Determining metrology sampling decisions based on fabrication simulation
    1.
    发明授权
    Determining metrology sampling decisions based on fabrication simulation 有权
    基于制造模拟确定计量抽样决策

    公开(公告)号:US07257502B1

    公开(公告)日:2007-08-14

    申请号:US11363748

    申请日:2006-02-28

    IPC分类号: H01L21/00

    摘要: A method for determining metrology sampling rates for workpieces in a process flow includes determining a current status of the process flow. Future processing of the workpieces in the process flow is simulated based on the current status of the process flow over a predetermined time horizon to predict sampling rates for the workpieces. During the simulating, sampling rules are implemented that consider capacity constraints of a metrology resource in the process flow. Actual workpieces in the process flow are sampled based on the predicted metrology sampling rates.

    摘要翻译: 用于确定工艺流程中工件的计量采样率的方法包括确定工艺流程的当前状态。 基于过程流程在预定时间范围内的当前状态来模拟工艺流程中工件的未来处理,以预测工件的采样率。 在模拟期间,实施了考虑过程流程中度量资源的能力限制的抽样规则。 基于预测的计量采样率对工艺流程中的实际工件进行采样。

    AUTOMATED SCHEDULING OF TEST WAFER BUILDS IN A SEMICONDUCTOR MANUFACTURING PROCESS FLOW
    4.
    发明申请
    AUTOMATED SCHEDULING OF TEST WAFER BUILDS IN A SEMICONDUCTOR MANUFACTURING PROCESS FLOW 审中-公开
    半导体制造工艺流程中自动调试测试波形

    公开(公告)号:US20090157216A1

    公开(公告)日:2009-06-18

    申请号:US11956941

    申请日:2007-12-14

    IPC分类号: G06F19/00

    摘要: An automated, computer-implemented method for managing test wafers in an integrated, automated semiconductor manufacturing environment includes: managing a test wafer inventory; consuming inventoried test wafers in the automated process flow; and distributing the consumed test wafers according to their level of usage after an evaluation thereof. An automated, computer-implemented method for use in semiconductor manufacturing includes: monitoring test wafer utilization in an automated process flow; maintaining an inventory of test wafers of a plurality of different types responsive to the monitored utilization; and managing the test wafer utilization of the test wafer inventory. An automated, computer-implemented method for use in semiconductor manufacturing includes: kitting a lot of test wafers; instantiating a software-implemented test lot scheduling agent for the kitted lot, the agent being capable of: scheduling a build for the kitted lot; or scheduling the kitted lot as a resource for consumption in an automated process flow.

    摘要翻译: 用于在集成的自动化半导体制造环境中管理测试晶片的自动计算机实现的方法包括:管理测试晶片库存; 在自动化过程流程中消耗盘点的测试晶片; 并在评估之后根据其使用水平分配消耗的测试晶片。 用于半导体制造的自动计算机实现的方法包括:在自动化处理流程中监测测试晶片利用率; 根据所监视的利用率维护多种不同类型的测试晶片的库存; 并管理测试晶片库存的测试晶片利用率。 用于半导体制造的自动计算机实现的方法包括:大量测试晶片; 实例化针对批次的软件实现的测试批次调度代理,该代理能够:调度针对批次的构建; 或将该批次批处理作为在自动化流程中消费的资源。

    Preventative maintenance scheduling incorporating facility and loop optimization
    5.
    发明授权
    Preventative maintenance scheduling incorporating facility and loop optimization 有权
    包含设施和循环优化的预防性维护计划

    公开(公告)号:US07444200B1

    公开(公告)日:2008-10-28

    申请号:US11756710

    申请日:2007-06-01

    IPC分类号: G06F19/00

    CPC分类号: G06Q10/06 Y02P90/86

    摘要: A method for scheduling preventative maintenance tasks includes defining a set of global time periods. Members of a set of preventative maintenance tasks associated with a plurality of machines for are scheduled execution during the global time periods based on capacities of the machines and production targets for the machines. A plurality of time slots is defined for a selected global period having a selected preventative maintenance task scheduled for execution therein. A selected time slot from the plurality of time slots is scheduled for performing the selected preventative maintenance task based on work in process levels for with the associated machine over the time slots.

    摘要翻译: 一种用于调度预防性维护任务的方法包括定义一组全局时间段。 与多台机器相关联的一组预防性维护任务的成员基于机器的机器和生产目标的能力在全球时间段内被调度执行。 针对所选择的全局周期定义多个时隙,其中所选择的预定维护任务被调度用于在其中执行。 调度来自多个时隙的所选择的时隙被调度为基于在时隙上与相关联的机器的处理级别中的工作来执行所选择的预防性维护任务。

    Automated integrated circuit device manufacturing facility using distributed control
    6.
    发明授权
    Automated integrated circuit device manufacturing facility using distributed control 失效
    使用分布式控制的自动化集成电路器件制造设备

    公开(公告)号:US07289867B1

    公开(公告)日:2007-10-30

    申请号:US11148092

    申请日:2005-06-08

    IPC分类号: G06F19/00

    摘要: The system includes a plurality of process modules and an independent module controller for each of the plurality of process modules that is adapted to control the process tools within each of the process modules. Each of the independent module controllers performs at least run-to-run control of the processing tools, yield management analysis, scheduling of materials provided to and sent from the process module, and movement of wafers within the process module. One method of the present invention involves providing a plurality of process modules, each of which has an independent module controller that is adapted to perform at least run-to-run control of the processing tools within the process module, yield management analysis, scheduling of materials, and movement of wafers within the process module. The independent module controller for each of the process modules controls the process tools within its respective process module that are employed in forming a portion of the integrated circuit device.

    摘要翻译: 该系统包括多个处理模块和用于多个处理模块中的每一个的独立模块控制器,其适于控制每个处理模块内的处理工具。 每个独立模块控制器至少执行对处理工具的运行控制,产量管理分析,提供给处理模块和从处理模块发送的材料的调度以及晶片在处理模块内的移动。 本发明的一种方法涉及提供多个处理模块,每个处理模块具有独立的模块控制器,该模块控制器适于对处理模块内的处理工具执行至少运行控制的运行控制,产量管理分析,调度 材料和晶片在工艺模块内的移动。 用于每个处理模块的独立模块控制器控制在其各自的处理模块内用于形成集成电路器件的一部分的处理工具。