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公开(公告)号:US5294459A
公开(公告)日:1994-03-15
申请号:US935943
申请日:1992-08-27
申请人: Patrick T. Hogan , Bernard J. McHugh , James J. Turner , Takaji Shimada , Tsuyoshi Nishimura , Bradley N. Stoops
发明人: Patrick T. Hogan , Bernard J. McHugh , James J. Turner , Takaji Shimada , Tsuyoshi Nishimura , Bradley N. Stoops
CPC分类号: H05K3/0091 , B05B7/0815 , B05B7/162 , B05B9/002 , B05B9/01 , H05K2201/09872 , H05K2201/0989 , H05K2203/081 , H05K2203/1366 , H05K2203/1509
摘要: Apparatus and methods for spray coating selected areas of a circuit board with an insulative coating material without coating regions of the circuit board to be left uncoated. A liquid spray device emits the coating material and an air assist attachment connected to the liquid spray device directs jets of air into impinging relation with the coating material emitted therefrom to transform the coating material into an atomized, shaped spray pattern for coating the selected areas. The air assist attachment can be disabled so that the spray device transforms the coating material into a non-atomized, shaped spray pattern for coating selected areas without coating regions of the circuit board to be left uncoated.
摘要翻译: 用绝缘涂层材料喷涂电路板的选定区域而不涂覆电路板的未涂覆区域的装置和方法。 液体喷射装置发射涂覆材料,并且连接到液体喷射装置的空气辅助附件引导空气射流与从其喷出的涂层材料的撞击关系,以将涂层材料转变成雾化的成形喷雾图案,以涂覆所选择的区域。 空气辅助附件可以被禁用,使得喷涂装置将涂料转化成非雾化的成形喷雾图案,用于涂覆所选择的区域,而不涂覆电路板的未被涂覆的区域。