Wafer aligning apparatus and related method
    1.
    发明授权
    Wafer aligning apparatus and related method 失效
    晶圆对准装置及相关方法

    公开(公告)号:US08600150B2

    公开(公告)日:2013-12-03

    申请号:US12900645

    申请日:2010-10-08

    Abstract: A wafer aligning apparatus includes a laser sensor that generates a trigger signal, a CCD camera imaging a wafer in response to the trigger signal, a signal processing unit that calculates a center alignment correction value for the wafer, and a robot controller that receives the center alignment correction value to control movement of a transfer robot. The laser sensor generates the trigger signal in accordance with a change in reflected light detected by the laser sensor, the change in the amount of reflected light being detected by the laser sensor when a boundary between a blade of the transfer robot and a coupler of the transfer robot passes under the laser sensor.

    Abstract translation: 晶片对准装置包括产生触发信号的激光传感器,响应于触发信号成像晶片的CCD照相机,计算晶片的中心对准校正值的信号处理单元,以及接收中心的机器人控制器 对准校正值来控制传送机器人的移动。 激光传感器根据激光传感器检测到的反射光的变化产生触发信号,当传送机器人的叶片与传感器的耦合器之间的边界处时,激光传感器检测到的反射光量的变化 传送机器人通过激光传感器。

    WAFER ALIGNING APPARATUS AND RELATED METHOD
    2.
    发明申请
    WAFER ALIGNING APPARATUS AND RELATED METHOD 失效
    WAFER ALIGNING设备及相关方法

    公开(公告)号:US20110050882A1

    公开(公告)日:2011-03-03

    申请号:US12900645

    申请日:2010-10-08

    Abstract: A wafer aligning apparatus includes a laser sensor that generates a trigger signal, a CCD camera imaging a wafer in response to the trigger signal, a signal processing unit that calculates a center alignment correction value for the wafer, and a robot controller that receives the center alignment correction value to control movement of a transfer robot. The laser sensor generates the trigger signal in accordance with a change in reflected light detected by the laser sensor, the change in the amount of reflected light being detected by the laser sensor when a boundary between a blade of the transfer robot and a coupler of the transfer robot passes under the laser sensor.

    Abstract translation: 晶片对准装置包括产生触发信号的激光传感器,响应于触发信号成像晶片的CCD照相机,计算晶片的中心对准校正值的信号处理单元,以及接收中心的机器人控制器 对准校正值来控制传送机器人的移动。 激光传感器根据激光传感器检测到的反射光的变化产生触发信号,当传送机器人的叶片与传感器的耦合器之间的边界处时,激光传感器检测到的反射光量的变化 传送机器人通过激光传感器。

    Wafer aligning apparatus and related method
    3.
    发明申请
    Wafer aligning apparatus and related method 有权
    晶圆对准装置及相关方法

    公开(公告)号:US20070189596A1

    公开(公告)日:2007-08-16

    申请号:US11641870

    申请日:2006-12-20

    Abstract: Embodiments of the invention provide a wafer aligning apparatus and a wafer aligning method. In one embodiment, the wafer aligning apparatus comprises an imaging unit adapted to take an image of a wafer being transferred from a load lock chamber to a transfer chamber and adapted to convert the image into digital signals, and a signal processing unit adapted to calculate a center alignment correction value for the wafer by comparing the digital signals to a master image stored in the signal processing unit. The wafer aligning apparatus further comprises a robot controller adapted to receive the center alignment correction value from the signal processing unit and adapted to control a transfer robot in accordance with the center alignment correction value to provide the wafer to a process chamber such that the center of the wafer is substantially aligned.

    Abstract translation: 本发明的实施例提供一种晶片对准装置和一种晶圆对准方法。 在一个实施例中,晶片对准装置包括成像单元,其适于将从负载锁定室传送的晶片的图像转移到传送室,并适于将图像转换成数字信号,以及信号处理单元, 通过将数字信号与存储在信号处理单元中的主图像进行比较来获得晶片的中心对准校正值。 晶片对准装置还包括机器人控制器,其适于从信号处理单元接收中心对准校正值,并且适于根据中心对准校正值来控制传送机器人,以将晶片提供给处理室,使得处理室的中心 晶片基本对齐。

    X-Y table having belt drives for moving a stage of the table in fine
increments and microscope comprising the same
    4.
    发明授权
    X-Y table having belt drives for moving a stage of the table in fine increments and microscope comprising the same 有权
    X-Y工作台具有用于以微小增量移动工作台的带驱动装置和包括其的显微镜

    公开(公告)号:US6018415A

    公开(公告)日:2000-01-25

    申请号:US144543

    申请日:1998-08-31

    Abstract: An X-Y table of a microscope includes an a X-axis moving plate, an object holder mounted on an upper surface of the X-axis moving plate, a Y-axis moving plate to which the X-axis moving plate is slidingly coupled for movement in the X direction, a fixed plate to which the Y-axis moving plate is slidingly coupled for movement in the Y direction, an X-axis driving system which uses a belt for moving the X-axis moving plate in the X direction, and Y-axis driving system which also uses a belt for moving the Y-axis moving plate in the Y direction. The X-axis moving plate and the Y-axis moving plate serve as the stage of the microscope. In operation, when it is desired to move the X- and Y-moving plates rapidly to generally position the object under the microscope, the belts of the X- and Y-driving systems are disengaged from drive elements associated therewith. Without the belts being engaged, the X and Y plates can thus travel quickly and smoothly and, without abrasion occurring between the belts and their associated drive elements. On the other hand, when the X- and Y-moving plates are to be moved in fine uniform increments to precisely position the object held by the object holder, the belts are engaged and are used to move the plates slowly to precisely position the object under the microscope.

    Abstract translation: 显微镜的XY工作台包括X轴移动板,安装在X轴移动板的上表面上的物体保持架,X轴移动板滑动联接以移动的Y轴移动板 在X方向上,Y轴移动板在Y方向上滑动联接的固定板,X轴驱动系统,其使用用于沿X方向移动X轴移动板的带,以及 Y轴驱动系统,其还使用用于沿Y方向移动Y轴移动板的带。 X轴移动板和Y轴移动板用作显微镜的阶段。 在操作中,当希望快速移动X和Y移动板以将物体大致定位在显微镜下时,X和Y驱动系统的带与与其相关联的驱动元件脱离。 在没有皮带接合的情况下,X和Y板因此能够快速平稳地行进,并且不会在皮带和它们相关联的驱动元件之间发生磨损。 另一方面,当要以精细均匀的增量移动X和Y移动板以精确地定位由物体保持器保持的物体时,带被接合并用于缓慢地移动板以精确地定位物体 在显微镜下。

    Illumination system for use with an optical instrument having an
auxiliary magnifying lens
    5.
    发明授权
    Illumination system for use with an optical instrument having an auxiliary magnifying lens 有权
    用于具有辅助放大镜的光学仪器的照明系统

    公开(公告)号:US6023368A

    公开(公告)日:2000-02-08

    申请号:US135651

    申请日:1998-08-18

    CPC classification number: G02B21/06

    Abstract: An optical microscope has an illuminator from which light emanates to illuminate an object under examination, and an auxiliary magnifying lens unit which magnifies an image of the object formed by the light reflecting from the object. A reflective cover is connected to the bottom of the ocular lens unit of the microscope. An auxiliary magnifying unit, made up of the auxiliary magnifying lens mounted in a casing, is disposed within the reflective cover adjacent the bottom of the ocular lens unit. The illuminator is located between the reflective cover and the casing of the auxiliary magnifying unit. The auxiliary magnifying lens is thus shielded from the illuminator. The light emitted from the illuminator is prevented from propagating directly to the auxiliary magnifying lens (along any straight line from the illuminator) or indirectly to the auxiliary magnifying lens via reflection from the inner wall of the reflective cover. Accordingly, a clear image of the object is produced. Furthermore, the reflective cover screws the auxiliary magnifying unit onto the bottom of the ocular lens unit. These components can be easily and quickly assembled and disassembled as the need arises.

    Abstract translation: 光学显微镜具有发光的光照射器,用于照射被检查物体;以及辅助放大透镜单元,其放大由从物体反射的光形成的物体的图像。 反射罩连接到显微镜的镜片单元的底部。 辅助放大单元由安装在壳体中的辅助放大镜组成,设置在与眼镜片单元的底部相邻的反射盖内。 照明器位于反光罩和辅助放大单元的外壳之间。 辅助放大镜因此被遮蔽。 防止从照明器发出的光直接传播到辅助放大透镜(沿着照明器的任何直线)或者通过反射罩的内壁的反射间接传播到辅助放大镜。 因此,产生物体的清晰图像。 此外,反光罩将辅助放大单元螺丝固定在眼镜单元的底部上。 根据需要,可以容易且快速地组装和拆卸这些部件。

    Wafer aligning apparatus and related method
    6.
    发明授权
    Wafer aligning apparatus and related method 有权
    晶圆对准装置及相关方法

    公开(公告)号:US07813542B2

    公开(公告)日:2010-10-12

    申请号:US11641870

    申请日:2006-12-20

    Abstract: Embodiments of the invention provide a wafer aligning apparatus and a wafer aligning method. In one embodiment, the wafer aligning apparatus comprises an imaging unit adapted to take an image of a wafer being transferred from a load lock chamber to a transfer chamber and adapted to convert the image into digital signals, and a signal processing unit adapted to calculate a center alignment correction value for the wafer by comparing the digital signals to a master image stored in the signal processing unit. The wafer aligning apparatus further comprises a robot controller adapted to receive the center alignment correction value from the signal processing unit and adapted to control a transfer robot in accordance with the center alignment correction value to provide the wafer to a process chamber such that the center of the wafer is substantially aligned.

    Abstract translation: 本发明的实施例提供一种晶片对准装置和一种晶圆对准方法。 在一个实施例中,晶片对准装置包括成像单元,其适于将从负载锁定室传送的晶片的图像转移到传送室,并适于将图像转换成数字信号,以及信号处理单元, 通过将数字信号与存储在信号处理单元中的主图像进行比较来获得晶片的中心对准校正值。 晶片对准装置还包括机器人控制器,其适于从信号处理单元接收中心对准校正值,并且适于根据中心对准校正值来控制传送机器人,以将晶片提供给处理室,使得处理室的中心 晶片基本对齐。

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