公开(公告)号：US06391138B1

公开(公告)日：2002-05-21

申请号：US09399824

申请日：1999-09-20

申请人： Bruno Bablee ,  Michael Malone

发明人： Bruno Bablee ,  Michael Malone

IPC分类号： B32B3118

CPC分类号： H05K3/0058 ,  H05K3/386 ,  H05K2201/0909 ,  H05K2201/2009 ,  H05K2203/0264 ,  H05K2203/066 ,  Y10T156/1052 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T156/1062 ,  Y10T156/1074 ,  Y10T428/15 ,  Y10T428/24314 ,  Y10T428/24777

摘要： A method of fabricating a laminated circuit assembly and the assembly made therefrom including the steps of providing a relatively stiff substrate. A U-shaped slit is cut in the substrate in an area where a peripheral pull tab subsequently is to be located. The side legs of the U-shaped configuration define spaced slit portions. A relatively flexible backing sheet is adhered to a back side of the substrate. The laminated substrate and backing sheet are cut with a peripheral cut intersecting the side legs of the U-shaped slit, with the peripheral cut forming a pull tab projecting outwardly from the U-shaped slit. The pull tab can be grasped and separated from the substrate to strip the backing sheet therefrom.

摘要翻译： 一种制造层压电路组件的方法及由此制成的组件包括提供相对刚性的衬底的步骤。 在随后设置外围拉片的区域中，在基板上切割U形狭缝。 U形构造的侧腿限定了间隔的狭缝部分。 相对柔性的背衬片粘附到基底的背面。 层叠基板和背衬片用与U形狭缝的侧腿相交的周边切口切割，周边切口形成从U形狭缝向外突出的拉片。 拉片可以被抓握并与衬底分离以从其剥离背衬片。