要: This process serves to form a long-time-vacuum-tight, high-strength, and corrosion-resistant joint, by means of a joining material, between a first body and a second body each made of sintered, polycrystalline alumina ceramic with a purity greater than 92 wt. % or of sapphire. The joining material is interposed in the form of a paste, a foil, or a slip between the first body and the second body. The joining material has been made from 1) an agglomerate-free, highly disperse, high-purity .alpha.-alumina powder with particles of as high a degree of calcination as possible and of a size not exceeding 100 nm (=10.sup.-7 m), 2) an anorganic oxidic powder of an auxiliary sintering agent with particles of approximately the same size as the particle size of the .alpha.-alumina powder, 3) an organic vehicle which is dissolved or suspended in an organic or aqueous solvant and in which the particles of the respective powder are distributed as evenly as possible. Instead of the anorganic oxidic powder of an auxiliary sintering agent an anorganic oxidic auxiliary sintering agent produced chemically as envelopes around or attachment to the particles of the .alpha.-alumina powder can be used, the total .alpha.-alumina and auxiliary-sintering-agent content of the paste, the foil, or the slip ranging between 50% and 70%. After interposing the joining material the bodies are heated to a temperature of not more than 1,300.degree. C. and then allowing them to cool down.

    摘要翻译: 该方法用于通过连接材料在第一主体和第二主体之间形成长时间真空密封,高强度和耐腐蚀的接头,每个第一主体和第二主体由具有纯度的烧结多晶氧化铝陶瓷制成 大于92wt。 %或蓝宝石。 接合材料以第一主体和第二主体之间的糊状物,箔片或滑动片的形式插入。 接合材料由1)无聚集高分散,高纯度的α-氧化铝粉末制成,该粉末具有尽可能高的煅烧程度且尺寸不超过100nm(=10-7μm) 2)一种辅助烧结剂的无机氧化粉末,其颗粒大小与α-氧化铝粉末的粒度大致相同,3)有机载体,其溶解或悬浮在有机或水溶液中,其中 各粉末的颗粒尽可能均匀地分布。 代替辅助烧结剂的无机氧化物粉末,可以使用以α-氧化铝粉末的颗粒包围或附着于其上化学形成的无机氧化物辅助烧结剂,总α-氧化铝和辅助烧结剂的总量 糊,箔或滑差在50%至70%之间。 在插入接合材料之后,将本体加热至不高于1300℃的温度,然后使其冷却。