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    Apparatus and method for loading a wafer in polishing system
    1.
    发明授权
    Apparatus and method for loading a wafer in polishing system 失效
    在抛光系统中装载晶片的装置和方法

    公开(公告)号：US06932679B2

    公开(公告)日：2005-08-23

    申请号：US10295197

    申请日：2002-11-15

    Applicant: Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

    Inventor： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

    IPC: B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/04 ,  B24B47/04 ,  B24B49/16 ,  B24B1/00

    CPC classification number: B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/013 ,  B24B37/04 ,  B24B37/205 ,  B24B47/04 ,  B24B49/16

    Abstract: The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

    Abstract translation: 本发明包括固定到机构的抛光垫或皮带，该机构允许垫或带以往往的方式即即向前和向后两个方向高速移动。 抛光垫或带在其抛光晶片时恒定的双向运动在晶片表面上提供了优异的平面性和均匀性。 当需要衬垫的新鲜部分时，衬垫移动通过包含辊的驱动系统，使得辊仅接触衬垫的背面，从而最小化除了从抛光抛光的晶片之外的摩擦源 并且使抛光垫的寿命最大化。

    Anode assembly for plating and planarizing a conductive layer
    2.
    发明授权
    Anode assembly for plating and planarizing a conductive layer 有权
    用于电镀和平坦化导电层的阳极组件

    公开(公告)号：US06478936B1

    公开(公告)日：2002-11-12

    申请号：US09568584

    申请日：2000-05-11

    Applicant: Rimma Volodarsky ,  Konstantin Volodarsky ,  Cyprian Uzoh ,  Homayoun Talieh ,  Douglas W. Young

    Inventor： Rimma Volodarsky ,  Konstantin Volodarsky ,  Cyprian Uzoh ,  Homayoun Talieh ,  Douglas W. Young

    IPC: C25B1103

    CPC classification number: C25D17/14 ,  C25F7/00

    Abstract: A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.

    Abstract translation: 可以使用特定的阳极组件来提供用于在半导体晶片上进行的电镀操作，平面化操作和电镀和平面化操作中的任何一种的解决方案。 阳极组件包括设置在其中执行操作的室内的可旋转轴，连接到轴的阳极壳体和附接到阳极壳体的多孔垫支撑板。 支撑板具有适于支撑面向晶片的焊盘的顶表面，并且与阳极壳体一起限定阳极腔。 可以在阳极腔中设置消耗性阳极以向溶液提供电镀材料。 还提供了可以将溶液输送到所述阳极腔的溶液输送结构。 溶液输送结构可以包含在进行操作的室内。 护罩还可以安装在轴和相关主轴之间，以防止溶液从腔室泄漏。

    Electrochemical processing of conductive surface
    4.
    发明授权
    Electrochemical processing of conductive surface 有权
    导电表面的电化学处理

    公开(公告)号：US07572354B2

    公开(公告)日：2009-08-11

    申请号：US11445594

    申请日：2006-06-01

    Applicant: Cyprian Emeka Uzoh ,  Homayoun Talieh ,  Bulent Basol ,  Douglas W. Young

    Inventor： Cyprian Emeka Uzoh ,  Homayoun Talieh ,  Bulent Basol ,  Douglas W. Young

    IPC: C25B9/00 ,  C25D7/00

    CPC classification number: B24B37/20 ,  B24B37/046 ,  B24B37/24 ,  B24B37/26 ,  C25D5/06 ,  C25D17/001 ,  C25D17/14 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/76877

    Abstract: The present invention relates to methods and apparatus for plating a conductive material on a semiconductor substrate by rotating pad or blade type objects in close proximity to the substrate, thereby eliminating/reducing dishing and voids. This is achieved by providing pad or blade type objects mounted on cylindrical anodes or rollers and applying the conductive material to the substrate using the electrolyte solution disposed on or through the pads, or on the blades. In one embodiment of the invention, the pad or blade type objects are mounted on the cylindrical anodes and rotated about a first axis while the workpiece may be stationary or rotate about a second axis, and metal from the electrolyte solution is deposited on the workpiece when a potential difference is applied between the workpiece and the anode. In another embodiment of the present invention, the plating apparatus includes an anode plate spaced apart from the cathode workpiece. Upon application of power to the anode plate and the cathode workpiece, the electrolyte solution disposed in the plating apparatus is used to deposit the conductive material on the workpiece surface using cylindrical rollers having the pad or blade type objects.

    Abstract translation: 本发明涉及通过旋转靠近基板的垫片或刀片型物体来在半导体衬底上镀覆导电材料的方法和装置，从而消除/减少凹陷和空隙。 这通过提供安装在圆柱形阳极或辊子上的垫片或刀片型物体，并使用设置在垫片上或穿过垫片上的电解质溶液将导电材料施加到衬底来实现。 在本发明的一个实施例中，衬垫或刀片型物体安装在圆柱形阳极上并围绕第一轴线旋转，同时工件可以是静止的或围绕第二轴线旋转，并且来自电解质溶液的金属沉积在工件上， 在工件和阳极之间施加电位差。 在本发明的另一实施例中，电镀装置包括与阴极工件间隔开的阳极板。 在向阳极板和阴极工件施加电力时，使用设置在电镀装置中的电解液将导电材料沉积在工件表面上，使用具有焊盘或刀片型物体的圆柱形辊。

    Method of using vertically configured chamber used for multiple processes
    5.
    发明授权
    Method of using vertically configured chamber used for multiple processes 有权
    使用垂直配置的室用于多个过程的方法

    公开(公告)号：US06969456B2

    公开(公告)日：2005-11-29

    申请号：US10041029

    申请日：2001-12-28

    Applicant: Konstantin Volodarsky ,  Boguslaw A. Nagorski ,  Rimma Volodarsky ,  Douglas W. Young ,  Cyprian Uzoh ,  Homayoun Talieh

    Inventor： Konstantin Volodarsky ,  Boguslaw A. Nagorski ,  Rimma Volodarsky ,  Douglas W. Young ,  Cyprian Uzoh ,  Homayoun Talieh

    IPC: C25D7/12 ,  H01L21/00 ,  H01L21/02 ,  H01L21/3063 ,  C25F3/00 ,  B08B3/04

    CPC classification number: H01L21/6719 ,  C25D7/12 ,  C25D17/001 ,  H01L21/67028 ,  Y10S134/902

    Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.

    Abstract translation: 本发明涉及一种用于进行多个处理步骤的容纳室，例如沉积，抛光，蚀刻，改性，漂洗，清洁和干燥工件上的表面。 在本发明的一个实例中，室用于在半导体晶片上化学机械地沉积导电材料。 然后可以使用相同的容纳室来冲洗和清洁相同的晶片。 结果，本发明消除了对用于沉积导电材料和清洁晶片的单独处理站的需要。 因此，利用本发明，降低了成本和物理空间，同时提供了使用容纳室在晶片表面上执行多个工艺的有效的装置和方法。

    Anode assembly for plating and planarizing a conductive layer
    7.
    发明授权
    Anode assembly for plating and planarizing a conductive layer 有权
    用于电镀和平坦化导电层的阳极组件

    公开(公告)号：US06773576B2

    公开(公告)日：2004-08-10

    申请号：US10251377

    申请日：2002-09-20

    Applicant: Rimma Volodarsky ,  Konstantin Volodarsky ,  Cyprian Uzoh ,  Homayoun Talieh ,  Douglas W. Young

    Inventor： Rimma Volodarsky ,  Konstantin Volodarsky ,  Cyprian Uzoh ,  Homayoun Talieh ,  Douglas W. Young

    IPC: C25F302

    CPC classification number: C25D17/14 ,  C25F7/00

    Abstract: A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.

    Abstract translation: 可以使用特定的阳极组件来提供用于在半导体晶片上进行的电镀操作，平面化操作和电镀和平面化操作中的任何一种的解决方案。 阳极组件包括设置在其中执行操作的室内的可旋转轴，连接到轴的阳极壳体和附接到阳极壳体的多孔垫支撑板。 支撑板具有适于支撑面向晶片的焊盘的顶表面，并且与阳极壳体一起限定阳极腔。 可以在阳极腔中设置消耗性阳极以向溶液提供电镀材料。 还提供了可以将溶液输送到所述阳极腔的溶液输送结构。 溶液输送结构可以包含在进行操作的室内。 护罩还可以安装在轴和相关主轴之间，以防止溶液从腔室泄漏。

    METHOD AND APPARATUS FOR STRINGING THIN FILM SOLAR CELLS
    10.
    发明申请
    METHOD AND APPARATUS FOR STRINGING THIN FILM SOLAR CELLS 有权
    用于稀释薄膜太阳能电池的方法和装置

    公开(公告)号：US20100200170A1

    公开(公告)日：2010-08-12

    申请号：US12698903

    申请日：2010-02-02

    Applicant: Jalal Ashjaee ,  Douglas W. Young ,  Kiet Tran ,  Steve Kuskie

    Inventor： Jalal Ashjaee ,  Douglas W. Young ,  Kiet Tran ,  Steve Kuskie

    IPC: B32B37/06 ,  B32B37/08

    CPC classification number: B32B38/1841 ,  B32B38/1858 ,  B32B2309/02 ,  B32B2457/12 ,  H01L31/188 ,  Y02E10/50 ,  Y10T156/17

    Abstract: The present inventions generally relate to thin film solar cell fabrication, and more particularly, to techniques for interconnecting solar cells based on Group IBIIIAVIA thin film semiconductors. In a particular embodiment, a system is described that positions solar cells and conductive leads with respect to each other so that application of a conductive adhesive and formation of an assembled solar cell string, followed by curing and cooling of the conductive adhesive, can occur in a repeatable manner.

    Abstract translation: 本发明一般涉及薄膜太阳能电池制造，更具体地涉及基于IBIIIAVIA薄膜半导体的用于互连太阳能电池的技术。 在具体实施例中，描述了一种系统，其将太阳能电池和导电引线相对于彼此定位，使得导电粘合剂的应用和组装的太阳能电池串的形成，随后导电粘合剂的固化和冷却可以发生在 一个可重复的方式。

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