公开(公告)号：US06612915B1

公开(公告)日：2003-09-02

申请号：US09472523

申请日：1999-12-27

申请人： Cyprian Uzoh ,  Boguslaw Andrzej Nagorski ,  Konstantin Volodarsky ,  Douglas W. Young

发明人： Cyprian Uzoh ,  Boguslaw Andrzej Nagorski ,  Konstantin Volodarsky ,  Douglas W. Young

IPC分类号： B24B700

CPC分类号： B24B37/30 ,  C25D7/12

摘要： A work piece carrier head can carry a semiconductor wafer during both plating and polishing operations. The carrier head includes a first component secured to a shaft by which the carrier head can be rotated, translated, and moved up and down, a second component connected to the first component and movable by fluid pressure relative to the first component between retracted and extended positions, and a third component connected to the first and second components for up and down movement between wafer loading or unloading and wafer plating or polishing positions. The third carrier head component includes a contact element by which electrical contact with the wafer is provided to permit wafer plating.

摘要翻译： 工件载体头可以在电镀和抛光操作期间承载半导体晶片。 承载头包括固定到轴的第一部件，承载头可以通过该第一部件旋转，平移和上下移动;第二部件，连接到第一部件并且可相对于第一部件在流体压力下相对于第一部件在缩回和延伸之间移动 位置，以及连接到第一和第二部件的第三部件，用于晶片装载或卸载以及晶片电镀或抛光位置之间的上下移动。 第三载体头部件包括接触元件，通过该接触元件提供与晶片的电接触以允许晶片电镀。