Method of copper plating gravure rolls
    1.
    发明授权
    Method of copper plating gravure rolls 失效
    镀铜凹版辊的方法

    公开(公告)号:US4781801A

    公开(公告)日:1988-11-01

    申请号:US10212

    申请日:1987-02-03

    申请人: C. Richard Frisby

    发明人: C. Richard Frisby

    IPC分类号: C25D3/38 C25D7/04 C25D7/00

    CPC分类号: C25D3/38

    摘要: A method of electropolating a layer of copper on gravure rolls is provided with the so-plated layer being especially adapted to receive electronic engraving. The method comprises the steps of placing a gravure roll in an electroplating bath comprising from about 150 to about 225 g/l of copper sulfate as pentahydrate, from about 35 to about 90 g/l of sulfuric acid, from about 0.01 to about 1.0 g/l of a polyether surfactant having a molecular weight of from about 400 to about 10,000, from about 1 to about 100 mg/l of a sulfonated, sulfurized benzene brightener compound, and about 0.5 to about 5 mg/l of a grain refining compound having the nucleus ##STR1## in a heterocyclic ring structure, and a molecular weight between about 100 and about 180.

    Solid tin-palladium catalyst for electroless deposition incorporating
stannous salts of organic acids
    2.
    发明授权
    Solid tin-palladium catalyst for electroless deposition incorporating stannous salts of organic acids 失效
    用于无电沉积的固体锡 - 钯催化剂,结合有机酸的亚锡盐

    公开(公告)号:US4717421A

    公开(公告)日:1988-01-05

    申请号:US857034

    申请日:1986-04-28

    CPC分类号: B01J23/626 C23C18/28

    摘要: An improved method of producing a tin/palladium catalyst for use in electroless plating baths is disclosed. The method comprises the steps:(a) preparing a mixture of stannous halide, an alkali metal halide and water,(b) reacting said mixture with a palladium halide salt at an elevated temperature,(c) adding a stannous salt of an organic carboxylic acid to the reaction mixture obtained in step (b), and(d) continuing the heating of the reaction mixture to complete the reaction.The catalysts so produced exhibit improved activity and resist decomposition.

    摘要翻译: 公开了一种制备用于化学镀浴的锡/钯催化剂的改进方法。 该方法包括以下步骤:(a)制备卤化亚锡,碱金属卤化物和水的混合物,(b)在升高的温度下使所述混合物与卤化钯盐反应,(c)加入有机羧酸的亚锡盐 酸与步骤(b)中获得的反应混合物反应,和(d)继续加热反应混合物以完成反应。 如此生产的催化剂表现出改进的活性和抗分解性。

    Method of copper plating gravure cylinders
    3.
    发明授权
    Method of copper plating gravure cylinders 失效
    镀铜方法凹版滚筒

    公开(公告)号:US4334966A

    公开(公告)日:1982-06-15

    申请号:US265143

    申请日:1981-05-19

    IPC分类号: C25D3/38 C25D7/00

    CPC分类号: C25D3/38

    摘要: A method is provided for depositing on a gravure roll a layer of copper especially adapted to receive electronic engraving comprising the steps of placing a gravure roll in an electroplating bath comprising from about 150 to about 225 grams/liter of copper sulfate from about 35 to about 90 grams/liter of sulfuric acid, from about 1 to about 15 grams/liter of a polyether having a molecular weight from about 4,000 to about 10,000, from about 0.3 to about 3.0 milligrams/liter of 1-lower alkyl-2-mercapto imidazole, and from about 1 to about 100 milligrams/liter of a sulfonated, sulfurized benzene compound; and passing electrical current through the bath to deposit copper on said roll.

    摘要翻译: 提供了一种用于在凹版辊上沉积尤其适于接收电子雕刻的铜层的方法,其特征在于包括以下步骤:将凹版辊放置在包含约150至约225克/升硫酸铜的电镀浴中,所述硫酸铜约35至约 90克/升硫酸,约1至约15克/升分子量为约4,000至约10,000,约0.3至约3.0毫克/升的1-低级烷基-2-巯基咪唑的聚醚 ,和约1至约100毫克/升的磺化硫化苯化合物; 并且使电流通过浴以在所述辊上沉积铜。

    Copper plating of gravure rolls
    4.
    发明授权
    Copper plating of gravure rolls 失效
    凹版辊镀铜

    公开(公告)号:US5417841A

    公开(公告)日:1995-05-23

    申请号:US328612

    申请日:1994-10-25

    申请人: C. Richard Frisby

    发明人: C. Richard Frisby

    CPC分类号: C25D3/38

    摘要: The invention relates to a process for depositing copper on a gravure roll comprising the steps of: immersing a gravure roll in an electroplating bath comprising A) copper, B) sulfuric acid, C) at least one alkoxythio compound, D) at least one sulfonated, sulfurized hydrocarbyl compound and E) at least one grain refining thio compound, and passing electric current through the bath to deposit copper on the gravure roll.

    摘要翻译: 本发明涉及一种在凹版辊上沉积铜的方法,包括以下步骤:将凹版辊浸入包括A)铜,B)硫酸的电镀浴中,C)至少一种烷氧基硫代化合物,D)至少一种磺化的 ,硫化烃基化合物和E)至少一种晶粒细化硫化合物,并使电流通过浴以在凹版辊上沉积铜。