Warpage-reducing packaging design
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    发明申请
    Warpage-reducing packaging design 审中-公开
    翘曲缩减包装设计

    公开(公告)号:US20070175660A1

    公开(公告)日:2007-08-02

    申请号:US11341991

    申请日:2006-01-27

    IPC分类号: H01L23/34

    摘要: A flange and packaging assembly characterized by a structural lip configured to impart resistance to thermal-induced deformation (i.e. “stiffness”) to the flange during elevated temperature die attachment processes. The stiffness is achieved through appropriate configuration of the lip (height, width and shape) and is sufficient to at least partially counteract the stresses generated from coefficient of thermal expansion differentials between the flange and a die attached to it. The lip may be molded or otherwise formed with the flange as a unitary lip-stiffened flange, or may be a separate structure that is affixed to the flange. The flange has a lip-stiffened region for die attachment. This region may be raised above the first surface of the substrate base for enhanced stiffening, and may be in the form of a single pedestal supporting a single or multiple die, or may be a series of raised pedestals, each supporting one or more die. The leads may be embedded in a polymetric material that is attached to the flange that is of sufficient thickess to provide the required stiffness. The embedded leads may be shaped and formed so that the desired seating plane height is achieved. The lead form placement can be either on the interior or exterior of the embedded polymetric material. The polymetric material can be supported along the edge of the flange or be seated on a part of an extrusion from the flange.

    摘要翻译: 一种凸缘和包装组件,其特征在于结构唇缘被配置成在高温模具附接过程期间赋予对凸缘的热诱导变形(即“刚度”)的抵抗力。 刚度通过唇缘的适当构造(高度,宽度和形状)来实现,并且足以至少部分地抵消由凸缘和附接到其上的模具之间的热膨胀差异系数产生的应力。 唇缘可以模制或以其它方式形成,凸缘作为整体唇缘加强的凸缘,或者可以是固定到凸缘的单独的结构。 凸缘具有用于模具附接的唇缘加强区域。 该区域可以升高到基板基底的第一表面之上,以增强加强硬度,并且可以是支撑单个或多个模头的单个基座的形式,或者可以是一系列凸起的基座,每个支撑一个或多个模具。 引线可以嵌入到具有足够厚度的凸缘附接到提供所需刚度的多边形材料中。 嵌入的引线可以被成形和形成,使得实现期望的座面高度。 引线形式放置可以在嵌入式多功能材料的内部或外部。 多边形材料可以沿着凸缘的边缘支撑,或者从凸缘位于挤压件的一部分上。