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1.发明授权Method of forming an external electrode fluorescent lamp, thick film electrode compositions used therein, and lamps and LCD devices formed thereof 失效形成外部电极荧光灯的方法，其中使用的厚膜电极组合物，以及由其形成的灯和LCD装置公开(公告)号：US07677945B2
公开(公告)日：2010-03-16
申请号：US11805919
申请日：2007-05-24
Applicant: Joel Skutsky , Brian D. Veeder , Andy Zao , Thomas Lin , Hsiu-Wei Wu , Tjong-Ren Chang , Shuang-Chang Yang , Wen-Chun Chiu , Jin-Yuh Lu
Inventor： Joel Skutsky , Brian D. Veeder , Andy Zao , Thomas Lin , Hsiu-Wei Wu , Tjong-Ren Chang , Shuang-Chang Yang , Wen-Chun Chiu , Jin-Yuh Lu
CPC classification number: H01J65/046 , H01J9/022
Abstract: This invention relates to method(s) of fabricating electrodes of an external electrode fluorescence lamp (EEFL) for use in thin film transistor-liquid crystal display (TFT-LCD) applications. Also disclosed is a structure with electrodes for external electrode fluorescence lamps used in TFT-LCD backlight units.
Abstract translation: 本发明涉及制造用于薄膜晶体管 - 液晶显示（TFT-LCD）应用的外部电极荧光灯（EEFL）的电极的方法。 还公开了具有用于TFT-LCD背光单元中的外部电极荧光灯的电极的结构。
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公开(公告)号：US20080035943A1
公开(公告)日：2008-02-14
申请号：US11891366
申请日：2007-08-10
Applicant: Joel Slutsky , Brian D. Veeder , Thomas Lin
Inventor： Joel Slutsky , Brian D. Veeder , Thomas Lin
CPC classification number: H01L21/4867 , H01L23/3736 , H01L2224/48091 , H01L2224/73265 , H01L2924/09701 , H01L2924/12044 , H05K1/053 , H05K1/092 , H05K3/246 , H05K2201/017 , H05K2201/0347 , H05K2201/10106 , H05K2203/0315 , H01L2924/00014
Abstract: The present invention provides novel methods of forming component carriers, component modules, and the carriers and modules formed therefrom which utilize thick film technology. In some embodiments, these methods are used to form lighting device chip carriers and modules. In further embodiments, these lighting device chip carriers and modules are used in LED applications.
Abstract translation: 本发明提供了形成部件载体，组件模块以及由此形成的载体和模块的新颖方法，其利用厚膜技术。 在一些实施例中，这些方法用于形成照明装置芯片载体和模块。 在另外的实施例中，这些照明装置芯片载体和模块用于LED应用中。
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公开(公告)号：US08710523B2
公开(公告)日：2014-04-29
申请号：US11891366
申请日：2007-08-10
Applicant: Joel Slutsky , Brian D. Veeder , Thomas Lin
Inventor： Joel Slutsky , Brian D. Veeder , Thomas Lin
CPC classification number: H01L21/4867 , H01L23/3736 , H01L2224/48091 , H01L2224/73265 , H01L2924/09701 , H01L2924/12044 , H05K1/053 , H05K1/092 , H05K3/246 , H05K2201/017 , H05K2201/0347 , H05K2201/10106 , H05K2203/0315 , H01L2924/00014
Abstract: The present invention provides novel methods of forming component carriers, component modules, and the carriers and modules formed therefrom which utilize thick film technology. In some embodiments, these methods are used to form lighting device chip carriers and modules. In further embodiments, these lighting device chip carriers and modules are used in LED applications.
Abstract translation: 本发明提供了形成部件载体，组件模块以及由此形成的载体和模块的新颖方法，其利用厚膜技术。 在一些实施例中，这些方法用于形成照明装置芯片载体和模块。 在另外的实施例中，这些照明装置芯片载体和模块用于LED应用中。
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