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8 条记录 (耗时 0.011 秒)

    Tamper respondent module
    1.
    发明授权
    Tamper respondent module 有权
    篡改受访者模块

    公开(公告)号：US08325486B2

    公开(公告)日：2012-12-04

    申请号：US12686492

    申请日：2010-01-13

    申请人： Nauman Arshad ,  Jing Kwok ,  Ivan Straznicky ,  Martin Terence Cassels

    发明人： Nauman Arshad ,  Jing Kwok ,  Ivan Straznicky ,  Martin Terence Cassels

    IPC分类号： H05K1/14

    CPC分类号： H05K5/0208 ,  G06F21/86 ,  H05K1/0275 ,  H05K1/141 ,  H05K2201/10151

    摘要： A tamper respondent module includes a basecard adapted to be inserted into a slot in a rack enclosure comprising at least one guide edge, at least one electrical coupler, a surface and at least one electronic component that contains information in an electronic format. In one example, an outer cover is coupled to the basecard and includes at least five sides. The outer cover is arranged in a covering relationship over the at least one electronic component. In another example, an anti-tamper apparatus is disposed between the outer cover and the surface. In another example, an anti-tamper circuit is electrically coupled to the at least one electronic component. In another example, a thermal frame is thermally coupled to the at least one electronic component.

    摘要翻译： 篡改答复模块包括适于插入到机架外壳中的插槽中的底座，其包括至少一个引导边缘，至少一个电连接器，表面和至少一个包含电子格式的信息的电子部件。 在一个示例中，外盖连接到底座并且包括至少五个侧面。 外盖以至少一个电子部件的覆盖关系布置。 在另一个实例中，防篡改装置设置在外盖和表面之间。 在另一示例中，防篡改电路电耦合到所述至少一个电子部件。 在另一示例中，热框架被热耦合到至少一个电子部件。

    Adjustable height liquid cooler in liquid flow through plate
    2.
    发明申请
    Adjustable height liquid cooler in liquid flow through plate 有权
    液体流量可调高度液体冷却器

    公开(公告)号：US20070070605A1

    公开(公告)日：2007-03-29

    申请号：US11527794

    申请日：2006-09-26

    申请人： Ivan Straznicky ,  Richard Power-Fardy

    发明人： Ivan Straznicky ,  Richard Power-Fardy

    IPC分类号： H05K7/20 ,  F28D15/00

    CPC分类号： H05K7/1461 ,  F28F3/12 ,  H01L23/4338 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20772 ,  H01L2924/00

    摘要： An arrangement having a cooling function is provided, comprising a circuit board, a plurality of heat generating devices attached to the circuit board, a cooling device thermally connected to one of the plurality of electronic devices, and a coolant plate. An example of the arrangement can include a source of pressurized coolant fluid connected to the coolant plate and adapted to cause the coolant fluid to be transferred between the coolant plate and the cooling device. In addition or alternatively, the arrangement can include a plurality of flexible conduits and an adjustment device adapted to selectively adjust he height of the cooling device. In addition or alternatively, a cooling apparatus within a cooling arrangement can comprise a cooling device, a coolant plate, and a coolant pathway including a first passage formed in the coolant plate and a second passage formed in the cooling device.

    摘要翻译： 提供具有冷却功能的装置，包括电路板，附接到电路板的多个发热装置，与多个电子装置中的一个热连接的冷却装置和冷却剂板。 该装置的实例可以包括连接到冷却剂板的加压冷却剂流体源，并且适于使冷却剂流体在冷却剂板和冷却装置之间传递。 另外或替代地，该装置可以包括多个柔性管道和适于选择性地调节其冷却装置的高度的调节装置。 另外或替代地，冷却装置内的冷却装置可以包括冷却装置，冷却剂板和冷却剂通道，冷却剂通道包括形成在冷却剂板中的第一通道和形成在冷却装置中的第二通道。

    TAMPER RESPONDENT MODULE
    4.
    发明申请
    TAMPER RESPONDENT MODULE 有权
    夯实响应模块

    公开(公告)号：US20100177487A1

    公开(公告)日：2010-07-15

    申请号：US12686492

    申请日：2010-01-13

    申请人： Nauman Arshad ,  Jing Kwok ,  Ivan Straznicky ,  Martin Terence Cassels

    发明人： Nauman Arshad ,  Jing Kwok ,  Ivan Straznicky ,  Martin Terence Cassels

    IPC分类号： H05K1/14

    CPC分类号： H05K5/0208 ,  G06F21/86 ,  H05K1/0275 ,  H05K1/141 ,  H05K2201/10151

    摘要： A tamper respondent module includes a basecard adapted to be inserted into a slot in a rack enclosure comprising at least one guide edge, at least one electrical coupler, a surface and at least one electronic component that contains information in an electronic format. In one example, an outer cover is coupled to the basecard and includes at least five sides. The outer cover is arranged in a covering relationship over the at least one electronic component. In another example, an anti-tamper apparatus is disposed between the outer cover and the surface. In another example, an anti-tamper circuit is electrically coupled to the at least one electronic component. In another example, a thermal frame is thermally coupled to the at least one electronic component.

    摘要翻译： 篡改答复模块包括适于插入到机架外壳中的插槽中的底座，其包括至少一个引导边缘，至少一个电连接器，表面和至少一个包含电子格式的信息的电子部件。 在一个示例中，外盖连接到底座并且包括至少五个侧面。 外盖以至少一个电子部件的覆盖关系布置。 在另一个实例中，防篡改装置设置在外盖和表面之间。 在另一示例中，防篡改电路电耦合到所述至少一个电子部件。 在另一示例中，热框架被热耦合到至少一个电子部件。

    Adjustable height liquid cooler in liquid flow through plate
    6.
    发明授权
    Adjustable height liquid cooler in liquid flow through plate 有权
    液体流量可调高度液体冷却器

    公开(公告)号：US07515418B2

    公开(公告)日：2009-04-07

    申请号：US11527794

    申请日：2006-09-26

    申请人： Ivan Straznicky ,  Richard Jude Power-Fardy

    发明人： Ivan Straznicky ,  Richard Jude Power-Fardy

    IPC分类号： H05K7/20 ,  F28D15/00

    CPC分类号： H05K7/1461 ,  F28F3/12 ,  H01L23/4338 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20772 ,  H01L2924/00

    摘要： An arrangement having a cooling function is provided, comprising a circuit board, a plurality of heat generating devices attached to the circuit board, a cooling device thermally connected to one of the plurality of electronic devices, and a coolant plate. An example of the arrangement can include a source of pressurized coolant fluid connected to the coolant plate and adapted to cause the coolant fluid to be transferred between the coolant plate and the cooling device. In addition or alternatively, the arrangement can include a plurality of flexible conduits and an adjustment device adapted to selectively adjust he height of the cooling device. In addition or alternatively, a cooling apparatus within a cooling arrangement can comprise a cooling device, a coolant plate, and a coolant pathway including a first passage formed in the coolant plate and a second passage formed in the cooling device.

    摘要翻译： 提供具有冷却功能的装置，包括电路板，附接到电路板的多个发热装置，与多个电子装置中的一个热连接的冷却装置和冷却剂板。 该装置的实例可以包括连接到冷却剂板的加压冷却剂流体源，并且适于使冷却剂流体在冷却剂板和冷却装置之间传递。 另外或替代地，该装置可以包括多个柔性管道和适于选择性地调节其冷却装置的高度的调节装置。 另外或替代地，冷却装置内的冷却装置可以包括冷却装置，冷却剂板和冷却剂通道，冷却剂通道包括形成在冷却剂板中的第一通道和形成在冷却装置中的第二通道。

    Supplemental heat conduction path for card to chassis heat dissipation
    7.
    发明授权
    Supplemental heat conduction path for card to chassis heat dissipation 失效
    补充热传导路径用于卡到机箱散热

    公开(公告)号：US06873528B2

    公开(公告)日：2005-03-29

    申请号：US10208272

    申请日：2002-07-29

    申请人： Jamie Hulan ,  David Perry ,  Ivan Straznicky

    发明人： Jamie Hulan ,  David Perry ,  Ivan Straznicky

    IPC分类号： H05K7/14 ,  H05K7/20

    CPC分类号： H05K7/1404 ,  H05K7/20545

    摘要： A heat dissipation element which can be shaped as a flat plate for transfer of heat to the opposite side of a mounting channel in a chassis for holding circuit cards. Circuit cards are typically held in place in channels in a chassis by an expansion type retention device. The circuit cards also include a heat frame for collecting the heat produced by the card components and channeling the heat from the card through the heat frame to the chassis. The retention device presses the heat frame in to thermal contact with one side of the channel. The heat dissipation plate is held in thermal contact with the other side of the channel, providing a second additional heat path to channel heat away from individual components, the circuit card and/or the heat frame.

    摘要翻译： 散热元件，其可以形成为平板，用于将热传递到用于保持电路卡的底盘中的安装通道的相对侧。 电路卡通常由扩展型保持装置保持在底盘的通道中。 电路卡还包括用于收集由卡组件产生的热量并将热量从卡通过加热框架引导到底架的加热框架。 保持装置将加热框架按压以与通道的一侧热接触。 散热板与通道的另一侧保持热接触，提供第二附加热路以将热量从各个部件，电路卡和/或加热框架导出。

    Embedded heat pipe for a conduction cooled circuit card assembly
    8.
    发明授权
    Embedded heat pipe for a conduction cooled circuit card assembly 有权
    用于传导冷却电路卡组件的嵌入式热管

    公开(公告)号：US06839235B2

    公开(公告)日：2005-01-04

    申请号：US10325631

    申请日：2002-12-19

    申请人： Chad St. Louis ,  David Perry ,  Ivan Straznicky

    发明人： Chad St. Louis ,  David Perry ,  Ivan Straznicky

    IPC分类号： H01L23/427 ,  H05K7/20

    CPC分类号： H05K7/20672 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： One or more heat pipes are connected between a component on a circuit card and the frame of a circuit card assembly for transfer of heat to the frame of the circuit card assembly. Circuit cards are typically held in place in channels in a chassis by an expansion type retention device. The circuit cards also include a heat frame for collecting the heat produced by the card components and channeling the heat from the card through the heat frame to the chassis. The retention device presses the heat frame in to thermal contact with one side of the channel. Heat collector can be attached to the heat generating components of a circuit card between the heat pipe and the component to provide improved thermal transfer. A number of heat collectors with pairs of heat pipes extending in opposite directions from the collector to the frame can be used to allow the heat pipes to effectively dissipate heat form the circuit card assembly regardless of the orientation of the circuit card assembly.

    摘要翻译： 一个或多个热管连接在电路卡上的组件和电路卡组件的框架之间，用于将热传递到电路卡组件的框架。 电路卡通常由扩展型保持装置保持在底盘的通道中。 电路卡还包括用于收集由卡组件产生的热量并将热量从卡通过加热框架引导到底架的加热框架。 保持装置将加热框架按压以与通道的一侧热接触。 热收集器可以连接到热管和部件之间的电路卡的发热部件，以提供改进的热传递。 可以使用多个具有从收集器到框架的相反方向延伸的热管对的热收集器，以允许热管有效地从电路卡组件散热，而与电路卡组件的取向无关。