公开(公告)号：US06839235B2

公开(公告)日：2005-01-04

申请号：US10325631

申请日：2002-12-19

申请人： Chad St. Louis ,  David Perry ,  Ivan Straznicky

发明人： Chad St. Louis ,  David Perry ,  Ivan Straznicky

IPC分类号： H01L23/427 ,  H05K7/20

CPC分类号： H05K7/20672 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： One or more heat pipes are connected between a component on a circuit card and the frame of a circuit card assembly for transfer of heat to the frame of the circuit card assembly. Circuit cards are typically held in place in channels in a chassis by an expansion type retention device. The circuit cards also include a heat frame for collecting the heat produced by the card components and channeling the heat from the card through the heat frame to the chassis. The retention device presses the heat frame in to thermal contact with one side of the channel. Heat collector can be attached to the heat generating components of a circuit card between the heat pipe and the component to provide improved thermal transfer. A number of heat collectors with pairs of heat pipes extending in opposite directions from the collector to the frame can be used to allow the heat pipes to effectively dissipate heat form the circuit card assembly regardless of the orientation of the circuit card assembly.

摘要翻译： 一个或多个热管连接在电路卡上的组件和电路卡组件的框架之间，用于将热传递到电路卡组件的框架。 电路卡通常由扩展型保持装置保持在底盘的通道中。 电路卡还包括用于收集由卡组件产生的热量并将热量从卡通过加热框架引导到底架的加热框架。 保持装置将加热框架按压以与通道的一侧热接触。 热收集器可以连接到热管和部件之间的电路卡的发热部件，以提供改进的热传递。 可以使用多个具有从收集器到框架的相反方向延伸的热管对的热收集器，以允许热管有效地从电路卡组件散热，而与电路卡组件的取向无关。