公开(公告)号：US10064282B2

公开(公告)日：2018-08-28

申请号：US15158645

申请日：2016-05-19

申请人： TactoTek Oy

发明人： Mikko Heikkinen ,  Jarmo Sääski ,  Jarkko Torvinen

IPC分类号： H01L23/00 ,  H05K1/18 ,  H05K1/02 ,  H01L33/52 ,  H01L23/498 ,  H01L23/538 ,  H01L51/00

CPC分类号： H05K1/186 ,  H01L23/4985 ,  H01L23/5387 ,  H01L33/52 ,  H01L51/0097 ,  H01L2224/1319 ,  H01L2933/005 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0129 ,  H05K2201/05 ,  H05K2201/09872 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1322

摘要： A multilayer structure for an electronic device having a flexible substrate film (202) for accommodating electronics (204); at least one electronic component (204) provided on said substrate film (202); and a number of conductive traces (206) provided on said substrate film (202) for electrically powering and/or connecting electronics including said at least one electronic component (204), wherein at least one preferably thermoformed cover (210) is attached to said substrate film (202) on top of said at least one electronic component (204), the at least one thermoformed cover (210) and the substrate film (202) accommodating the electronics (204) being overmolded with thermoplastic material (208). The invention also relates to a method for manufacturing a multilayer structure for an electronic device.

公开(公告)号：US10064266B2

公开(公告)日：2018-08-28

申请号：US13185583

申请日：2011-07-19

申请人： Kevin J. Fitzpatrick ,  Ryan K. Roth

发明人： Kevin J. Fitzpatrick ,  Ryan K. Roth

IPC分类号： H01H85/04 ,  H05K1/02 ,  H01H85/46 ,  A47L15/46 ,  H01R12/70

CPC分类号： H05K1/0256 ,  A47L15/46 ,  H01H85/04 ,  H01H85/463 ,  H01R12/7088 ,  H05K1/0263 ,  H05K2201/012 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09872 ,  H05K2201/10181 ,  H05K2201/10189

摘要： A printed circuit board to which corresponding wiring connectors such as power wiring connectors, may be connected to couple electrical components and a power supply to the printed circuit board and a control housing, which may be used for operably storing such a printed circuit board.

公开(公告)号：US10057983B1

公开(公告)日：2018-08-21

申请号：US14304650

申请日：2014-06-13

申请人： Verily Life Sciences LLC

发明人： James Etzkorn ,  Harvey Ho

IPC分类号： H05K3/32 ,  H05K1/02 ,  H05K3/30

CPC分类号： H05K1/0298 ,  A61B5/00 ,  A61B5/14532 ,  A61B5/1486 ,  A61B5/6821 ,  G02B3/00 ,  H05K3/007 ,  H05K3/284 ,  H05K3/303 ,  H05K3/4682 ,  H05K2201/09872 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/20 ,  H05K2203/0384 ,  H05K2203/0756 ,  H05K2203/1322 ,  H05K2203/1377

摘要： A method may involve: forming a first bio-compatible layer; forming an etch stop over a portion of the first bio-compatible layer; forming a conductive pattern over the etch stop and the first bio-compatible layer, wherein the conductive pattern defines an antenna, sensor electrodes, electrical contacts, and one or more electrical interconnects; mounting an electronic component to the electrical contacts; forming a second bio-compatible layer over the electronic component, the antenna, the sensor electrodes, the electrical contacts, the one or more electrical interconnects, and the etch stop; and etching, using an etchant, a portion of the second bio-compatible layer to form an opening in the second bio-compatible layer and thereby expose the sensor electrodes, wherein the etch stop inhibits etching of the portion of the first bio-compatible layer by the etchant.

公开(公告)号：US09832902B2

公开(公告)日：2017-11-28

申请号：US14556116

申请日：2014-11-29

申请人： ELANTAS PDG, INC.

发明人： Richard David Jordan, Jr. ,  Thomas C. Scanlon, IV

IPC分类号： C08G18/24 ,  C08G18/48 ,  C08G18/76 ,  C08G18/80 ,  C08G59/00 ,  C08G59/18 ,  C08G77/04 ,  C08L33/08 ,  C08L33/10 ,  C09D133/08 ,  C09D133/10 ,  C09D175/04 ,  C09D183/04 ,  H05K3/28 ,  H05K7/14

CPC分类号： H05K7/1427 ,  C08G18/246 ,  C08G18/4825 ,  C08G18/7664 ,  C08G18/8067 ,  C08G59/00 ,  C08G59/184 ,  C08G77/04 ,  C08L33/08 ,  C08L33/10 ,  C09D133/08 ,  C09D133/10 ,  C09D175/04 ,  C09D183/04 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/09872 ,  C08G18/10 ,  C08G18/36

摘要： Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and/or vibrations.

公开(公告)号：US09769920B2

公开(公告)日：2017-09-19

申请号：US14226593

申请日：2014-03-26

申请人： Apple Inc.

发明人： Colin M. Ely ,  Anna-Katrina Shedletsky ,  Fletcher R. Rothkopf ,  Stephen Brian Lynch

IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/28 ,  H05K3/00

CPC分类号： H05K1/0281 ,  H05K1/028 ,  H05K1/0284 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/115 ,  H05K3/0061 ,  H05K3/28 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/0305 ,  H05K2201/055 ,  H05K2201/057 ,  H05K2201/09109 ,  H05K2201/09872 ,  H05K2201/0999 ,  H05K2201/10128 ,  H05K2201/10409 ,  H05K2201/2009 ,  H05K2203/0126 ,  H05K2203/013 ,  H05K2203/1194 ,  H05K2203/1327 ,  H05K2203/1366

摘要： An electronic device may be provided with printed circuits. Electrical components may be interconnected using signal paths formed from metal traces in the printed circuits. The printed circuits may include flexible printed circuits with bent configurations. The flexible printed circuits may be provided with integral bend retention structures. A bend retention structure may be formed from a polymer layer, a solder layer, a stiffener formed from metal or polymer that is attached to flexible printed circuit layers with adhesive, a conformal plastic coating that covers exposed metal traces at a bend, a metal stiffener with screw holes, a shape memory alloy, a portion of a flexible printed circuit dielectric substrate layer with a reduced elongation at yield value, or combinations of these structures. The bend retention structure maintains a bend in a bent flexible printed circuit.

公开(公告)号：US09668354B2

公开(公告)日：2017-05-30

申请号：US14807594

申请日：2015-07-23

申请人： International Business Machines Corporation

发明人： Sarah K. Czaplewski ,  Joseph Kuczynski ,  Jason T. Wertz ,  Jing Zhang

IPC分类号： B29C65/52 ,  B32B37/14 ,  B32B37/26 ,  B32B38/10 ,  B32B43/00 ,  H05K3/28 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46

CPC分类号： H05K3/28 ,  C09D163/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/0058 ,  H05K3/0079 ,  H05K3/282 ,  H05K3/284 ,  H05K3/288 ,  H05K3/4644 ,  H05K2201/0183 ,  H05K2201/09872 ,  H05K2203/1322

摘要： In an example, a process for reversibly bonding a conformal coating to a dry film solder mask (DFSM) material is disclosed. The process includes applying a first conformal coating material to a DFSM material. The first conformal coating material includes a first functional group, and the DFSM material includes a second functional group that is different from the first functional group. The process also includes reversibly bonding the first conformal coating material to the DFSM material via a chemical reaction of the first functional group and the second functional group.

公开(公告)号：US09635759B2

公开(公告)日：2017-04-25

申请号：US14292829

申请日：2014-05-31

申请人： Sridharan Venk ,  Earl Alfred Picard, Jr. ,  Qi Dai ,  Richard Garner

发明人： Sridharan Venk ,  Earl Alfred Picard, Jr. ,  Qi Dai ,  Richard Garner

IPC分类号： H05K1/11 ,  H05K3/30 ,  H05K1/02 ,  H01L23/00 ,  F21S4/22 ,  F21V21/005 ,  H01L33/38 ,  H05K1/18 ,  H05K3/00 ,  H05K3/02 ,  H05K3/28 ,  H01L33/62 ,  G06K19/077 ,  H01L33/44

CPC分类号： H05K1/111 ,  F21S4/22 ,  F21V21/005 ,  G06K19/07749 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L33/385 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32227 ,  H01L2224/48227 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1421 ,  H05K1/0209 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0097 ,  H05K3/02 ,  H05K3/28 ,  H05K3/30 ,  H05K2201/051 ,  H05K2201/09381 ,  H05K2201/09445 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/09872 ,  H05K2201/099 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2203/1545 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. The body portion includes a perimeter edge having at least a first convex segment and a second convex with a first non-convex segment disposed between the first convex segment and the second convex segment. A method of constructing a flexible circuit to facilitate roll-to-roll manufacturing of the flexible circuit is also provided.

公开(公告)号：US20170094810A1

公开(公告)日：2017-03-30

申请号：US15266624

申请日：2016-09-15

申请人： Semblant Limited

发明人： Gianfranco Aresta ,  Gareth Hennighan ,  Andrew Simon Hall Brooks ,  Shailendra Vikram Singh

IPC分类号： H05K3/46 ,  C23C16/505 ,  H05K1/18

CPC分类号： H05K3/467 ,  C23C16/30 ,  C23C16/505 ,  H05K1/181 ,  H05K3/285 ,  H05K2201/0104 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/10053 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10128 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10181 ,  H05K2203/095 ,  H05K2203/121 ,  H05K2203/1322 ,  H05K2203/1338

摘要： An electrical assembly which has a multi-layer conformal coating on at least one surface of the electrical assembly, wherein each layer of the multi-layer coating is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally O2, N2O, NO2, H2, NH3, N2, SiF4 and/or hexafluoropropylene (HFP), and (c) optionally He, Ar and/or Kr. The chemistry of the resulting plasma-deposited material chemistry can be described by the general formula: SiOxHyCzFaNb. The properties of the conformal coating are tailored by tuning the values of x, y, z, a and b.

公开(公告)号：US20170055374A1

公开(公告)日：2017-02-23

申请号：US14831464

申请日：2015-08-20

申请人： Microsoft Technology Licensing, LLC

发明人： Juha Erkki Antero Penttinen

IPC分类号： H05K7/20 ,  H05K3/30 ,  H05K3/00

CPC分类号： H05K7/20436 ,  G06F1/203 ,  H05K1/0204 ,  H05K1/0209 ,  H05K3/0091 ,  H05K3/284 ,  H05K3/285 ,  H05K3/303 ,  H05K2201/0162 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2203/1316

摘要： In an embodiment, thermal conductive material within a device having electrical component is described. In an embodiment, a device is disclosed comprising: a printed circuit board comprising electrical components; a housing of the device, wherein the housing substantially encloses the printed circuit board; a thermal conductive material coated on the printed circuit board, wherein the thermal conductive material is configured to coat an interface between an electrical component and the printed circuit board, and wherein the thermal conductive material is located between the printed circuit board and a portion of the housing according to both a three dimensional topography of the printed circuit board and a three dimensional shape of the portion of the housing.

摘要翻译： 在一个实施例中，描述了具有电气部件的装置内的导热材料。 在一个实施例中，公开了一种装置，包括：包括电气部件的印刷电路板; 所述装置的壳体，其中所述壳体基本上包围所述印刷电路板; 涂覆在所述印刷电路板上的导热材料，其中所述导热材料被配置为涂覆电气部件和所述印刷电路板之间的界面，并且其中所述导热材料位于所述印刷电路板和所述印刷电路板的一部分之间 根据印刷电路板的三维形状以及壳体的一部分的三维形状的外壳。

公开(公告)号：US20160324011A1

公开(公告)日：2016-11-03

申请号：US15103367

申请日：2014-12-10

申请人： EUROPLASMA NV

发明人： Filip Legein ,  Eva Rogge ,  Peter Martens

IPC分类号： H05K3/28

CPC分类号： H05K3/285 ,  B05D1/62 ,  B05D5/08 ,  C09D183/04 ,  C09D183/16 ,  H05K3/282 ,  H05K2201/015 ,  H05K2201/09872 ,  H05K2203/095

摘要： The present invention concerns a process for the deposition of a solder-through polymer coating on an uncoated printed circuit board which comprises the use of an average low power and low pressure plasma polymerisation in a polymerisation chamber of an organosilane precursor monomer which is introduced into said polymerisation chamber by means of a carrier gas, said organosilane being of the Formula Y1-X—Y2 (I) or —[Si(CH3)2-X-]n- (II), wherein: X is O or NH; Y1 is —Si(Y3)(Y4)Y5; Y2 is Si(Y3′)(Y4′)Y5′; Y3, Y4, Y5, Y3′, Y4′, and Y5′ are each independently H or an alkyl group of up to 10 carbon atoms; the monomer of formula (II) is cyclic wherein n is 2 to 10, and wherein at most one of Y3, Y4 and Y5 is hydrogen, at most one of Y3′, Y4′ and Y5′ is hydrogen and the total number of carbon atoms is not more than 20.

摘要翻译： 本发明涉及一种用于在未涂覆的印刷电路板上沉积焊料穿透聚合物涂层的方法，其包括在有机硅烷前体单体的聚合室中使用平均低功率和低压等离子体聚合，所述聚合室被引入所述 所述有机硅烷为式Y1-X-Y2（I）或 - [Si（CH3）2-X-n-（Ⅱ）），其中：X为O或NH; Y1是-Si（Y3）（Y4）Y5; Y2是Si（Y3'）（Y4'）Y5'; Y 3，Y 4，Y 5，Y 3'，Y 4'和Y 5'各自独立地为H或至多10个碳原子的烷基; 式（II）的单体是环状的，其中n为2至10，并且其中Y 3，Y 4和Y 5中的至少一个为氢，Y 3'，Y 4'和Y 5'中的至多一个为氢，并且碳 原子不超过20。