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公开(公告)号：US20100145547A1
公开(公告)日：2010-06-10
申请号：US12330096
申请日：2008-12-08
申请人： Buz Darabnia , Andy Yednak , Mike Halpin , Loren Jacobs , Ravinder Aggarwal
发明人： Buz Darabnia , Andy Yednak , Mike Halpin , Loren Jacobs , Ravinder Aggarwal
摘要： A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.
摘要翻译： 描述了用于半导体加工反应的热电偶。 热电偶包括具有测量尖端和在相对端的开口的护套。 接收第一线和第二线的一部分的支撑构件被容纳在护套内。 第一和第二线形成在测量尖端处接触鞘的内表面的接合点。 间隔构件固定在护套的开口处并接收支撑构件。 间隔构件允许支撑构件，第一线和第二线自由地相对于彼此热膨胀而不在其中引入压缩或拉伸应力。
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公开(公告)号：US20120310440A1
公开(公告)日：2012-12-06
申请号：US13563274
申请日：2012-07-31
申请人： Buz Darabnia , Andy Yednak , Mike Halpin , Loren Jacobs , Ravinder Aggarwal
发明人： Buz Darabnia , Andy Yednak , Mike Halpin , Loren Jacobs , Ravinder Aggarwal
摘要： A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.
摘要翻译： 描述了用于半导体加工反应的热电偶。 热电偶包括具有测量尖端和在相对端的开口的护套。 接收第一线和第二线的一部分的支撑构件被容纳在护套内。 第一和第二线形成在测量尖端处接触鞘的内表面的接合点。 间隔构件固定在护套的开口处并接收支撑构件。 间隔构件允许支撑构件，第一线和第二线自由地相对于彼此热膨胀而不在其中引入压缩或拉伸应力。
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公开(公告)号：US08262287B2
公开(公告)日：2012-09-11
申请号：US12330096
申请日：2008-12-08
申请人： Buz Darabnia , Andy Yednak , Mike Halpin , Loren Jacobs , Ravinder Aggarwal
发明人： Buz Darabnia , Andy Yednak , Mike Halpin , Loren Jacobs , Ravinder Aggarwal
摘要： A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.
摘要翻译： 描述了用于半导体加工反应的热电偶。 热电偶包括具有测量尖端和在相对端的开口的护套。 接收第一线和第二线的一部分的支撑构件被容纳在护套内。 第一和第二线形成在测量尖端处接触鞘的内表面的接合点。 间隔构件固定在护套的开口处并接收支撑构件。 间隔构件允许支撑构件，第一线和第二线自由地相对于彼此热膨胀而不在其中引入压缩或拉伸应力。
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公开(公告)号：US08616765B2
公开(公告)日：2013-12-31
申请号：US13563274
申请日：2012-07-31
申请人： Buz Darabnia , Andy Yednak , Mike Halpin , Loren Jacobs , Ravinder Aggarwal
发明人： Buz Darabnia , Andy Yednak , Mike Halpin , Loren Jacobs , Ravinder Aggarwal
摘要： A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.
摘要翻译： 描述了用于半导体加工反应的热电偶。 热电偶包括具有测量尖端和在相对端的开口的护套。 接收第一线和第二线的一部分的支撑构件被容纳在护套内。 第一和第二线形成在测量尖端处接触鞘的内表面的接合点。 间隔构件固定在护套的开口处并接收支撑构件。 间隔构件允许支撑构件，第一线和第二线自由地相对于彼此热膨胀而不在其中引入压缩或拉伸应力。
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