公开(公告)号：US20100044704A1

公开(公告)日：2010-02-25

申请号：US12544548

申请日：2009-08-20

申请人： Barry John Male ,  Philip L. Hower

发明人： Barry John Male ,  Philip L. Hower

IPC分类号： H01L29/66 ,  H01L21/70

CPC分类号： H01L35/30 ,  H01L23/38 ,  H01L27/16 ,  H01L35/22 ,  H01L35/32 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A thermoelectric device is disclosed which includes metal thermal terminals protruding from a top surface of an IC, connected to vertical thermally conductive conduits made of interconnect elements of the IC. Lateral thermoelectric elements are connected to the vertical conduits at one end and heatsinked to the IC substrate at the other end. The lateral thermoelectric elements are thermally isolated by interconnect dielectric materials on the top side and field oxide on the bottom side. When operated in a generator mode, the metal thermal terminals are connected to a heat source and the IC substrate is connected to a heat sink. Thermal power flows through the vertical conduits to the lateral thermoelectric elements, which generate an electrical potential. The electrical potential may be applied to a component or circuit in the IC. The thermoelectric device may be integrated into an IC without adding fabrication cost or complexity.

摘要翻译： 公开了一种热电装置，其包括从IC的顶表面突出的金属热端子，其连接到由IC的互连元件制成的垂直导热导管。 侧向热电元件在一端连接到垂直导管，并在另一端与IC基板相互散热。 侧向热电元件通过顶侧的互连电介质材料和底侧的场氧化物热隔离。 当在发电机模式下工作时，金属热端子连接到热源，并且IC基板连接到散热器。 热功率流过垂直管道到横向热电元件，产生电位。 电位可以施加到IC中的元件或电路。 热电装置可以集成到IC中而不增加制造成本或复杂性。